公开(公告)号：US20220411572A1

公开(公告)日：2022-12-29

申请号：US17773694

申请日：2020-11-05

Applicant: TORAY INDUSTRIES, INC.

Inventor： Koji FURUKAWA ,  Kentaro SANO ,  Junko KAWASAKI

IPC: C08G59/50 ,  C08L63/00 ,  C08J5/24

Abstract: An object of the present invention is to provide an epoxy resin composition excellent in elastic modulus and strength, and a prepreg and a fiber reinforced composite material with the epoxy resin composition. The present invention is the epoxy resin composition including the following components [A] to [C] and satisfying the following conditions (1) to (3): [A]: epoxy resin [B]: aromatic diamine [C]: a compound having a boiling point of 130° C. or more and a molecular weight m of 50 or more and 250 or less, the compound having no epoxy group in the molecule and having substantially no curing ability of an epoxy resin (1): at least a part of the component [C] satisfies that the sum of the polar component and the hydrogen bond component in the Hansen solubility parameters is 10.0 or more.
(2): at least a part of the component [C] satisfies that the Hansen solubility parameter distance L to the component [A] is 20.0 or less.
(3): the ratio H/E between the amount by mole, E, of the epoxy group of the component [A] and the amount by mole, C, of the component [C] satisfying both the condition (1) and the condition (2) is 0.01 or more and 0.20 or less.
(4): the viscosity at 70° C. for 2 hours is 5.0 times or less the initial viscosity at 70° C.

公开(公告)号：US20240309200A1

公开(公告)日：2024-09-19

申请号：US18280059

申请日：2022-02-03

Applicant: TORAY INDUSTRIES, INC.

Inventor： Koji FURUKAWA ,  Kentaro SANO ,  Junko KAWASAKI

IPC: C08L63/00 ,  C08G59/50 ,  C08J5/24 ,  C08K5/521

CPC classification number: C08L63/00 ,  C08G59/504 ,  C08J5/24 ,  C08K5/521 ,  C08J2363/00 ,  C08J2463/00 ,  C08L2205/025

Abstract: An object of the present invention is to provide an epoxy resin composition which can be suitably used in prepreg and fiber-reinforced composite material applications, and which has an excellent strength, elastic modulus, elastic modulus under hot wet conditions and heat resistance after moisture absorption. The gist of the present invention is an epoxy resin composition including the following components [A], [B] and [C]:



[A]: an epoxy resin,
[B]: an amine curing agent, and
[C]: a phosphate ester compound having a molecular weight of 250 or less; wherein the epoxy resin composition satisfies the following requirements (1) and (2):
(1): the epoxy resin composition includes 1 part by mass or more and 15 parts by mass or less of the component [C] with respect to 100 parts by mass of the component [A]; and
(2): the component [A] has an average epoxy equivalent of 160 g/eq or less.

公开(公告)号：US20220411626A1

公开(公告)日：2022-12-29

申请号：US17772581

申请日：2020-11-05

Applicant: TORAY INDUSTRIES, INC.

Inventor： Koji FURUKAWA ,  Kentaro SANO ,  Junko KAWASAKI

IPC: C08L63/00 ,  C08G59/50 ,  C08J5/24 ,  C08J5/04

Abstract: An object of the present invention is to provide an epoxy resin composition that can be preferably used for prepreg and fiber reinforced composite material applications and is excellent in elastic modulus, strength, and pot life.
The present invention is the epoxy resin composition including the following components [A] to [C] and satisfying the following conditions (1) to (3): [A]: epoxy resin [B]: polyamine curing agent, and [C]: a compound having a boiling point of 130° C. or more and a molecular weight m of 50 or more and 250 or less, the compound having no epoxy group in the molecule and having substantially no curing ability of an epoxy resin, and (1): at least a part of the component [C] has two or more alcoholic hydroxyl groups in the molecule. (2): the ratio C/E of the amount by mole, E, for epoxy groups of the component [A] to the amount by mole, C, of the component [C] satisfying the condition (1) is 0.01 or more and 0.20 or less. (3): the viscosity at 70° C. for 2 hours is 5.0 times or less the initial viscosity at 70° C.

公开(公告)号：US20150368857A1

公开(公告)日：2015-12-24

申请号：US14842377

申请日：2015-09-01

Applicant: TORAY INDUSTRIES, INC.

