COATED SUBSTRATE FOR PACKAGING APPLICATIONS AND A METHOD FOR PRODUCING SAID COATED SUBSTRATE
    5.
    发明申请
    COATED SUBSTRATE FOR PACKAGING APPLICATIONS AND A METHOD FOR PRODUCING SAID COATED SUBSTRATE 有权
    用于包装应用的涂覆基材和用于生产涂覆的基材的方法

    公开(公告)号:US20150064494A1

    公开(公告)日:2015-03-05

    申请号:US14388201

    申请日:2013-03-20

    IPC分类号: C25D5/50 C21D1/26 C21D1/18

    摘要: This relates to a coated substrate for packaging applications including a recrystallisation annealed single reduced steel substrate or a double reduced steel substrate subjected to recrystallisation annealing between the first and second cold rolling treatment, wherein one or both sides of the substrate is coated with an iron-tin alloy layer which contains at least 80 weight percent (wt. %) of FeSn (50 at. % iron and 50 at. % tin) and wherein the iron-tin alloy layer or layers are provided with a chromium metal-chromium oxide coating layer produced by a trivalent chromium electroplating process, and wherein the thickness of the chromium metal-chromium oxide coating layer corresponds to at least 20 mg Cr/m2 and a process for producing the coated substrate.

    摘要翻译: 这涉及用于包装应用的涂覆基材,包括在第一和第二冷轧处理之间进行再结晶退火的再结晶退火的单一还原钢基材或双重还原钢基材,其中基材的一面或两面涂覆有铁 - 锡合金层,其含有至少80重量%(重量%)的FeSn(50原子%铁和50原子%锡),并且其中所述铁 - 锡合金层或层设置有铬金属 - 铬氧化物涂层 通过三价铬电镀工艺制备的层,并且其中铬金属 - 铬氧化物涂层的厚度对应于至少20mg Cr / m 2,以及制备涂覆的基材的方法。