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公开(公告)号：US11188032B2
公开(公告)日：2021-11-30
申请号：US16589176
申请日：2019-10-01
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Bichoy Bahr , Argyrios Dellis , Adam Fruehling , Juan Alejandro Herbsommer
IPC: G04F5/00
Abstract: A clock generator includes a hermetically sealed cavity and clock generation circuitry. A dipolar molecule in the hermetically sealed cavity has a quantum rotational state transition at a fixed frequency. The clock generation circuitry generates an output clock signal based on the fixed frequency of the dipolar molecule. The clock generation circuitry includes a detection circuit, a reference oscillator, and control circuitry. The detection circuit generates a first detection signal and a second detection signal representative of amplitude of signal at an output of the hermetically sealed cavity responsive to a first sweep signal and a second sweep signal input to the hermetically sealed cavity. The control circuitry sets a frequency of the reference oscillator based on a difference in time of identification of the fixed frequency of the dipolar molecule in the first detection signal and the second detection signal.
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公开(公告)号：US09966194B2
公开(公告)日：2018-05-08
申请号：US15385431
申请日：2016-12-20
Applicant: Texas Instruments Incorporated
Inventor： Arun Gupta , William C. McDonald , Adam Fruehling , Ivan Kmecko , Lance Barron , Divyanshu Agrawal , Arthur M. Turner , John C. Ehmke
CPC classification number: H01G5/16 , B81B3/0008 , B81B3/001 , B81B3/0013 , B81B7/0064 , B81B7/008 , B81B7/02 , B81B2201/016 , B81B2201/0221 , B81B2203/0109 , B81B2203/0118 , B81B2203/0127 , B81B2203/0181 , B81B2203/053 , B81B2203/058 , B81B2203/06 , B81B2207/012 , B81B2207/096 , B81C1/00158 , H01G5/011 , H01G5/40
Abstract: A MEMs actuator device and method of forming includes arrays of actuator elements. Each actuator element has a moveable top plate and a bottom plate. The top plate includes a central membrane member and a cantilever spring for movement of the central membrane member. The bottom plate consists of two RF signal lines extending under the central membrane member. A MEMs electrostatic actuator device includes a CMOS wafer, a MEMs wafer, and a ball bond assembly. Interconnections are made from a ball bond to an associated through-silicon-via (TSV) that extends through the MEMS wafer. A RF signal path includes a ball bond electrically connected through a TSV and to a horizontal feed bar and from the first horizontal feed bar vertically into each column of the array. A metal bond ring extends between the CMOS wafer and the MEMS wafer. An RF grounding loop is completed from a ground shield overlying the array to the metal bond ring, a TSV and to a ball bond.
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公开(公告)号：US20240274387A1
公开(公告)日：2024-08-15
申请号：US18169013
申请日：2023-02-14
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Adam Fruehling , Scott Summerfelt
IPC: H01H59/00
CPC classification number: H01H59/00
Abstract: An apparatus includes a semiconductor structure having a cavity, a first terminal on a first cavity side, and a second terminal on a second cavity side. The second terminal includes an extension that overlaps part of the cavity. The extension includes a first contact. The apparatus includes a bendable beam extending from the first cavity side and includes a metal layer coupled to the first terminal. The beam has opposite first and second beam sides. The first beam side couples to the first terminal, and the second beam side faces the second cavity side. The beam includes a second contact that overlaps at least a portion of the extension and faces the first contact. An actuator is configured to bend the bendable beam around a first axis, and bend the bendable beam around a second axis orthogonal to the first axis by moving the second beam side against the extension.
