公开(公告)号：US20240274529A1

公开(公告)日：2024-08-15

申请号：US18641739

申请日：2024-04-22

Applicant: Texas Instruments Incorporated

Inventor： Klaas De Haan ,  Mikhail Valeryevich Ivanov ,  Tobias Bernhard Fritz ,  Swaminathan Sankaran ,  Thomas Dyer Bonifield

IPC: H01L23/522 ,  H01L21/50 ,  H01L23/50 ,  H04L25/02

CPC classification number: H01L23/5227 ,  H01L21/50 ,  H01L23/50 ,  H01L23/5222 ,  H04L25/0268

Abstract: An electronic device has an electronic device includes a substrate and a first dielectric layer over the substrate. The electronic device also includes a first metal layer on the first dielectric layer, the first metal layer including a first plate and a second dielectric layer over the first dielectric layer and the first metal layer. Additionally, the electronic device includes a second metal layer on the second dielectric layer. The second metal layer includes a second plate spaced apart from the first plate and a winding around the second plate.

公开(公告)号：US20220189873A1

公开(公告)日：2022-06-16

申请号：US17120123

申请日：2020-12-12

Applicant: Texas Instruments Incorporated

Inventor： Klaas De Haan ,  Mikhail Valeryevich Ivanov ,  Tobias Bernhard Fritz ,  Swaminathan Sankaran ,  Thomas Dyer Bonifield

IPC: H01L23/522 ,  H01L23/50 ,  H04L25/02 ,  H01L21/50

Abstract: An electronic device has a substrate and first and second metallization levels with a resonant circuit. The first metallization level has a first dielectric layer on a side of the substrate, and a first metal layer on the first dielectric layer. The second metallization level has a second dielectric layer on the first dielectric layer and the first metal layer, and a second metal layer on the second dielectric layer. The electronic device includes a first plate in the first metal layer, and a second plate spaced apart from the first plate in the second metal layer to form a capacitor. The electronic device includes a winding in one of the first and second metal layers and coupled to one of the first and second plates in a resonant circuit.

公开(公告)号：US11257814B2

公开(公告)日：2022-02-22

申请号：US16428682

申请日：2019-05-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Michael Szelong ,  James Robert Todd ,  Tobias Bernhard Fritz ,  Ralf Peter Brederlow

IPC: H01L27/08 ,  G01L1/18 ,  H01L49/02

Abstract: An integrated circuit comprises a semiconductor substrate having a surface. A lateral resistor is arranged in a first plane parallel to the surface of the substrate. A vertical reference resistor comprises a layer arranged in a second plane parallel to the surface of the substrate and deeper than the first plane. This layer is doped to promote current flow in the second plane. The vertical reference resistor further comprises a first trench and a second trench coupled between the layer and the surface of the substrate. The first and second trenches are arranged in a vertical direction orthogonal to the first and the second planes and are doped to impede current flow in the vertical direction. A cross-section of the first and second trenches is two-fold rotationally symmetric around the vertical direction, and the lateral resistor and the first and second trenches have the same temperature coefficient.

公开(公告)号：US11653568B2

公开(公告)日：2023-05-16

申请号：US17136413

申请日：2020-12-29

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Baher Haroun ,  Tobias Bernhard Fritz ,  Michael Szelong ,  Ernst Muellner

IPC: H01L41/113 ,  H01L27/20 ,  G01L1/18 ,  H01L41/311 ,  H01L25/16 ,  H01L23/31 ,  H01L41/053

CPC classification number: H01L41/311 ,  G01L1/18 ,  H01L23/3107 ,  H01L25/165 ,  H01L27/20 ,  H01L41/053 ,  H01L41/1132

Abstract: An integrated circuit is described herein that includes a semiconductor substrate. First and second piezoresistive sensors are on or in the substrate where each have a respective sensing axis extending in first and second directions respectively parallel with a surface of the substrate, where the second direction is perpendicular to the first direction. A third piezoresistive sensor is on or in the substrate and has a respective sensing axis extending in a third direction parallel with the surface of the substrate and neither parallel nor perpendicular to the first and second directions.

公开(公告)号：US10389407B2

公开(公告)日：2019-08-20

申请号：US15816365

申请日：2017-11-17

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Erich Johann Bayer ,  Johann Zipperer ,  Christophe Vaucourt ,  Tobias Bernhard Fritz

IPC: H04B5/00 ,  H04B1/58 ,  H03L7/08 ,  H02J50/10 ,  H02M3/335

Abstract: In described examples, a system includes a transformer including a primary winding and a secondary winding. The system also includes a primary side circuit coupled to the primary winding of the transformer. The primary side circuit includes a primary controller. The system further includes a secondary side circuit coupled to the secondary winding of the transformer. The primary controller coupled to cause the primary side circuit to transfer power and intermittently transmit data to the secondary side circuit via the primary winding and the secondary winding of the transformer.

