公开(公告)号：US20200303939A1

公开(公告)日：2020-09-24

申请号：US16821637

申请日：2020-03-17

Applicant: Texas Instruments Incorporated

Inventor： John Mitchell Perry ,  Indumini Ranmuthu

IPC: H02J7/02 ,  H02J7/00

Abstract: A multi-port charging system includes a controller having a power input terminal coupled to a DC power output of a converter, multiple power output terminals coupled to the power input terminal, and a communications input terminal. The system includes multiple charger ports, the respective charger ports having a charging power line coupled to a respective one of the power output terminals, and a communications line coupled to the communications input terminal. The controller is configured to control the state of the control output terminal to set a voltage of the DC power output according to a selected highest common compatible voltage of one or more sink devices coupled to one or more respective ones of the charger ports.

公开(公告)号：US20200292610A1

公开(公告)日：2020-09-17

申请号：US16297972

申请日：2019-03-11

Applicant: Texas Instruments Incorporated

Inventor： Pavan Pakala ,  Indumini Ranmuthu

IPC: G01R31/26 ,  G01R31/28 ,  G06F13/40 ,  G01R1/073

Abstract: A wafer test probe system, probe card, and method to test back-to-back connected first and second transistors of a wafer. The probe card includes a waveform generator circuit and probe needles to couple the waveform generator circuit to provide a first pulse signal of a first polarity using a body diode of the first transistor to test the second transistor, and to provide a second pulse signal of a second polarity using a body diode of the second transistor to the test the first transistor. One example includes a resistor connected between the waveform generator circuit and one of the probe needles. The probe card includes a probe needle to connect a sense transistor of the wafer to the first transistor during wafer probe testing.

公开(公告)号：US20200227551A1

公开(公告)日：2020-07-16

申请号：US16368313

申请日：2019-03-28

Applicant: Texas Instruments Incorporated

Inventor： Indumini Ranmuthu

IPC: H01L29/78 ,  H01L27/088 ,  G06F13/42 ,  G01R19/00

Abstract: Back-to-back power field-effect transistors with associated current sensors are disclosed. An example apparatus includes a first power field-effect transistor (FET) having a first source, and a second power FET having a second source. The first and second power FETs share a common drain. The first and second sources positioned on a first side of a substrate and the common drain positioned on a second side of the substrate opposite the first side. The example apparatus includes a current sensing FET positioned between a first portion of the first source of the first power FET and a second portion of the first source of the first power FET. The current sensing FET senses a current passing through the first and second power FETs.

公开(公告)号：US09870984B2

公开(公告)日：2018-01-16

申请号：US14965697

申请日：2015-12-10

Applicant: Texas Instruments Incorporated

Inventor： Indumini Ranmuthu

IPC: H01L23/495 ,  H01L27/088 ,  H01L25/065 ,  H01L23/00

CPC classification number: H01L23/49568 ,  H01L23/49524 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49575 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L25/0657 ,  H01L25/071 ,  H01L25/16 ,  H01L27/088 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/37599 ,  H01L2224/40245 ,  H01L2224/84 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Techniques are described for integrating power field-effect transistors (FETs), pre-drivers, controllers, and/or resistors into a common multi-chip package for implementing multi-phase bridge circuits. The techniques may provide a multi-chip package with at least two high-side (HS) FETs and at least two low-side (LS) FETs, and place the at least two HS FETs or the at least LS FETs on a common die. Placing at least two FETs on a common die may reduce the number of die and the number of thermal pads (i.e., die pads) needed to implement a set of power FETs, thereby decreasing component count of a multi-phase bridge circuit and/or allowing a more compact, higher current density multi-phase bridge circuit to be obtained without significantly increasing thermal power dissipation of the circuit.

公开(公告)号：US11063146B2

公开(公告)日：2021-07-13

申请号：US16368313

申请日：2019-03-28

Applicant: Texas Instruments Incorporated

Inventor： Indumini Ranmuthu

IPC: H01L29/78 ,  G01R19/00 ,  G06F13/42 ,  H01L27/088

Abstract: Back-to-back power field-effect transistors with associated current sensors are disclosed. An example apparatus includes a first power field-effect transistor (FET) having a first source, and a second power FET having a second source. The first and second power FETs share a common drain. The first and second sources positioned on a first side of a substrate and the common drain positioned on a second side of the substrate opposite the first side. The example apparatus includes a current sensing FET positioned between a first portion of the first source of the first power FET and a second portion of the first source of the first power FET. The current sensing FET senses a current passing through the first and second power FETs.

公开(公告)号：US20130121357A1

公开(公告)日：2013-05-16

申请号：US13662712

申请日：2012-10-29

Applicant: Texas Instruments Incorporated

Inventor： Douglas Dean Warren ,  Shengyuan Li ,  Indumini Ranmuthu

IPC: G11B11/12

CPC classification number: G11B7/126 ,  G11B7/00456

Abstract: An optical disk drive system associated with a laser diode is described. The optical disk drive system comprises a current generator for receiving input signals; a current switch coupled to receive timing signals; a current driver coupled to receive output signals from the current switch and the current generator, the current driver further comprising a driver with wave shape control selected from the group consisting of a laser diode read driver and a laser diode write driver, wherein the driver with shape control is operative for transmitting at least one output signal that is a scaled version of at least one of the output signals received from the current generator, wherein the current driver is operative for transmitting at least one output signal driving the laser diode.

