公开(公告)号：US20240139780A1

公开(公告)日：2024-05-02

申请号：US18496824

申请日：2023-10-27

Applicant: TOKYO ELECTRON LIMITED

Inventor： Kento KURUSU ,  Akihiro KUBO ,  Noboru NAKASHIMA ,  Yasunari KASAI

IPC: B08B1/00 ,  B08B1/02 ,  B24B7/07

CPC classification number: B08B1/001 ,  B08B1/02 ,  B24B7/07

Abstract: A substrate cleaning member includes: a first member including a first contact surface, wherein the first member is configured to clean or polish a main surface of a substrate by moving the first contact surface along the main surface while the first contact surface is in contact with the main surface; a second member including a second contact surface, wherein the second member is configured to clean the main surface by moving the second contact surface along the main surface while the second contact surface is in contact with the main surface; a lower-layer member configured to support the second member such that the second contact surface protrudes beyond the first contact surface in an axial direction in which the predetermined axis extends; and a base configured to support the first member, the second member and the lower-layer member.

公开(公告)号：US20150133032A1

公开(公告)日：2015-05-14

申请号：US14533133

申请日：2014-11-05

Applicant: TOKYO ELECTRON LIMITED

Inventor： Akihiro KUBO ,  Masahiro FUKUDA ,  Taro YAMAMOTO ,  Kenji YADA ,  Masashi ENOMOTO ,  Noboru NAKASHIMA

IPC: H01L21/67 ,  B24B37/005 ,  B24B37/34

CPC classification number: B24B37/005 ,  B24B25/00 ,  B24B27/0061 ,  B24B37/34 ,  B24B47/16 ,  B24D7/18 ,  H01L21/0209 ,  H01L21/30625 ,  H01L21/67046 ,  H01L21/67253

Abstract: There is disclosed a polishing cleaning mechanism configured to be in contact with a rear surface of a substrate which is held in a substrate holding unit for holding the rear surface of the substrate and perform a polishing process and a cleaning process on the rear surface of the substrate, including a cleaning member configured to clean the rear surface of the substrate, a polishing member configured to polish the rear surface of the substrate, and a support member configured to support the polishing member and the cleaning member to face the rear surface of the substrate held in the substrate holding unit, wherein a surface of the polishing member facing the substrate and a surface of the cleaning member facing the substrate differ in relative height from each other.

Abstract translation: 公开了一种抛光清洁机构，其构造成与保持在基板保持单元中的基板的后表面接触，用于保持基板的后表面，并且在该基板的后表面上执行抛光处理和清洁处理 基板，包括构造成清洁基板的后表面的清洁构件，被配置为抛光基板的后表面的抛光构件，以及支撑构件，其构造成将抛光构件和清洁构件支撑在面 基板保持在基板保持单元中，其中抛光构件的面向基板的表面和清洁构件的面对基板的表面在相对高度上不同。

公开(公告)号：US20170225289A1

公开(公告)日：2017-08-10

申请号：US15499402

申请日：2017-04-27

Applicant: TOKYO ELECTRON LIMITED

Inventor： Akihiro KUBO ,  Masahiro FUKUDA ,  Taro YAMAMOTO ,  Kenzi YADA ,  Masashi ENOMOTO ,  Noboru NAKASHIMA

IPC: B24B37/005 ,  H01L21/67 ,  H01L21/306 ,  B24B37/34 ,  H01L21/02

CPC classification number: B24B37/005 ,  B24B25/00 ,  B24B27/0061 ,  B24B37/34 ,  B24B47/16 ,  B24B49/16 ,  B24D7/18 ,  H01L21/0209 ,  H01L21/30625 ,  H01L21/67046 ,  H01L21/67253

Abstract: There is disclosed a polishing cleaning mechanism configured to be in contact with a rear surface of a substrate which is held in a substrate holding unit for holding the rear surface of the substrate and perform a polishing process and a cleaning process on the rear surface of the substrate, including a cleaning member configured to clean the rear surface of the substrate, a polishing member configured to polish the rear surface of the substrate, and a support member configured to support the polishing member and the cleaning member to face the rear surface of the substrate held in the substrate holding unit, wherein a surface of the polishing member facing the substrate and a surface of the cleaning member facing the substrate differ in relative height from each other.