公开(公告)号：US09922859B2

公开(公告)日：2018-03-20

申请号：US14163015

申请日：2014-01-24

Applicant: TOKYO ELECTRON LIMITED

Inventor： Shintaro Sugihara ,  Naoto Yoshitaka ,  Shigenori Kitahara ,  Keizo Hirose

IPC: B23Q3/08 ,  H01L21/673 ,  H01L21/683 ,  H01L21/67 ,  H01L21/68

Abstract: A joining device for joining substrates together includes a first holding member configured to vacuum-suck a first substrate to draw and hold the first substrate on a lower surface thereof, and a second holding member disposed below the first holding member and configured to vacuum-suck a second substrate to draw and hold the second substrate on an upper surface thereof. The second holding member includes a body portion formed into a size larger than the second substrate when seen in a plan view and configured to vacuum-suck the second substrate, a plurality of pins provided on the body portion and configured to make contact with a rear surface of the second substrate, and an outer wall portion annularly provided on the body portion at an outer side of the plurality of pins and configured to support an outer periphery portion of the rear surface of the second substrate.

公开(公告)号：US09716002B2

公开(公告)日：2017-07-25

申请号：US15204068

申请日：2016-07-07

Applicant: TOKYO ELECTRON LIMITED

Inventor： Yasushi Takiguchi ,  Taro Yamamoto ,  Akihiro Fujimoto ,  Shuuichi Nishikido ,  Dai Kumagai ,  Naoto Yoshitaka ,  Takahiro Kitano ,  Yoichi Tokunaga

IPC: H01L21/02 ,  B08B3/02 ,  H01L21/67 ,  B08B1/00 ,  B08B1/04 ,  B08B5/02 ,  B08B7/00 ,  H01L21/687

CPC classification number: H01L21/0209 ,  B08B1/002 ,  B08B1/04 ,  B08B3/02 ,  B08B5/02 ,  B08B7/0057 ,  H01L21/67028 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/68742 ,  H01L21/68764

Abstract: A disclosed substrate cleaning apparatus for cleaning a back surface of a substrate includes a first substrate supporting portion configured to support the substrate at a first area of a back surface of the substrate, the back surface facing down; a second substrate supporting portion configured to support the substrate at a second area of the back surface of the substrate, the second area being separated from the first area; a cleaning liquid supplying portion configured to supply cleaning liquid to the back surface of the substrate; a drying portion configured to dry the second area of the back surface of the substrate; and a cleaning portion configured to clean a third area of the back surface of the substrate when the substrate is supported by the first substrate supporting portion, the third area including the second area, and a fourth area of the back surface of the substrate when the substrate is supported by the second substrate supporting portion, the fourth area excluding the second area of the back surface.

公开(公告)号：US09960069B2

公开(公告)日：2018-05-01

申请号：US14163015

申请日：2014-01-24

Applicant: TOKYO ELECTRON LIMITED

Inventor： Shintaro Sugihara ,  Naoto Yoshitaka ,  Shigenori Kitahara ,  Keizo Hirose

IPC: B23Q3/08 ,  H01L21/673 ,  H01L21/683 ,  H01L21/67 ,  H01L21/68

CPC classification number: H01L21/6838 ,  H01L21/67092 ,  H01L21/681 ,  Y10T29/53974

Abstract: A joining device for joining substrates together includes a first holding member configured to vacuum-suck a first substrate to draw and hold the first substrate on a lower surface thereof, and a second holding member disposed below the first holding member and configured to vacuum-suck a second substrate to draw and hold the second substrate on an upper surface thereof. The second holding member includes a body portion formed into a size larger than the second substrate when seen in a plan view and configured to vacuum-suck the second substrate, a plurality of pins provided on the body portion and configured to make contact with a rear surface of the second substrate, and an outer wall portion annularly provided on the body portion at an outer side of the plurality of pins and configured to support an outer periphery portion of the rear surface of the second substrate.

公开(公告)号：US09607869B2

公开(公告)日：2017-03-28

申请号：US14457219

申请日：2014-08-12

Applicant: Tokyo Electron Limited

Inventor： Masataka Matsunaga ,  Naoto Yoshitaka ,  Satoshi Nishimura

IPC: H01L21/67 ,  H01L23/00 ,  H01L21/68

CPC classification number: H01L21/67173 ,  B32B2457/14 ,  H01L21/67092 ,  H01L21/67109 ,  H01L21/68 ,  H01L24/75 ,  H01L2224/7515 ,  H01L2224/753 ,  H01L2224/7565 ,  H01L2224/75981 ,  H01L2924/06 ,  H01L2924/15788 ,  H01L2924/20106 ,  H01L2924/00

Abstract: An object of the present disclosure is to reduce a footprint. A bonding system of the present disclosure includes a first processing station, a second processing station, and a carry-in/out station. The first processing station includes a first conveyance region, a coating device, a heating device, and a first delivery block. The second processing station includes a plurality of bonding devices, a second conveyance region, and a second delivery block. Each of the plurality of bonding devices bonds the first substrate to the second substrate. The second conveyance region is a region configured to convey the first substrate and the second substrate to and from the plurality of bonding devices. The second delivery block delivers the first substrate, the second substrate and the superimposed substrate between the first conveyance region and the second conveyance region.