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公开(公告)号：US20240071694A1
公开(公告)日：2024-02-29
申请号：US17900195
申请日：2022-08-31
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Gokhan Ariturk , Adam Fruehling
CPC classification number: H01H1/0036 , H01H59/0009 , H01P1/12 , H01H2001/0084
Abstract: A microelectromechanical system (MEMS) switch implemented with a coplanar waveguide. The MEMS switch includes an input terminal, an output terminal. The MEMS switch includes a beam extending between the input terminal and the output terminal. The beam includes a first edge and a second edge coupled to a gate of the MEMS switch. The beam includes a third edge proximate the input terminal. The first edge includes a first set of finger contacts proximate a first corner of the beam and a second set of finger contacts proximate a second corner of the beam. The beam includes a fourth edge proximate the output terminal, the fourth edge opposing the third edge. The MEMS switch has a first anchor coupled to the input terminal. The first anchor includes a first segment extending from a region proximate the input terminal to a region overlying the first set of finger contacts.
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公开(公告)号：US20250015783A1
公开(公告)日：2025-01-09
申请号：US18349020
申请日：2023-07-07
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Gokhan Ariturk , Adam Fruehling , Yao Yu , Ting-Ta Yen
Abstract: A filter includes an electromagnetic (EM) resonator having a first EM resonator terminal and a second EM resonator terminal. The second EM filter terminal is coupled to a ground terminal. The filter includes a first bulk acoustic wave (BAW) resonator coupled between the first EM resonator terminal and the ground terminal and includes a second BAW resonator coupled between the first EM resonator terminal and the ground terminal. A third BAW resonator is coupled between a first filter terminal and a first BAW resonator terminal of the first BAW resonator. A fourth BAW resonator is coupled between a second filter terminal and a second BAW resonator terminal of the second BAW resonator.
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Patent Agency Ranking
公开(公告)号：US09573801B2
公开(公告)日：2017-02-21
申请号：US15044016
申请日：2016-02-15
Applicant: Texas Instruments Incorporated
Inventor： Arun Gupta , William C. McDonald , Adam Fruehling , Ivan Kmecko , Lance Barron , Divyanshu Agrawal
CPC classification number: H01G5/16 , B81B3/0008 , B81B3/001 , B81B3/0013 , B81B7/0064 , B81B7/008 , B81B7/02 , B81B2201/016 , B81B2201/0221 , B81B2203/0109 , B81B2203/0118 , B81B2203/0127 , B81B2203/0181 , B81B2203/053 , B81B2203/058 , B81B2203/06 , B81B2207/012 , B81B2207/096 , B81C1/00158 , H01G5/011 , H01G5/40
Abstract: A MEMs actuator device and method of forming includes arrays of actuator elements. Each actuator element has a moveable top plate and a bottom plate. The top plate includes a central membrane member and a cantilever spring for movement of the central membrane member. The bottom plate consists of two RF signal lines extending under the central membrane member. A MEMs electrostatic actuator device includes a CMOS wafer, a MEMs wafer, and a ball bond assembly. Interconnections are made from a ball bond to an associated through-silicon-via (TSV) that extends through the MEMS wafer. A RF signal path includes a ball bond electrically connected through a TSV and to a horizontal feed bar and from the first horizontal feed bar vertically into each column of the array. A metal bond ring extends between the CMOS wafer and the MEMS wafer. An RF grounding loop is completed from a ground shield overlying the array to the metal bond ring, a TSV and to a ball bond.
Abstract translation: 一种MEM致动器装置和形成方法包括致动器元件的阵列。 每个致动器元件具有可移动的顶板和底板。 顶板包括用于中心膜构件运动的中心膜构件和悬臂弹簧。 底板由在中央膜构件下方延伸的两个RF信号线组成。 MEM静电致动器装置包括CMOS晶片，MEM晶片和球接合组件。 互连由球接合到通过MEMS晶片延伸的相关的通硅通孔（TSV）。 RF信号路径包括通过TSV电连接到水平进给杆并且从第一水平进给杆垂直地连接到阵列的每一列中的球形接合。 金属结合环在CMOS晶片和MEMS晶片之间延伸。 射频接地回路从覆盖阵列的接地屏蔽到金属接合环，TSV和球接合完成。
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公开(公告)号：US20240274388A1
公开(公告)日：2024-08-15
申请号：US18168959
申请日：2023-02-14
Applicant: Texas Instruments Incorporated
Inventor： Adam Fruehling , Scott Summerfelt
IPC: H01H59/00
CPC classification number: H01H59/0009 , H01H2203/02 , H01H2205/004
Abstract: An apparatus includes a semiconductor structure having a cavity. The apparatus also includes a first electrical terminal on a first cavity side, a second electrical terminal on a second cavity side, and the second electrical terminal including an extension that overlaps part of the cavity. The apparatus also includes a bendable beam extending from the first cavity side and overlapping at least part of the extension. The apparatus also includes an actuator in a periphery of the beam, the actuator configured to generate a fringing electric field that causes the second beam side to move towards the extension in a direction different from the fringing electric field and bend the beam.
