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公开(公告)号：US20180164449A1
公开(公告)日：2018-06-14
申请号：US15719571
申请日：2017-09-29
发明人： Yuanjing Li , Ziran Zhao , Jianmin Li , Yulan Li , Weibin Zhu , Xiang Zou , Qingjun Zhang , Chunguang Zong , Xiaolin Zhao , Shuwei Li , Junxiao Wang
IPC分类号： G01T1/24
摘要： This disclosure provides a radiation detection apparatus and a method, a data processing method and a processor, which relates to the field of radiation detection technology. Wherein, the radiation detection apparatus of this disclosure comprises: a radiation detector which generates an electrical signal by interacting with X-rays; an Analog-to-Digital Converter (ADC) which is coupled to the radiation detector and transmits the electrical signal to a waveform data; and a data processor which receives the waveform data from the ADC, determines the number of single photon signals according to the waveform data, and determines whether an integral signal and/or a count signal of the waveform data will be used for imaging according to the number of the single photon signals.
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公开(公告)号：US10338236B2
公开(公告)日：2019-07-02
申请号：US15719571
申请日：2017-09-29
发明人： Yuanjing Li , Ziran Zhao , Jianmin Li , Yulan Li , Weibin Zhu , Xiang Zou , Qingjun Zhang , Chunguang Zong , Xiaolin Zhao , Shuwei Li , Junxiao Wang
摘要： This disclosure provides a radiation detection apparatus and a method, a data processing method and a processor, which relates to the field of radiation detection technology. Wherein, the radiation detection apparatus of this disclosure comprises: a radiation detector which generates an electrical signal by interacting with X-rays; an Analog-to-Digital Converter (ADC) which is coupled to the radiation detector and transmits the electrical signal to a waveform data; and a data processor which receives the waveform data from the ADC, determines the number of single photon signals according to the waveform data, and determines whether an integral signal and/or a count signal of the waveform data will be used for imaging according to the number of the single photon signals.
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公开(公告)号：US10935691B2
公开(公告)日：2021-03-02
申请号：US16234625
申请日：2018-12-28
发明人： Kejun Kang , Jianmin Li , Xiulin Ni , Yulan Li , Yuanjing Li , Zhiqiang Chen , Li Zhang , Liang Li , Xiang Zou , Weifeng Yu , Hejun Zhou , Chunguang Zong
IPC分类号： G01V5/00 , G01N23/046
摘要： The present disclosure relates to the technical field of CT detection, and in particular to a CT inspection system and a CT imaging method. The CT inspection system provided by the present disclosure comprises a radioactive source device, a detection device, a rotation monitoring device and an imaging device, wherein the detection device obtains detection data at a frequency that is N times a beam emitting frequency of the radioactive source device; the rotation monitoring device detects a rotation angle of the detection device and transmits a signal to the imaging device each time the detection device rotates by a preset angle; the imaging device determines a rotational position of the detection device each time the radioactive source device emits a beam according to the signal transmitted by the rotation monitoring device and the detection data of the detection device.
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公开(公告)号：US20200212251A1
公开(公告)日：2020-07-02
申请号：US16727573
申请日：2019-12-26
发明人： Wenjian Zhang , Qingjun Zhang , Xiang Zou , Yiyan Gong
IPC分类号： H01L31/18 , H01L27/146 , H01L31/0236
摘要： Embodiments of the present disclosure disclose a backside processing method for a back-illuminated photoelectric device. The backside processing method includes: mechanically thinning the back-illuminated photoelectric device such that a thickness of the back-illuminated photoelectric device reaches a first desired thickness; and chemically thinning and chemically polishing the back side of the mechanically thinned back-illuminated photoelectric device by using a nitric acid solution and a hydrofluoric acid solution such that the thickness of the mechanically thinned back-illuminated photoelectric device reaches a second desired thickness and a surface roughness of the back side of the back-illuminated photoelectric device reaches a desired surface roughness.
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公开(公告)号：US10408804B2
公开(公告)日：2019-09-10
申请号：US15276595
申请日：2016-09-26
发明人： Qingjun Zhang , Yuanjing Li , Zhiqiang Chen , Ziran Zhao , Weiping Zhu , Yaohong Liu , Qiufeng Ma , Xiang Zou , Huishao He , Jianping Chang , Song Liang
IPC分类号： G01N30/72 , G01N23/085 , G01B15/00 , G01N30/84
摘要： A darkroom type security inspection apparatus and a method of performing an inspection using the darkroom type security inspection apparatus. An apparatus includes a housing constituting a closed darkroom, and assemblies disposed inside the housing. The assemblies disposed inside the housing include: a sample collecting unit configured to collect a sample, a conveyor unit, and a X-ray detection unit to detect a position of the objected to be inspected, wherein the X-ray detection unit is configured to determine the position of the objected to be inspected within the sampling assembly so that the object to be inspected together with the conveyor unit is conveyed to an expected position; and a sample processing assembly, wherein the assemblies disposed inside the housing are communicated by fittings or connectors.