公开(公告)号：US09120120B2

公开(公告)日：2015-09-01

申请号：US14460020

申请日：2014-08-14

Applicant: TOKYO ELECTRON LIMITED

Inventor： Taro Yamamoto ,  Naoto Yoshitaka ,  Shuichi Nishikido ,  Yoichi Tokunaga

IPC: B08B3/00 ,  B05D3/10 ,  G03F7/16 ,  H01L21/67 ,  B05D3/06 ,  B05D5/06

CPC classification number: B05D3/105 ,  B05D3/065 ,  B05D5/06 ,  G03F7/168 ,  H01L21/67046 ,  H01L21/67051

Abstract: A cleaning apparatus includes a first substrate-holding portion configured to hold a first area of a back surface of the substrate so that the top surface is kept face up; a second substrate-holding portion configured to hold a second area of the back surface of the substrate, the second area being not overlapped with the first area, and rotate the substrate; a top-surface cleaning nozzle configured to supply a top surface cleaning fluid to a top surface of the substrate; a bevel cleaning nozzle configured to supply a bevel cleaning fluid to a bevel portion of the substrate; a cleaning fluid supplying portion configured to supply a back surface cleaning fluid to the back surface of the substrate held by the first or the second substrate-holding portion; and a cleaning member configured to clean the back surface of the substrate held by the first or the second-substrate holding portion.

Abstract translation: 清洁装置包括：第一基板保持部，其构造成保持基板的背面的第一区域，使得顶表面保持朝上; 第二基板保持部构造成保持基板的背面的第二区域，第二区域不与第一区域重叠，并旋转基板; 顶表面清洁喷嘴，其构造成将顶表面清洁流体供应到所述基板的顶表面; 斜面清洁喷嘴，其构造成将倾斜清洁流体供应到所述基板的斜面部分; 清洗液供给部，其构造成将后表面清洗液供给到由所述第一或第二基板保持部保持的基板的背面; 以及清洁部件，其构造成清洁由所述第一或第二基板保持部保持的所述基板的背面。

公开(公告)号：US20150059985A1

公开(公告)日：2015-03-05

申请号：US14457219

申请日：2014-08-12

Applicant: Tokyo Electron Limited

Inventor： Masataka Matsunaga ,  Naoto Yoshitaka ,  Satoshi Nishimura

IPC: H01L23/00 ,  H01L21/67 ,  H01L21/68 ,  H01L21/677

CPC classification number: H01L21/67173 ,  B32B2457/14 ,  H01L21/67092 ,  H01L21/67109 ,  H01L21/68 ,  H01L24/75 ,  H01L2224/7515 ,  H01L2224/753 ,  H01L2224/7565 ,  H01L2224/75981 ,  H01L2924/06 ,  H01L2924/15788 ,  H01L2924/20106 ,  H01L2924/00

Abstract: An object of the present disclosure is to reduce a footprint. A bonding system of the present disclosure includes a first processing station, a second processing station, and a carry-in/out station. The first processing station includes a first conveyance region, a coating device, a heating device, and a first delivery block. The second processing station includes a plurality of bonding devices, a second conveyance region, and a second delivery block. Each of the plurality of bonding devices bonds the first substrate to the second substrate. The second conveyance region is a region configured to convey the first substrate and the second substrate to and from the plurality of bonding devices. The second delivery block delivers the first substrate, the second substrate and the superimposed substrate between the first conveyance region and the second conveyance region.

Abstract translation: 本公开的目的是减少占用空间。 本公开的接合系统包括第一处理站，第二处理站和进/出站。 第一处理站包括第一输送区域，涂布装置，加热装置和第一输送块。 第二处理站包括多个接合装置，第二输送区域和第二输送块。 多个接合装置中的每一个将第一基板结合到第二基板。 第二输送区域是构造成将第一基板和第二基板输送到多个接合装置的区域。 第二输送块在第一输送区域和第二输送区域之间输送第一基板，第二基板和叠加基板。