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公开(公告)号：US20230420164A1
公开(公告)日：2023-12-28
申请号：US18340391
申请日：2023-06-23
发明人： Shallu Soneja , Yiliang Wu , Gokce Gulsoy , Helge Schmidt , Soenke Sachs
CPC分类号： H01B13/322 , H01B13/0016 , H01B13/003 , H01B1/02 , H01B5/02
摘要： A method for producing a surface finish on an electrically conductive substrate includes transferring an ink having a plurality of electrically conductive particles onto an area of a predetermined form and/or size on a surface of the electrically conductive substrate by gravure and/or flexo printing. The ink is heated to a temperature that is higher than a melting point of the electrically conductive particles to create a melt. The melt solidifies into the surface finish on the electrically conductive substrate.
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公开(公告)号：US10933675B2
公开(公告)日：2021-03-02
申请号：US16185841
申请日：2018-11-09
申请人： TE Connectivity Corporation , TE Connectivity Germany GmbH , Tyco Electronics (Shanghai) Co. Ltd.
发明人： Shallu Soneja , Gokce Gulsoy , Yiliang Wu , Xiao Zhou , Helge Schmidt , Soenke Sachs , Felix Greiner
IPC分类号： B23K26/00 , B41M3/00 , B23K1/00 , B23K1/005 , B23K26/354 , B23K3/06 , B23K1/20 , B23K1/19 , B23K103/10 , B23K101/42 , B23K103/08
摘要： A method of producing a solderable aluminum contact comprises formulating an ink, applying the ink to an aluminum substrate to form an ink layer on a surface of the aluminum substrate, and melting the ink layer. The ink includes a solderable element that is conductive. The melting of the ink layer forms an alloy on the surface of the aluminum substrate including the solderable element.
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公开(公告)号：US20170326841A1
公开(公告)日：2017-11-16
申请号：US15663608
申请日：2017-07-28
发明人： Lavanya Bharadwaj , Barry C. Mathews , Dominique Freckmann , Shallu Soneja , Michael A. Oar , Gokce Gulsoy , Helge Schmidt , Michael Leidner , Soenke Sachs
CPC分类号： B32B15/04 , B32B37/06 , B32B37/08 , B32B2307/554 , B32B2457/00 , H01L21/324 , H05K1/0207 , H05K3/125 , H05K2203/092 , H05K2203/1131
摘要： Electronic components and processes of producing electronic components are disclosed. The electronic component includes a substrate and a thermal grain modified layer positioned on the substrate. The thermal grain modified layer includes a modified grain structure. The modified grain structure includes a thermal grain modification additive. A method for forming the electronic component is also disclosed.
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公开(公告)号：US20190143726A1
公开(公告)日：2019-05-16
申请号：US16185841
申请日：2018-11-09
申请人： TE Connectivity Corporation , TE Connectivity Germany GmbH , Tyco Electronics (Shanghai) Co. Ltd.
发明人： Shallu Soneja , Gokce Gulsoy , Yiliang Wu , Xiao Zhou , Helge Schmidt , Soenke Sachs , Felix Greiner
摘要： A method of producing a solderable aluminum contact comprises formulating an ink, applying the ink to an aluminum substrate to form an ink layer on a surface of the aluminum substrate, and melting the ink layer. The ink includes a solderable element that is conductive. The melting of the ink layer forms an alloy on the surface of the aluminum substrate including the solderable element.
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公开(公告)号：US20170100916A1
公开(公告)日：2017-04-13
申请号：US14881041
申请日：2015-10-12
发明人： Lavanya Bharadwaj , Barry C. Mathews , Dominique Freckmann , Shallu Soneja , Michael A. Oar , Gokce Gulsoy , Helge Schmidt , Michael Leidner , Soenke Sachs
CPC分类号： B32B15/04 , B32B37/06 , B32B37/08 , B32B2307/554 , B32B2457/00 , H01L21/324 , H05K1/0207 , H05K3/125 , H05K2203/092 , H05K2203/1131
摘要： Electronic components and processes of producing electronic components are disclosed. The electronic component includes a substrate and a thermal grain modified layer positioned on the substrate. The thermal grain modified layer includes a modified grain structure. The modified grain structure includes a thermal grain modification additive. A method for forming the electronic component is also disclosed.
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