Inventor： Nobuyuki ARAI ,  Norimitsu NATSUME ,  Kenichi YOSHIOKA ,  Junko KAWASAKI ,  Hiroshi TAKEZAKI

IPC: D06M15/53 ,  B32B5/26 ,  D06M11/83 ,  B32B5/02 ,  D06M15/63 ,  D06M11/74

CPC classification number: C08J5/24 ,  B32B5/022 ,  B32B5/22 ,  B32B5/26 ,  B32B27/12 ,  B32B2255/02 ,  B32B2255/26 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/106 ,  B32B2264/0214 ,  B32B2264/105 ,  B32B2264/108 ,  B32B2305/076 ,  B32B2305/08 ,  B32B2307/202 ,  B32B2307/558 ,  B32B2603/00 ,  B32B2605/18 ,  C08J2363/00 ,  C08J2477/00 ,  C08L63/00 ,  C08L2201/02 ,  D06M11/74 ,  D06M11/83 ,  D06M15/53 ,  D06M15/63 ,  D06M2101/40 ,  D06M2200/00 ,  Y10T428/24 ,  Y10T428/24994 ,  Y10T428/249942 ,  Y10T428/249948 ,  Y10T428/249949 ,  Y10T428/24995 ,  Y10T428/25 ,  Y10T428/254 ,  Y10T442/2418 ,  Y10T442/2426 ,  Y10T442/645

Abstract: A prepreg containing a carbon fiber [A] and a thermosetting resin [B], and in addition, satisfying at least one of the following (1) and (2). (1) a thermoplastic resin particle or fiber [C] and a conductive particle or fiber [D] are contained, and weight ratio expressed by [compounding amount of [C] (parts by weight)]/[compounding amount of [D] (parts by weight)] is 1 to 1000. (2) a conductive particle or fiber of which thermoplastic resin nucleus or core is coated with a conductive substance [E] is contained.

Abstract translation: 包含碳纤维[A]和热固性树脂[B]的预浸料，另外满足以下（1）和（2）中的至少一个。 （1）包含热塑性树脂颗粒或纤维[C]和导电颗粒或纤维[D]，由[C]（重量份）的配混量/ [[D]的配混量] （重量份）]为1〜1000。（2）含有导电性物质[E]的热塑性树脂核或核的导电性粒子或纤维。

公开(公告)号：US20230037333A1

公开(公告)日：2023-02-09

申请号：US17772574

申请日：2020-11-05

Applicant: TORAY INDUSTRIES, INC.

Inventor： Koji FURUKAWA ,  Kentaro SANO ,  Junko KAWASAKI

IPC: C08G59/24 ,  C08G59/50 ,  C08K5/053 ,  C08K5/07 ,  C08K5/20 ,  C08J5/24 ,  C08J5/04

Abstract: An object of the present invention is to provide an epoxy resin composition that can be preferably used for prepreg and fiber reinforced composite material applications and is excellent in elastic modulus, strength, and pot life. The present invention is the epoxy resin composition including the following components [A] to [C] and satisfying the following conditions (1) to (4):
[A]: epoxy resin [B]: aromatic diamine [C]: a compound having a boiling point of 130° C. or more and a molecular weight m of 50 or more and 250 or less, the compound having no epoxy group in the molecule and having substantially no curing ability of an epoxy resin (1): the ratio H/E between the amount by mole, E, of the epoxy group in the component [A] and the amount by mole, H, of active hydrogen in the component [B] is 0.50 or more and 1.30 or less. (2): at least a part of the component [C] satisfies 0.10 or more and 0.60 or less in a ratio m/M of a molecular weight m thereof to a theoretical molecular weight between crosslinking points, M, of a cured product of the epoxy resin composition. (3): the ratio C/E of the amount by mole, E, for epoxy groups of the component [A] to the amount by mole, C, of the component [C] satisfying the condition (2) is 0.01 or more and 0.20 or less; and (4): the viscosity at 70° C. for 2 hours is 5.0 times or less the initial viscosity at 70° C.

公开(公告)号：US20220380561A1

公开(公告)日：2022-12-01

申请号：US17773706

申请日：2020-11-05

Applicant: TORAY INDUSTRIES, INC.

Inventor： Koji FURUKAWA ,  Kentaro SANO ,  Junko KAWASAKI

IPC: C08J5/24 ,  C08G59/50

Abstract: An object of the present invention is to provide an epoxy resin composition that can be preferably used for prepreg and fiber reinforced composite material applications, has high Tg, and is excellent in elastic modulus and strength. The present invention is the epoxy resin composition including the following components [A] to [C] and satisfying the following conditions (1) to (2): [A]: epoxy resin [B]: polyamine curing agent, and [C]: a compound having a boiling point of 130° C. or more and a molecular weight m of 50 or more and 250 or less, the compound having no epoxy group in the molecule and having substantially no curing ability of an epoxy resin, (1): at least a part of the component [C] satisfies that the sum of the polar component and the hydrogen bond component in the Hansen solubility parameters is 10.0 or less, (2): the ratio C/E of the amount by mole, E, for epoxy groups of the component [A] to the amount by mole, C, of the component [C] satisfying the condition (1) is 0.01 or more and 0.20 or less.