PLASMA TREATMENT FOR MULTILAYER ADHESIVE BONDING ELEMENT

    公开(公告)号:US20180112107A1

    公开(公告)日:2018-04-26

    申请号:US15783527

    申请日:2017-10-13

    Applicant: TESA SE

    Abstract: Method for bonding by wrapping a medium which is capable of expanding transversely to a winding with an adhesive tape, in which: an adhesive tape is unrolled from an adhesive tape roll, the unrolled adhesive tape is provided on one side of a carrier film (1) with an adhesive cement layer (2) and on an opposite side with a separating agent layer (3), the separating agent layer (3) is subjected to a plasma treatment, the plasma-treated adhesive tape is wound around the medium which is capable of expanding transversely to a winding, so that at least a portion of the adhesive tape is bonded to a lower winding ply by the adhesive cement layer (2).

Patent Agency Ranking