Abstract translation: 描述了与激光二极管相关联的光盘驱动器系统。 光盘驱动系统包括用于接收输入信号的电流发生器; 耦合以接收定时信号的电流开关; 电流驱动器，其耦合以从电流开关和电流发生器接收输出信号，所述电流驱动器还包括从由激光二极管读取驱动器和激光二极管写入驱动器组成的组中选择的波形控制的驱动器，其中所述驱动器具有 形状控制用于发送至少一个输出信号，其是从电流发生器接收的至少一个输出信号的缩放版本，其中当前驱动器用于传输驱动该激光二极管的至少一个输出信号。

公开(公告)号：US20230411988A1

公开(公告)日：2023-12-21

申请号：US18460948

申请日：2023-09-05

Applicant: Texas Instruments Incorporated

Inventor： John Mitchell Perry ,  Indumini Ranmuthu

IPC: H02J7/02 ,  H02J7/00

CPC classification number: H02J7/02 ,  H02J2207/40 ,  H02J2207/20 ,  H02J7/007186

Abstract: A multi-port charging system includes a controller having a power input terminal coupled to a DC power output of a converter, multiple power output terminals coupled to the power input terminal, and a communications input terminal. The system includes multiple charger ports, the respective charger ports having a charging power line coupled to a respective one of the power output terminals, and a communications line coupled to the communications input terminal. The controller is configured to control the state of the control output terminal to set a voltage of the DC power output according to a selected highest common compatible voltage of one or more sink devices coupled to one or more respective ones of the charger ports.

公开(公告)号：US11791650B2

公开(公告)日：2023-10-17

申请号：US16821637

申请日：2020-03-17

Applicant: Texas Instruments Incorporated

Inventor： John Mitchell Perry ,  Indumini Ranmuthu

IPC: H02J7/02 ,  H02J7/00

CPC classification number: H02J7/02 ,  H02J7/007186 ,  H02J2207/20 ,  H02J2207/40

Abstract: A multi-port charging system includes a controller having a power input terminal coupled to a DC power output of a converter, multiple power output terminals coupled to the power input terminal, and a communications input terminal. The system includes multiple charger ports, the respective charger ports having a charging power line coupled to a respective one of the power output terminals, and a communications line coupled to the communications input terminal. The controller is configured to control the state of the control output terminal to set a voltage of the DC power output according to a selected highest common compatible voltage of one or more sink devices coupled to one or more respective ones of the charger ports.

公开(公告)号：US20160172280A1

公开(公告)日：2016-06-16

申请号：US14965697

申请日：2015-12-10

Applicant: Texas Instruments Incorporated

Inventor： Indumini Ranmuthu

IPC: H01L23/495 ,  H01L25/065 ,  H01L27/06

CPC classification number: H01L23/49568 ,  H01L23/49524 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49575 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L25/0657 ,  H01L25/071 ,  H01L25/16 ,  H01L27/088 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/37599 ,  H01L2224/40245 ,  H01L2224/84 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Techniques are described for integrating power field-effect transistors (FETs), pre-drivers, controllers, and/or resistors into a common multi-chip package for implementing multi-phase bridge circuits. The techniques may provide a multi-chip package with at least two high-side (HS) FETs and at least two low-side (LS) FETs, and place the at least two HS FETs or the at least LS FETs on a common die. Placing at least two FETs on a common die may reduce the number of die and the number of thermal pads (i.e., die pads) needed to implement a set of power FETs, thereby decreasing component count of a multi-phase bridge circuit and/or allowing a more compact, higher current density multi-phase bridge circuit to be obtained without significantly increasing thermal power dissipation of the circuit.

Abstract translation: 描述了将功率场效应晶体管（FET），预驱动器，控制器和/或电阻器集成到用于实现多相桥式电路的公共多芯片封装中的技术。 这些技术可以提供具有至少两个高侧（HS）FET和至少两个低侧（LS）FET）的多芯片封装，并且将至少两个HS FET或至少LS FET放置在公共裸片上 。 将至少两个FET放置在公共管芯上可以减少管芯数量和实现一组功率FET所需的热焊盘数量（即，焊盘），从而减少多相桥式电路的元件数量和/或 允许获得更紧凑，更高电流密度的多相桥式电路，而不显着增加电路的热功率耗散。

公开(公告)号：US11552555B2

公开(公告)日：2023-01-10

申请号：US17139470

申请日：2020-12-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Indumini Ranmuthu ,  Brian Thomas Lynch

IPC: H02M1/44 ,  H02M3/158

Abstract: In some examples, a circuit includes a state machine. The state machine is configured to operate in a buck state in which the state machine is configured to control a power converter to operate in a buck mode of operation at a first frequency. The state machine is configured to determine that a switch time of the power converter has decreased to within a threshold amount of a minimum switch time for the power converter. The state machine is configured to, responsive to the switch time of the power converter having decreased to within the threshold amount of the minimum switch time for the power converter, transition from the buck state to a reduced frequency buck state in which the state machine is configured to control the power converter to operate in the buck mode of operation at a second frequency that is less than the first frequency.