公开(公告)号：US20190207786A1

公开(公告)日：2019-07-04

申请号：US15859419

申请日：2017-12-30

Applicant: Texas Instruments Incorporated

Inventor： Swaminathan Sankaran ,  Bradley Allen Kramer ,  Baher Haroun ,  Tobias Bernhard Fritz ,  Ernst Georg Muellner ,  Ralf Peter Brederlow

IPC: H04L25/02 ,  H05K1/02 ,  H03K17/693 ,  G01R31/317 ,  H04B1/525 ,  H04B3/54

CPC classification number: H04L25/0276 ,  G01R31/31706 ,  H03K17/693 ,  H04B1/525 ,  H04B3/542 ,  H05K1/0233

Abstract: Described examples include an integrated circuit including a receive portion to receive an encoded transmission on a line. The receive portion has: a wake mode in which the receiver is capable of receiving the encoded transmission; and a sleep mode in which the receiver is not capable of receiving the encoded transmission. A wakeup controller monitors the line for a wakeup signal and provides a signal to the receive portion to cause the receive portion to enter the wake mode when the wakeup controller receives the wakeup signal.

公开(公告)号：US12127480B2

公开(公告)日：2024-10-22

申请号：US16932343

申请日：2020-07-17

Applicant: Texas Instruments Incorporated

Inventor： Umidjon Nurmetov ,  Ralf Peter Brederlow ,  Baher Haroun ,  Jose Antonio Vieira Formenti ,  Michael Szelong ,  Tobias Bernhard Fritz

IPC: G01L1/18 ,  G01L1/22 ,  H10N30/30 ,  H10N30/80

CPC classification number: H10N30/302 ,  G01L1/18 ,  G01L1/2268 ,  H10N30/802

Abstract: In described examples, a circuit includes an analog frontend arranged to generate an analog stress compensating signal in response to a to-be-compensated analog signal and a first-axis stress sensing signal. The analog frontend can comprise a first precision component (e.g., 220) arranged on a piezoelectric material and arranged to generate the to-be-compensated analog signal that is affected by a stress exerted in the piezoelectric material and a directional stress sensor arranged on the piezoelectric material and coupled to the first precision component. The directional stress sensor is arranged to generate the first-axis sensing signal in response to a longitudinal resultant of a stress exerted in the piezoelectric material. A compensating circuit is arranged to generate a compensated output signal in response to the compensating analog signal and to-be-compensated analog signal.

公开(公告)号：US12033936B2

公开(公告)日：2024-07-09

申请号：US17963149

申请日：2022-10-10

Applicant: Texas Instruments Incorporated

Inventor： Klaas De Haan ,  Mikhail Valeryevich Ivanov ,  Tobias Bernhard Fritz ,  Swaminathan Sankaran ,  Thomas Dyer Bonifield

IPC: H01L23/522 ,  H01L21/50 ,  H01L23/50 ,  H04L25/02

CPC classification number: H01L23/5227 ,  H01L21/50 ,  H01L23/50 ,  H01L23/5222 ,  H04L25/0268

Abstract: An electronic device has a substrate and first and second metallization levels with a resonant circuit. The first metallization level has a first dielectric layer on a side of the substrate, and a first metal layer on the first dielectric layer. The second metallization level has a second dielectric layer on the first dielectric layer and the first metal layer, and a second metal layer on the second dielectric layer. The electronic device includes a first plate in the first metal layer, and a second plate spaced apart from the first plate in the second metal layer to form a capacitor. The electronic device includes a winding in one of the first or second metal layers and coupled to one of the first or second plates in a resonant circuit.

公开(公告)号：US11581309B2

公开(公告)日：2023-02-14

申请号：US17675066

申请日：2022-02-18

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Michael Szelong ,  James Robert Todd ,  Tobias Bernhard Fritz ,  Ralf Peter Brederlow

IPC: H01L27/08 ,  G01L1/18 ,  H01L49/02

Abstract: An integrated circuit comprises a semiconductor substrate having a surface. A lateral resistor is arranged in a first plane parallel to the surface of the substrate. A vertical reference resistor comprises a layer arranged in a second plane parallel to the surface of the substrate and deeper than the first plane. This layer is doped to promote current flow in the second plane. The vertical reference resistor further comprises a first trench and a second trench coupled between the layer and the surface of the substrate. The first and second trenches are arranged in a vertical direction orthogonal to the first and the second planes and are doped to impede current flow in the vertical direction. A cross-section of the first and second trenches is two-fold rotationally symmetric around the vertical direction, and the lateral resistor and the first and second trenches have the same temperature coefficient.

公开(公告)号：US20220187378A1

公开(公告)日：2022-06-16

申请号：US17389415

申请日：2021-07-30

Applicant: Texas Instruments Incorporated

Inventor： Jose Antonio Vieira Formenti ,  Michael Szelong ,  Takao Oshida ,  Tobias Bernhard Fritz ,  Vishnu Ravinuthula

IPC: G01R31/374 ,  H03M1/38 ,  G01R31/3835 ,  G01L1/22

Abstract: An electronic device includes an ADC, a multiplexer, a voltage reference circuit, an analog circuit, and a digital circuit. The ADC has a signal input, a reference input, and an output. The multiplexer has signal inputs and a signal output coupled to the signal input of the ADC. The voltage reference circuit has an output coupled to the reference input of the ADC, a first strain sensor coupled to a first signal input of the multiplexer, a second strain sensor coupled to a second signal input of the multiplexer, and a temperature sensor. The analog circuit has an input coupled to a battery, and an output coupled to a fourth signal input of the multiplexer. The digital circuit is coupled to the output of the ADC and stores correction parameters for correcting a converted battery voltage value from the ADC.