公开(公告)号：US20240153973A1

公开(公告)日：2024-05-09

申请号：US17993527

申请日：2022-11-23

Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.

Inventor： KUEI-FENG PENG

IPC: H01L27/146 ,  H01L23/00 ,  H01L23/367 ,  H01L23/498

CPC classification number: H01L27/14618 ,  H01L23/367 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265

Abstract: A packaging module includes a circuit board, a chip, a radiation fin, and a light conducting member. The chip, the radiation fin, and the light conducting member are arranged on a same surface of the circuit board, the light conducting member and the circuit board enclosing a chamber containing the chip. The radiation fin surrounds the chip and is in contact with the light conducting. The circuit board includes a first through hole extending in a thickness direction of the circuit board and corresponding to the chip. In the packaging module, heat is transferred to the outside along two different directions, via the first through hole and via the radiation fin, improving heat dissipation efficiency.

公开(公告)号：US20240224419A1

公开(公告)日：2024-07-04

申请号：US18236889

申请日：2023-08-22

Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.

Inventor： KUEI-FENG PENG

IPC: H05K1/02 ,  H05K1/14 ,  H05K3/12 ,  H05K3/32 ,  H05K3/34

CPC classification number: H05K1/028 ,  H05K1/147 ,  H05K3/1283 ,  H05K3/323 ,  H05K3/3489 ,  H05K2201/0212 ,  H05K2201/10083 ,  H05K2201/10121

Abstract: A camera module packaging structure with simplified process, and an electronic device carrying it, includes a FPC, an ACF, an embedded printed circuit board, a no-flow underfill, and a chip-scale package camera module. The present application uses a no-flow underfill, which can omit steps of applying the flux and removing the flux, thus the process is simplified. By setting the ACF in the present application, a stable structure having vertical conduction characteristic and horizontal insulation characteristic is formed between the chip-scale packaged camera module and the flexible circuit board.

公开(公告)号：US20240089571A1

公开(公告)日：2024-03-14

申请号：US18076295

申请日：2022-12-06

Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.

Inventor： KUEI-FENG PENG

IPC: H04N23/54 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H05K3/32 ,  H05K3/40

CPC classification number: H04N23/54 ,  H05K1/115 ,  H05K1/147 ,  H05K1/18 ,  H05K3/32 ,  H05K3/4038 ,  H05K2201/10151 ,  H05K2201/10734

Abstract: A camera module of reduced overall height includes multiple electronic components embedded in a PCB, multiple first holes defined on the PCB, each first hole enables a connection with one electronic component. A sensor chip is attached to the PCB by anisotropic conductive adhesive, multiple conductive balls on the sensor chip enter the multiple first holes and connect with the multiple electronic components. The embedded electronic components and the PCB form an integrated and single structure, avoiding multiple installations of electronic components one by one into the board and simplifying the manufacturing process of the camera module. The multiple conductive balls sinking into the multiple first holes reduce overall size of the camera module. A method for manufacturing the camera is also disclosed.