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公开(公告)号：US20230095040A1
公开(公告)日：2023-03-30
申请号：US17490938
申请日：2021-09-30
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Argyrios Dellis , Adam Fruehling , Simon Joshua Jacobs
Abstract: A stackable molecular spectroscopy cell includes a hollow body, a first cap affixed to a first surface of the hollow body, covering a first opening in the hollow body, and a second cap affixed to a second surface of the hollow body, covering a second opening in the hollow body, and forming a sealed cavity within the hollow body. The sealed cavity contains a dipolar gas having a pressure of less than 0.5 mbar. The stackable molecular spectroscopy cell also includes a metal layer covering an inner surface of the hollow body and an inner surface of the first and second caps, including a first aperture in the metal layer covering the inner surface of the first cap and a second aperture in the metal layer covering the inner surface of the second cap.
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公开(公告)号：US20170098509A1
公开(公告)日：2017-04-06
申请号：US15385431
申请日：2016-12-20
Applicant: Texas Instruments Incorporated
Inventor： Arun Gupta , William C. McDonald , Adam Fruehling , Ivan Kmecko , Lance Barron , Divyanshu Agrawal , Arthur M. Turner , John C. Ehmke
CPC classification number: H01G5/16 , B81B3/0008 , B81B3/001 , B81B3/0013 , B81B7/0064 , B81B7/008 , B81B7/02 , B81B2201/016 , B81B2201/0221 , B81B2203/0109 , B81B2203/0118 , B81B2203/0127 , B81B2203/0181 , B81B2203/053 , B81B2203/058 , B81B2203/06 , B81B2207/012 , B81B2207/096 , B81C1/00158 , H01G5/011 , H01G5/40
Abstract: A MEMs actuator device and method of forming includes arrays of actuator elements. Each actuator element has a moveable top plate and a bottom plate. The top plate includes a central membrane member and a cantilever spring for movement of the central membrane member. The bottom plate consists of two RF signal lines extending under the central membrane member. A MEMs electrostatic actuator device includes a CMOS wafer, a MEMs wafer, and a ball bond assembly. Interconnections are made from a ball bond to an associated through-silicon-via (TSV) that extends through the MEMS wafer. A RF signal path includes a ball bond electrically connected through a TSV and to a horizontal feed bar and from the first horizontal feed bar vertically into each column of the array. A metal bond ring extends between the CMOS wafer and the MEMS wafer. An RF grounding loop is completed from a ground shield overlying the array to the metal bond ring, a TSV and to a ball bond.
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公开(公告)号：US20240364335A1
公开(公告)日：2024-10-31
申请号：US18308491
申请日：2023-04-27
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Gokhan Ariturk , Adam Fruehling , Ting-Ta Yen
IPC: H03K17/693 , H03K17/10 , H03K17/687
CPC classification number: H03K17/693 , H03K17/102 , H03K17/6871
Abstract: An apparatus includes a switch assembly having first and second switch terminals and a control terminal. The switch assembly includes a leakage attenuation circuit. The switch assembly is configured to, responsive to the control terminal having a first state, connect the first switch terminal to the second switch terminal and disconnect a circuit terminal of the leakage attenuation circuit from the first switch terminal. The switch assembly is configured to, responsive to the control terminal having a second state, connect the terminal of the leakage attenuation circuit to the first switch terminal and disconnect the first switch terminal from the second switch terminal.
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