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公开(公告)号：US11763959B2
公开(公告)日：2023-09-19
申请号：US17289023
申请日：2019-10-23
Applicant: TSE CO., LTD.
Inventor： Chang Su Oh , Bo Hyun Kim , Sung Ho Yoon
CPC classification number: H01B5/00 , H05K1/115 , H05K3/10 , H05K1/092 , H05K3/0014 , H05K2201/0242 , H05K2201/0263 , H05K2203/104
Abstract: The purpose of the present disclosure is to provide electro-conductive particles and a signal-transmitting connector having same, wherein the electro-conductive particles are improved to prevent the phenomenon of irregular scrub between the electro-conductive particles and to have improved signal delivery characteristics. Electro-conductive particles according to the present disclosure are provided on a signal-transmitting connector having multiple electroconductive portions supported by an insulating portion made of an elastic insulating material to be spaced apart from each other such that the signal-transmitting connector can be connected to an electronic component and can transmit electric signals.
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公开(公告)号：US10718809B1
公开(公告)日：2020-07-21
申请号：US16633375
申请日：2018-07-23
Applicant: TSE CO., LTD
Inventor： Bo Hyun Kim , Yoon Hyeong Lee
Abstract: The present invention relates to a history management pad of a semiconductor test socket, a manufacturing method thereof, and a semiconductor test device including the history management pad. According to the present invention, a history management pad of a semiconductor test socket is provided, the history management pad which is installed on one side of the periphery of a socket frame of a semiconductor test socket composed of a socket body and the socket frame, is characterized by including: an insulating molded film member provided with a plurality of electrode units in the thickness direction; a guide film means which is formed above the molded film member and guides and supports the mounting of a tracking chip to the molded film member; the tracking chip which is conductively connected to an upper end part of the electrode units of the molded film member; and a fixing means for fixing the tracking chip to the guide film means, wherein electrode unit lower end parts protruding from socket frame holes formed at positions corresponding to the electrode units are connected to a pad of a socket printed circuit board.
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公开(公告)号：US20210293880A1
公开(公告)日：2021-09-23
申请号：US17204186
申请日：2021-03-17
Applicant: TSE CO., LTD.
Inventor： Chang Su Oh , Bo Hyun Kim
Abstract: The present invention relates to a test socket configured to electrically connect a tester generating a test signal and a device under inspection to each other includes a nonelastic electrically-conductive housing having a plurality of housing holes passing therethrough in a thickness direction, an insulating coating layer applied on at least an upper surface of the nonelastic electrically-conductive housing and a circumference of each of the plurality of housing hole, and an electrically-conductive part formed to have a configuration in which a plurality of electrically-conductive particles are contained in an elastic insulating material, disposed in the housing hole such that a lower end portion thereof may be connected to a signal electrode of the tester placed below the nonelastic electrically-conductive housing.
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公开(公告)号：US20220005626A1
公开(公告)日：2022-01-06
申请号：US17289023
申请日：2019-10-23
Applicant: TSE CO., LTD.
Inventor： Chang Su Oh , Bo Hyun Kim , Sung Ho Yoon
Abstract: The purpose of the present disclosure is to provide electro-conductive particles and a signal-transmitting connector having same, wherein the electro-conductive particles are improved to prevent the phenomenon of irregular scrub between the electro-conductive particles and to have improved signal delivery characteristics. Electro-conductive particles according to the present disclosure are provided on a signal-transmitting connector having multiple electroconductive portions supported by an insulating portion made of an elastic insulating material to be spaced apart from each other such that the signal-transmitting connector can be connected to an electronic component and can transmit electric signals.
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Patent Agency Ranking
公开(公告)号：US20210302468A1
公开(公告)日：2021-09-30
申请号：US17210970
申请日：2021-03-24
Applicant: TSE CO., LTD.
