公开(公告)号：US11152729B2

公开(公告)日：2021-10-19

申请号：US16144566

申请日：2018-09-27

Applicant: TE CONNECTIVITY CORPORATION

Inventor： Rodney Ivan Martens ,  John Joseph Consoli ,  Arturo Pachon Munoz ,  Chad William Morgan ,  Douglas Edward Shirk

IPC: H01R13/03 ,  H01R13/6587 ,  H01R13/514 ,  H01R13/658 ,  H01R13/6598

Abstract: Electrical connector includes a housing and a mating array having a plurality of signal contacts and a plurality of ground contacts that are coupled to the housing. The signal contacts and the ground contacts are positioned for mating with signal conductors and ground conductors, respectively, of a mating connector. The ground contacts are plated with a ground-material composition and the signal contacts are plated with a signal-material composition. The ground-material composition is configured to cause a first low-level contact resistance (LLCR) while mated with the ground conductors during operation. The signal-material composition is configured to cause a second LLCR while mated with the signal conductors during operation. The second LLCR is less than the first LLCR during operation.

公开(公告)号：US11183787B2

公开(公告)日：2021-11-23

申请号：US16145913

申请日：2018-09-28

Applicant: TE CONNECTIVITY CORPORATION

Inventor： John Joseph Consoli ,  Rodney Ivan Martens ,  Chad William Morgan ,  Suvrat Bhargava

IPC: H01R13/03 ,  H01R13/514 ,  H01B1/02 ,  H01R13/6471 ,  H01R13/6587 ,  H01R43/20 ,  H05K9/00 ,  H05K3/24

Abstract: Electrical connector includes a housing, signal contacts, and ground shields. The signal contacts are coupled to the housing and positioned for mating with mating signal contacts of a mating connector. The ground shields are coupled to the housing and at least partially surround the signal contacts to shield the signal contacts. The ground shields are plated with a ground-material composition along one or more contact segments of the ground shields that come into compression engagement with one or more other conductive members. The ground-material composition includes a tin-nickel (Sn/Ni) alloy plating layer. The signal contacts are plated with a signal-material composition that is different than the ground-material composition.

公开(公告)号：US20190036256A1

公开(公告)日：2019-01-31

申请号：US16144566

申请日：2018-09-27

Applicant: TE CONNECTIVITY CORPORATION

Inventor： Rodney Ivan Martens ,  John Joseph Consoli ,  Arturo Pachon Munoz ,  Chad William Morgan ,  Douglas Edward Shirk

IPC: H01R13/03 ,  H01R13/6587 ,  H01R13/658 ,  H01R13/514

Abstract: Electrical connector includes a housing and a mating array having a plurality of signal contacts and a plurality of ground contacts that are coupled to the housing. The signal contacts and the ground contacts are positioned for mating with signal conductors and ground conductors, respectively, of a mating connector. The ground contacts are plated with a ground-material composition and the signal contacts are plated with a signal-material composition. The ground-material composition is configured to cause a first low-level contact resistance (LLCR) while mated with the ground conductors during operation. The signal-material composition is configured to cause a second LLCR while mated with the signal conductors during operation. The second LLCR is less than the first LLCR during operation.

公开(公告)号：US20170145170A1

公开(公告)日：2017-05-25

申请号：US15425664

申请日：2017-02-06

Applicant: TE Connectivity Corporation

Inventor： Jaydip Das ,  Ting Gao ,  Mark F. Wartenberg ,  Kavitha Bharadwaj ,  Richard B. Lloyd ,  Rodney Ivan Martens

IPC: C08J3/20 ,  H01B13/00 ,  H05K9/00 ,  H01R13/50 ,  B29B7/90 ,  H01Q1/36 ,  B29B7/82 ,  B29C47/00 ,  B29C67/24 ,  C08K3/08 ,  C08K9/04 ,  C08K3/36 ,  H01B1/22 ,  B29B7/48

CPC classification number: C08J3/201 ,  B29B7/48 ,  B29B7/82 ,  B29B7/90 ,  B29C48/022 ,  B29C67/24 ,  B29K2027/16 ,  B29K2105/16 ,  B29K2505/06 ,  B29K2505/10 ,  B29L2031/34 ,  C08J2327/16 ,  C08K3/08 ,  C08K3/36 ,  C08K7/00 ,  C08K7/18 ,  C08K9/04 ,  C08K2003/085 ,  C08K2201/001 ,  C08K2201/005 ,  C08K2201/014 ,  H01B1/22 ,  H01B13/0036 ,  H01Q1/364 ,  H01R13/50 ,  H05K9/0083 ,  C08L27/16

Abstract: A composite formulation and composite product are disclosed. The composite formulation includes a polymer matrix having metal particles, the metal particles including dendritic particles and tin-containing particles. The metal particles are blended within the polymer matrix at a temperature greater than the melt temperature of the polymer matrix. The tin containing particles are at a concentration in the composite formulation of, by volume, between 10% and 36%, and the dendritic particles are at a concentration in the composite formulation of, by volume, between 16% and 40%. The temperature at which the metal particles are blended generates metal-metal diffusion of the metal particles, producing intermetallic phases, the temperature being at least the intermetallic annealing temperature of the metal particles.