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公开(公告)号：US09869775B2
公开(公告)日：2018-01-16
申请号：US14983411
申请日：2015-12-29
发明人： Yanchun Wang , Qingjun Zhang , Yuanjing Li , Zhiqiang Chen , Ziran Zhao , Yinong Liu , Yaohong Liu , Jianping Chang , Wenjian Zhang , Shuqing Zhao , Xiang Zou , Yongqiang Wang
CPC分类号： G01T1/2018
摘要： A method for processing a ceramic scintillator array, characterized in that, comprising the following steps: (a) forming, in a first direction, a predetermined number of straight first-direction through-cuts which are parallel to each other and spaced from each other on a scintillator substrate by using laser; (b) adequately filling the first-direction through-cuts with an adhesive and solidifying the adhesive; (c) forming, in a second direction. a predetermined number of second direction through-cuts which are parallel to each other at a predetermined interval on the scintillator substrate by using laser, wherein the second direction is perpendicular to the first direction; and (d) adequately filling the second direction through-cuts with the adhesive and solidifying the adhesive bond.
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公开(公告)号：US10510683B2
公开(公告)日：2019-12-17
申请号：US15718919
申请日：2017-09-28
发明人： Wenjian Zhang , Qingjun Zhang , Yuanjing Li , Zhiqiang Chen , Ziran Zhao , Yinong Liu , Yaohong Liu , Xiang Zou , Huishao He , Shuwei Li , Nan Bai
IPC分类号： H01L25/00 , H01L23/00 , H01L31/024 , H01L31/18 , H01L23/15 , H01L23/498 , H01L31/02 , H01L31/0203 , H01L27/146
摘要： The present disclosure proposes a packaging structure for a metallic bonding based opto-electronic device and a manufacturing method thereof. According to the embodiments, the packaging structure for an opto-electronic device may comprise an opto-electronic chip and a packaging base. The opto-electronic chip comprises: a substrate having a first substrate surface and a second substrate surface opposite to each other; an opto-electronic device formed on the substrate; and electrodes for the opto-electronic device which are formed on the first substrate surface. The packaging base has a first base surface and a second base surface opposite to each other, and comprises conductive channels extending from the first base surface to the second base surface. The opto-electronic chip is stacked on the packaging base in such a manner that the first substrate surface faces the packaging base, and the electrodes formed on the first substrate surface of the opto-electronic chip are bonded with corresponding conductive channels in the packaging base.
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公开(公告)号：US09983321B2
公开(公告)日：2018-05-29
申请号：US15258209
申请日：2016-09-07
发明人： Qingjun Zhang , Yuanjing Li , Zhiqiang Chen , Ziran Zhao , Yinong Liu , Yaohong Liu , Xiang Zou , Huishao He , Shuwei Li , Jianping Chang , Wenjian Zhang
CPC分类号： G01T7/00 , G01J1/0271 , G01J2001/0276
摘要： The invention discloses a safety inspection detector and a goods safety inspection system. The safety inspection detector at least comprises a circuit board, a first housing, a second housing, a detection module and a connecting interface. The detection module and the connecting interface are mounted on the circuit board. The first housing is pressed and connected to a first surface of the circuit board, and the second housing is pressed and connected to a second surface of the circuit board. The first housing and the second housing can hermetically wrap the detection module and electronic devices on the circuit board, but bypass the connecting interface to realize leading-out and connection with related interconnected cables by utilizing the connecting interface. The housings can be used for sealing and protecting sensitive electronic devices in the detector, thus being moisture proof and preventing interference.
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公开(公告)号：US10775320B2
公开(公告)日：2020-09-15
申请号：US16403555
申请日：2019-05-05
发明人： Shuwei Li , Wenjian Zhang , Xiang Zou , Bozhen Zhao , Qingjun Zhang , Huishao He , Yongqiang Wang , Yanchun Wang
摘要： The present disclosure discloses an afterglow detection device and an afterglow detection method. The afterglow detection device comprises: an X-ray tube for emitting an X-ray beam; a first reading circuit for receiving a first detected signal from a to-be-detected detector to form and output a first measurement signal according to the first detected signal, the to-be-detected detector being connected to the first reading circuit and disposed on a beam-out side of the X-ray tube to receive radiation of the X-ray beam and outputting the first detected signal to the first reading circuit at the time of detection; a residual ray detector disposed on a beam-out side of the X-ray tube; a second reading circuit connected to the residual ray detector for receiving a second detected signal from the residual ray detector to form and output a second measurement signal according to the second detected signal.
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公开(公告)号：US20180180746A1
公开(公告)日：2018-06-28
申请号：US15853961
申请日：2017-12-26
发明人： Shuwei Li , Qingjun Zhang , Ziran Zhao , Junxiao Wang , Xiang Zou , Bozhen Zhao , Lifeng Sun , Yongqiang Wang
IPC分类号： G01T1/20
CPC分类号： G01T1/2018 , G01V5/0016
摘要： The present application relates to a dual energy detector and a radiation inspection system. The dual energy detector comprises: a detector module mount and a plurality of detector modules. The detector module includes a higher energy detector array and a lower energy detector array, which are juxtaposedly provided on said detector module mount to be independently irradiated. The present application may simplify the arrangement of the photodiodes and printed circuit boards to which the higher and lower energy detector arrays are connected, such that necessary thickness dimension of the detector module mount is reduced, thereby facilitating the installation and use of the dual energy detector of the present application. On the other hand, the radiation beam in the present application may be independently irradiated to the higher and lower energy detector arrays juxtaposed to each other, which reduces to certain extent the mutual restriction during selection of the higher and lower energy detector arrays.
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