公开(公告)号：US20240085813A1

公开(公告)日：2024-03-14

申请号：US18515667

申请日：2023-11-21

Applicant: Tokyo Electron Limited

Inventor： Kenta SHIBASAKI ,  Hiroichi INADA ,  Satoshi SHIMMURA ,  Koji TAKAYANAGI ,  Kenji YADA ,  Shinichi SEKI ,  Akihiro TERAMOTO

IPC: G03F7/00 ,  B05C11/02 ,  B08B3/08 ,  G03F7/16

CPC classification number: G03F7/70925 ,  B05C11/02 ,  B08B3/08 ,  G03F7/162

Abstract: A cleaning method of cleaning a solution treatment apparatus for applying a coating solution onto a substrate, the solution treatment apparatus including a holder holding and rotating the substrate; a coating solution supplier; and an inner cup surrounding the holder from a lateral side and having a peripheral edge side upper surface inclining down outward in a radial direction. The cleaning method includes introducing the cleaning solution to the storage chamber via the introduction hole, discharging the cleaning solution from the discharge port and making the cleaning solution flow down along the peripheral edge side upper surface of the inner cup, thereby cleaning away the coating solution adhering to the peripheral edge side upper surface. The discharging in the cleaning discharges the cleaning solution from discharge ports of the inner cup outward in the radial direction and obliquely upward.

公开(公告)号：US20150133032A1

公开(公告)日：2015-05-14

申请号：US14533133

申请日：2014-11-05

Applicant: TOKYO ELECTRON LIMITED

Inventor： Akihiro KUBO ,  Masahiro FUKUDA ,  Taro YAMAMOTO ,  Kenji YADA ,  Masashi ENOMOTO ,  Noboru NAKASHIMA

IPC: H01L21/67 ,  B24B37/005 ,  B24B37/34

CPC classification number: B24B37/005 ,  B24B25/00 ,  B24B27/0061 ,  B24B37/34 ,  B24B47/16 ,  B24D7/18 ,  H01L21/0209 ,  H01L21/30625 ,  H01L21/67046 ,  H01L21/67253

Abstract: There is disclosed a polishing cleaning mechanism configured to be in contact with a rear surface of a substrate which is held in a substrate holding unit for holding the rear surface of the substrate and perform a polishing process and a cleaning process on the rear surface of the substrate, including a cleaning member configured to clean the rear surface of the substrate, a polishing member configured to polish the rear surface of the substrate, and a support member configured to support the polishing member and the cleaning member to face the rear surface of the substrate held in the substrate holding unit, wherein a surface of the polishing member facing the substrate and a surface of the cleaning member facing the substrate differ in relative height from each other.

Abstract translation: 公开了一种抛光清洁机构，其构造成与保持在基板保持单元中的基板的后表面接触，用于保持基板的后表面，并且在该基板的后表面上执行抛光处理和清洁处理 基板，包括构造成清洁基板的后表面的清洁构件，被配置为抛光基板的后表面的抛光构件，以及支撑构件，其构造成将抛光构件和清洁构件支撑在面 基板保持在基板保持单元中，其中抛光构件的面向基板的表面和清洁构件的面对基板的表面在相对高度上不同。

公开(公告)号：US20230185199A1

公开(公告)日：2023-06-15

申请号：US18077577

申请日：2022-12-08

Applicant: Tokyo Electron Limited

Inventor： Hiroki SAKURAI ,  Nobuhiro OGATA ,  Daisuke GOTO ,  Kanta MORI ,  Kenji YADA ,  Yusuke HASHIMOTO ,  Shoki MIZUGUCHI ,  Yenrui HSU

IPC: G03F7/30 ,  G03F7/42

CPC classification number: G03F7/3021 ,  G03F7/426

Abstract: A nozzle that mixes fluid containing steam or mist of pressurized pure water and processing liquid containing at least sulfuric acid and ejects mixed fluid of the fluid and the processing liquid, the nozzle comprising: at least one first ejection port ejecting the fluid; at least one second ejection port ejecting the processing liquid; and at least one lead-out path being in fluid communication with the at least one first ejection port and the at least one second ejection port and leading out the mixed fluid of the fluid ejected from the at least one first ejection port and the processing liquid ejected from the at least one second ejection port, wherein the at least one first ejection port or the at least one second ejection port is arranged to be directed to position deviated from central axis of the at least one lead-out path in a plan view.

公开(公告)号：US20220113643A1

公开(公告)日：2022-04-14

申请号：US17485698

申请日：2021-09-27

Applicant: Tokyo Electron Limited

Inventor： Kenta SHIBASAKI ,  Hiroichi INADA ,  Satoshi SHIMMURA ,  Koji TAKAYANAGI ,  Kenji YADA ,  Shinichi SEKI ,  Akihiro TERAMOTO

IPC: G03F7/20 ,  B08B3/08 ,  G03F7/16

Abstract: A solution treatment apparatus for applying a coating solution onto a substrate, includes: a holder holding and rotating the substrate; a coating solution supplier supplying the coating solution to the substrate on the holder; and an inner cup surrounding the holder from a lateral side and having a peripheral edge side upper surface inclining down outward in a radial direction from an apex part located below a peripheral edge side of the substrate on the holder, wherein: the inner cup has a plurality of discharge ports formed along a circumferential direction at the apex part; and the discharge ports are formed to discharge a cleaning solution and make the cleaning solution flow down along the peripheral edge side upper surface of the inner cup, thereby cleaning the peripheral edge side upper surface, and to discharge the cleaning solution outward in the radial direction and obliquely upward.