公开(公告)号：US20160155721A1

公开(公告)日：2016-06-02

申请号：US14950281

申请日：2015-11-24

申请人： TOKYO ELECTRON LIMITED

发明人： Kenji SUGAKAWA ,  Yuji MIMURA ,  Shuhei MATSUMOTO ,  Takahiro MASUNAGA ,  Makoto TSUKISHIMA

IPC分类号： H01L23/00 ,  H01L21/67 ,  H01L21/66

CPC分类号： H01L21/67248 ,  H01L21/67092 ,  H01L21/681 ,  H01L21/8221 ,  H01L22/12 ,  H01L22/20 ,  H01L24/08 ,  H01L24/75 ,  H01L24/80 ,  H01L24/94 ,  H01L2224/08145 ,  H01L2224/7501 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75301 ,  H01L2224/75601 ,  H01L2224/7565 ,  H01L2224/75702 ,  H01L2224/75704 ,  H01L2224/75705 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/75753 ,  H01L2224/75802 ,  H01L2224/75804 ,  H01L2224/75822 ,  H01L2224/75823 ,  H01L2224/75824 ,  H01L2224/759 ,  H01L2224/75981 ,  H01L2224/80003 ,  H01L2224/80013 ,  H01L2224/80048 ,  H01L2224/8013 ,  H01L2224/80132 ,  H01L2224/80201 ,  H01L2224/80894 ,  H01L2224/80908 ,  H01L2224/83201 ,  H01L2224/94 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2224/80 ,  H01L2924/00014

摘要： There is provided a method of bonding substrates to each other, which includes: holding a first substrate on a lower surface of a first holding part; adjusting a temperature of a second substrate by a temperature adjusting part to become higher than a temperature of the first substrate; holding the second substrate on an upper surface of a second holding part; inspecting a state of the second substrate by imaging a plurality of reference points of the second substrate with a first imaging part, measuring positions of the reference points, and comparing a measurement result with a predetermined permissible range; and pressing a central portion of the first substrate with a pressing member, bringing the central portion of the first substrate into contact with a central portion of the second substrate, and sequentially bonding the first substrate and the second substrate.

摘要翻译： 提供了将基板彼此接合的方法，其包括：将第一基板保持在第一保持部的下表面上; 通过温度调节部分调节第二基板的温度以变得高于第一基板的温度; 将第二基板保持在第二保持部的上表面上; 通过用第一成像部分对第二基板的多个参考点进行成像来检查第二基板的状态，测量参考点的位置，并将测量结果与预定的允许范围进行比较; 并且用按压部件按压所述第一基板的中央部，使所述第一基板的中央部与所述第二基板的中央部接触，并顺序地接合所述第一基板和所述第二基板。

公开(公告)号：US20200343216A1

公开(公告)日：2020-10-29

申请号：US16928814

申请日：2020-07-14

申请人： TOKYO ELECTRON LIMITED

发明人： Yoshitaka OTSUKA ,  Takashi NAKAMITSU ,  Yosuke OMORI ,  Kenji SUGAKAWA

IPC分类号： H01L23/00 ,  H01L21/677 ,  H01L21/67 ,  H01L21/683 ,  B32B15/01 ,  H01L21/18 ,  H01L21/20 ,  H01L21/68

摘要： There is provided a bonding apparatus for bonding substrates together, which includes: a first holding part configured to adsorptively hold a first substrate by vacuum-drawing the first substrate on a lower surface of the first substrate; a second holding part provided below the first holding part and configured to adsorptively hold a second substrate by vacuum-drawing the second substrate on an upper surface of the second substrate; a pressing member provided in the first holding part and configured to press a central portion of the first substrate; and a plurality of substrate detection parts provided in the first holding part and configured to detect a detachment of the first substrate from the first holding part.

公开(公告)号：US20190385973A1

公开(公告)日：2019-12-19

申请号：US16553530

申请日：2019-08-28

申请人： TOKYO ELECTRON LIMITED

发明人： Yoshitaka OTSUKA ,  Takashi NAKAMITSU ,  Yosuke OMORI ,  Kenji SUGAKAWA

IPC分类号： H01L23/00 ,  H01L21/683 ,  H01L21/67 ,  H01L21/677

摘要： There is provided a bonding apparatus for bonding substrates together, which includes: a first holding part configured to adsorptively hold a first substrate by vacuum-drawing the first substrate on a lower surface of the first substrate; a second holding part provided below the first holding part and configured to adsorptively hold a second substrate by vacuum-drawing the second substrate on an upper surface of the second substrate; a pressing member provided in the first holding part and configured to press a central portion of the first substrate; and a plurality of substrate detection parts provided in the first holding part and configured to detect a detachment of the first substrate from the first holding part.

公开(公告)号：US20180158796A1

公开(公告)日：2018-06-07

申请号：US15822364

申请日：2017-11-27

申请人： TOKYO ELECTRON LIMITED

发明人： Yoshitaka OTSUKA ,  Takashi NAKAMITSU ,  Yosuke OMORI ,  Kenji SUGAKAWA

IPC分类号： H01L23/00 ,  H01L21/683 ,  H01L21/677 ,  H01L21/67 ,  B32B37/10 ,  B32B41/00 ,  B32B37/00

CPC分类号： H01L24/75 ,  B32B15/01 ,  B32B37/0046 ,  B32B37/10 ,  B32B41/00 ,  B32B2041/04 ,  B32B2457/14 ,  H01L21/187 ,  H01L21/2007 ,  H01L21/67092 ,  H01L21/67253 ,  H01L21/67259 ,  H01L21/67742 ,  H01L21/68 ,  H01L21/6838 ,  H01L24/80 ,  H01L24/83 ,  H01L2224/7515 ,  H01L2224/753 ,  H01L2224/75302 ,  H01L2224/75305 ,  H01L2224/7531 ,  H01L2224/7555 ,  H01L2224/7565 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/75901 ,  H01L2224/75981 ,  H01L2224/75986 ,  H01L2224/80009 ,  H01L2224/80201 ,  H01L2224/80894 ,  H01L2224/80908 ,  H01L2224/83009 ,  H01L2224/83201 ,  H01L2224/83894 ,  H01L2224/83908

摘要： There is provided a bonding apparatus for bonding substrates together, which includes: a first holding part configured to adsorptively hold a first substrate by vacuum-drawing the first substrate on a lower surface of the first substrate; a second holding part provided below the first holding part and configured to adsorptively hold a second substrate by vacuum-drawing the second substrate on an upper surface of the second substrate; a pressing member provided in the first holding part and configured to press a central portion of the first substrate; and a plurality of substrate detection parts provided in the first holding part and configured to detect a detachment of the first substrate from the first holding part.