公开(公告)号：US10908500B2

公开(公告)日：2021-02-02

申请号：US16063893

申请日：2017-01-10

申请人： TORAY INDUSTRIES, INC.

发明人： Yu Shoji ,  Yuki Masuda ,  Kimio Isobe ,  Ryoji Okuda

IPC分类号： G03F7/023 ,  C08G73/22 ,  G03F7/40 ,  G03F7/085 ,  G03F7/075 ,  G03F7/022

摘要： Provided is a cured film having high chemical resistance, high elongation, and high adhesion to metal copper. A cured film formed by curing a photosensitive resin composition containing a polybenzoxazole precursor, in which a rate at which the polybenzoxazole precursor is cyclized into polybenzoxazole is not less than 10% and not more than 60%.

公开(公告)号：US10948821B2

公开(公告)日：2021-03-16

申请号：US16084496

申请日：2017-03-24

申请人： TORAY INDUSTRIES, INC.

发明人： Yohei Kiuchi ,  Yu Shoji ,  Kimio Isobe

IPC分类号： G03F7/037 ,  G03F7/027 ,  C09D183/08 ,  C09D183/04 ,  G03F7/075 ,  C08L83/08 ,  C08G77/26 ,  C08G77/20 ,  C08L65/00

摘要： A photosensitive resin composition includes an alkali-soluble resin (A) containing at least one selected from polyimides and precursors thereof, and polybenzoxazoles and precursors thereof, and a (meth)acryl group-containing compound (B) which constitutes a polyfunctional (meth)acryl group-containing silane condensate (B1) having a weight average molecular weight of 1,000 to 20,000, and having a plurality of structures represented by Formula (1), which is a condensate of compounds having a structure represented by Formula (1) and at least one structure selected from Formula (2-1), Formula (2-2), and Formula (2-3).

公开(公告)号：US11174350B2

公开(公告)日：2021-11-16

申请号：US15765596

申请日：2016-09-21

申请人： TORAY INDUSTRIES, INC.

发明人： Yuki Masuda ,  Yu Shoji ,  Kimio Isobe ,  Ryoji Okuda

IPC分类号： C08G73/10 ,  G03F7/20 ,  C08L79/08 ,  C08K5/13 ,  G03F7/075 ,  H01L51/05

摘要： A resin and a photosensitive resin composition whereby a cured film exhibiting high extensibility, reduced stress, and high adhesion to metals can be obtained are provided. A resin (A) including a polyamide structure and at least any structure of an imide precursor structure and an imide structure, wherein at least any of the structures of the resin (A) include a diamine residue having an aliphatic group.

公开(公告)号：US10545406B2

公开(公告)日：2020-01-28

申请号：US15744676

申请日：2016-09-20

申请人： TORAY INDUSTRIES, INC.

发明人： Yu Shoji ,  Yuki Masuda ,  Kimio Isobe ,  Ryoji Okuda

IPC分类号： H01L23/48 ,  G03F7/038 ,  C08G69/02 ,  G03F7/40 ,  G03F7/20 ,  C08G69/40 ,  G03F7/16 ,  G03F7/26 ,  H01L23/00

摘要： Provided is a cured film of high elongation, low stress, and high adhesion to metal copper. The cured film is formed by curing a photosensitive resin composition, wherein the photosensitive resin comprises a polyhydroxyamide, and wherein the rate of ring-closure of the polyhydroxyamide in the cured film is not more than 10%.