公开(公告)号：US20210090913A1

公开(公告)日：2021-03-25

申请号：US16950389

申请日：2020-11-17

Applicant: TOSHIBA MEMORY CORPORATION

Inventor： Yasuhito YOSHIMIZU ,  Yuya AKEBOSHI ,  Fuyuma ITO ,  Hakuba KITAGAWA

IPC: H01L21/67 ,  H01L21/3213 ,  H01L21/311

Abstract: According to an embodiment, a substrate treatment apparatus includes a hair member including a noble metal, and a liquid chemical supply member to supply a liquid chemical. While a tip part of the hair member is contact with a predetermined surface of a metal, the liquid chemical is supplied onto the surface of the metal, and the metal is removed with etching.

公开(公告)号：US20200185221A1

公开(公告)日：2020-06-11

申请号：US16559518

申请日：2019-09-03

Applicant: TOSHIBA MEMORY CORPORATION

Inventor： Yasuhito YOSHIMIZU ,  Fuyuma ITO ,  Hakuba KITAGAWA ,  Yohei YAMAMOTO ,  Hisashi OKUCHI ,  Yuji YAMADA

IPC: H01L21/02 ,  B08B3/08 ,  H01L21/67

Abstract: According to an embodiment, the substrate treatment device includes a dilutor configured to dilute a first liquid containing a metal ion and exhibiting acidity. The device further includes a pH changer configured to change a pH of the first liquid before or after being diluted by the dilutor. The device further includes a substrate conditioner configured to treat the substrate using the first liquid, which is diluted by the dilutor and with the pH changed by the pH changer.

公开(公告)号：US20200211864A1

公开(公告)日：2020-07-02

申请号：US16556014

申请日：2019-08-29

Applicant: TOSHIBA MEMORY CORPORATION

Inventor： Yasuhito YOSHIMIZU ,  Hakuba KITAGAWA ,  Takaumi MORITA

IPC: H01L21/67 ,  H01L21/445 ,  H01L21/673

Abstract: According to one embodiment, a substrate processing apparatus includes a table configured to place a substrate thereon and to connect the substrate to a positive electrode, an counter electrode located opposite to the table, having a plurality of holes, and connected to a negative electrode, and a holding unit located opposite to the table across the counter electrode and configured to supply a chemical liquid to the counter electrode while holding the counter electrode.

公开(公告)号：US20200066550A1

公开(公告)日：2020-02-27

申请号：US16278757

申请日：2019-02-19

Applicant: TOSHIBA MEMORY CORPORATION

Inventor： Hakuba KITAGAWA ,  Yasuhito YOSHIMIZU ,  Fuyuma ITO ,  Hiroyuki TANIZAKI

IPC: H01L21/67 ,  H01L21/3213

Abstract: In one embodiment, a substrate treatment apparatus includes a supporter configured to support and rotate a substrate, and a liquid supplier configured to supply a liquid to the substrate. The apparatus further includes a wall provided separately from the supporter and at least partially surrounding the supporter, and a detector provided between the supporter and the wall and configured to detect a change in the liquid.

公开(公告)号：US20180265989A1

公开(公告)日：2018-09-20

申请号：US15700694

申请日：2017-09-11

Applicant: TOSHIBA MEMORY CORPORATION

Inventor： Yasuhito YOSHIMIZU ,  Yuya AKEBOSHI ,  Fuyuma ITO ,  Hakuba KITAGAWA

IPC: C23F1/32 ,  C23F1/08

CPC classification number: C23F1/32 ,  C23F1/02 ,  C23F1/08 ,  C23F1/38 ,  C23F1/40

Abstract: According to an embodiment, a substrate treatment apparatus includes a noble metal-containing member having a concave-convex surface including a noble metal, and a liquid chemical supply member to supply a liquid chemical. While convex portions of the concave-convex surface are contact with a predetermined surface of a metal, the liquid chemical is supplied onto the surface of the metal to remove the metal with etching.