Inventor： Chang Su Oh , Bo Hyun Kim
Abstract: The present disclosure discloses a test apparatus for testing a package-on-package (POP) type semiconductor package includes a lower socket mounted to a tester board providing a test signal, and provided with a plurality of socket pins connected to a lower terminal of a lower package to electrically connect the lower package and the tester board to each other; a pusher to which an upper package is coupled, the pusher having a pusher body which may be moved to approach the lower socket or to be moved away from the lower socket; and an upper socket coupled to the pusher body, and provided with an insulating pad formed of a nonelastic insulating material and a plurality of electrically-conductive parts supported on the insulating pad, the electrically-conductive part being formed of an elastic insulating material containing a plurality of electrically-conductive particles.
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公开(公告)号：US11609244B2
公开(公告)日：2023-03-21
申请号：US17210970
申请日：2021-03-24
Applicant: TSE CO., LTD.
Inventor： Chang Su Oh , Bo Hyun Kim
Abstract: The present disclosure discloses a test apparatus for testing a package-on-package (POP) type semiconductor package includes a lower socket mounted to a tester board providing a test signal, and provided with a plurality of socket pins connected to a lower terminal of a lower package to electrically connect the lower package and the tester board to each other; a pusher to which an upper package is coupled, the pusher having a pusher body which may be moved to approach the lower socket or to be moved away from the lower socket; and an upper socket coupled to the pusher body, and provided with an insulating pad formed of a nonelastic insulating material and a plurality of electrically-conductive parts supported on the insulating pad, the electrically-conductive part being formed of an elastic insulating material containing a plurality of electrically-conductive particles.
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公开(公告)号：US11233352B2
公开(公告)日：2022-01-25
申请号：US17289343
申请日：2020-01-03
Applicant: TSE CO., LTD.
Inventor： Chang Su Oh , Bo Hyun Kim , Sung Ho Yoon
IPC: H05K1/11 , H01R13/447 , G01R1/067 , G01R31/28
Abstract: The purpose of the present disclosure is to provide a electro-conductive part protecting member for a signal transmitting connector and a manufacturing method therefor, and a signal transmitting connector having same and a manufacturing method therefor, the electro-conductive part protecting member being capable of protecting an electro-conductive part so as to be able to minimize deformation of and damage to the electro-conductive part coming into contact with the terminals of an electronic component such as a semiconductor package, and more specifically, the electro-conductive part protecting members capable of being elastically modified in the longitudinal direction of the electro-conductive parts by having a hollow tube-shaped protection member body encompassing the electro-conductive parts, and a spiral groove to promote elasticity provided along the circumference of the protection member body so as to pass through the inside and the outside of the protection member body.
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公开(公告)号：US11199577B2
公开(公告)日：2021-12-14
申请号：US17204186
申请日：2021-03-17
Applicant: TSE CO., LTD.
Inventor： Chang Su Oh , Bo Hyun Kim
Abstract: The present invention relates to a test socket configured to electrically connect a tester generating a test signal and a device under inspection to each other includes a nonelastic electrically-conductive housing having a plurality of housing holes passing therethrough in a thickness direction, an insulating coating layer applied on at least an upper surface of the nonelastic electrically-conductive housing and a circumference of each of the plurality of housing hole, and an electrically-conductive part formed to have a configuration in which a plurality of electrically-conductive particles are contained in an elastic insulating material, disposed in the housing hole such that a lower end portion thereof may be connected to a signal electrode of the tester placed below the nonelastic electrically-conductive housing.
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公开(公告)号：US20210313730A1
公开(公告)日：2021-10-07
申请号：US17289343
申请日：2020-01-03
Applicant: TSE CO., LTD.
Inventor： Chang Su Oh , Bo Hyun Kim , Sung Ho Yoon
IPC: H01R13/447 , G01R31/28 , G01R1/067
Abstract: The purpose of the present disclosure is to provide a conductor part protecting member for a signal transmitting connector and a manufacturing method therefor, and a signal transmitting connector having same and a manufacturing method therefor, the conductor part protecting member being capable of protecting an electro-conductive part so as to be able to minimize deformation of and damage to the electro-conductive part coming into contact with the terminals of an electronic component such as a semiconductor package.
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