公开(公告)号：US09857687B2

公开(公告)日：2018-01-02

申请号：US14770979

申请日：2014-02-26

申请人： TOKAI SHINEI ELECTRONICS INDUSTRY CO., LTD ,  Tadayoshi Saito ,  YAMATOYA & CO., LTD

发明人： Kazunori Tsuge ,  Yoshihito Tanaka ,  Koji Akiyama ,  Kiyoshi Tanaka ,  Kazuyoshi Nishio ,  Takehiro Kato ,  Masaru Murakami ,  Tadayoshi Saito ,  Hirotoshi Yoshimura ,  Akira Inoue ,  Iwao Numakura ,  Noriaki Tsukada

IPC分类号： G03F7/004 ,  G03F7/09 ,  G03C1/76 ,  G03C1/95 ,  G03F7/20 ,  G03F7/11 ,  H01L23/498 ,  H05K1/02 ,  H05K3/28 ,  G03F1/50 ,  G03F7/32 ,  G03F7/40 ,  H05K3/34

CPC分类号： G03F7/2002 ,  G03C1/76 ,  G03C1/95 ,  G03F1/50 ,  G03F7/0012 ,  G03F7/004 ,  G03F7/038 ,  G03F7/09 ,  G03F7/11 ,  G03F7/2016 ,  G03F7/2022 ,  G03F7/203 ,  G03F7/32 ,  G03F7/40 ,  H01L23/49894 ,  H01L2924/0002 ,  H05K1/0269 ,  H05K3/287 ,  H05K3/341 ,  H05K2201/099 ,  H05K2201/09936 ,  H05K2203/056 ,  H05K2203/0571 ,  H01L2924/00

摘要： A method of manufacturing a substrate includes applying solder resist ink containing a mixing resin of epoxy-based resin and acrylic-based resin on at least one surface of a substrate body to form a solder resist layer, and irradiating a predetermined portion of the solder resist layer with ultraviolet rays and controlling an amount of irradiation of the ultraviolet rays irradiated to the predetermined of the solder resist layer to form the predetermined portion in transmissivity that transmits light.