公开(公告)号：US20140312474A1

公开(公告)日：2014-10-23

申请号：US13866200

申请日：2013-04-19

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Alok Prakash Joshi ,  Gireesh Rajendran ,  Brian Parks

IPC: H01L23/00

CPC classification number: H01L24/49 ,  H01L23/3107 ,  H01L23/4952 ,  H01L24/06 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/06135 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/49052 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/20752 ,  H01L2924/00

Abstract: A semiconductor package having a die having a plurality of electrically continuous die wire bonding sites includes a first die wire bonding site and a second die wire bonding site. The package includes a substrate having a plurality of electrically continuous substrate wire bonding sites including a first substrate wire bonding site and a second substrate wire bonding site. A first bondwire is connected between the first die wire bonding site and the first substrate wire bonding site and a second bondwire is connected between the second die wire bonding site and the second substrate wire bonding site. The first and second bondwires lie in adjacent, substantially parallel bondwire planes. The second bondwire is substantially skewed with respect to said first bondwire.

Abstract translation: 具有具有多个电连续芯线接合位置的管芯的半导体封装包括第一管芯接合位置和第二管芯接合部位。 该封装包括具有包括第一衬底引线接合位置和第二衬底引线接合部位的多个电连续衬底引线接合位置的衬底。 第一接合线连接在第一芯线接合部位和第一基板引线接合位置之间，第二接合线连接在第二芯线接合部位和第二基板引线接合部位之间。 第一和第二焊丝线位于相邻的基本上平行的接合线平面中。 第二接合线相对于所述第一接合线基本上是倾斜的。