摘要:
The present invention discloses an X-ray beam intensity monitoring device and an X-ray inspection system. The X-ray beam intensity monitoring device comprises an intensity detecting module and a data processing module, wherein the intensity detecting module is adopted to be irradiated by the X-ray beam and send a detecting signal, the data processing module is coupled with the intensity detecting module to receive the detecting signal and output an X-ray beam intensity monitoring signal, wherein the X-ray beam intensity monitoring signal includes a dose monitoring signal for the X-ray beam and a brightness correction signal for correcting signal values of the X-ray beam. The X-ray beam intensity monitoring device can simultaneously perform dose monitoring and brightness monitoring, thereby improving the service efficiency of the X-ray beam intensity monitoring device. Moreover, the monitoring result of the X-ray beam intensity can be more accurate and reliable.
摘要:
This disclosure provides a radiation detection apparatus and a method, a data processing method and a processor, which relates to the field of radiation detection technology. Wherein, the radiation detection apparatus of this disclosure comprises: a radiation detector which generates an electrical signal by interacting with X-rays; an Analog-to-Digital Converter (ADC) which is coupled to the radiation detector and transmits the electrical signal to a waveform data; and a data processor which receives the waveform data from the ADC, determines the number of single photon signals according to the waveform data, and determines whether an integral signal and/or a count signal of the waveform data will be used for imaging according to the number of the single photon signals.
摘要:
Methods and apparatuses for measuring an effective atomic number of an object are disclosed. The apparatus includes: a ray source configured to product a first X-ray beam having a first energy and a second X-ray beam having a second energy; a Cherenkov detector configured to receive the first X-ray beam and the second X-ray beam that pass through an object under detection, and to generate a first detection value and a second detection value; and a data processing device configured to obtain an effective atomic number of the object based on the first detection value and the second detection value. The Cherenkov detector can eliminate disturbance of X-rays below certain energy threshold with respect to the object identification, and thus accuracy can be improved for object identification.
摘要:
This disclosure provides a radiation detection apparatus and a method, a data processing method and a processor, which relates to the field of radiation detection technology. Wherein, the radiation detection apparatus of this disclosure comprises: a radiation detector which generates an electrical signal by interacting with X-rays; an Analog-to-Digital Converter (ADC) which is coupled to the radiation detector and transmits the electrical signal to a waveform data; and a data processor which receives the waveform data from the ADC, determines the number of single photon signals according to the waveform data, and determines whether an integral signal and/or a count signal of the waveform data will be used for imaging according to the number of the single photon signals.
摘要:
The present disclosure proposes a packaging structure for a metallic bonding based opto-electronic device and a manufacturing method thereof. According to the embodiments, the packaging structure for an opto-electronic device may comprise an opto-electronic chip and a packaging base. The opto-electronic chip comprises: a substrate having a first substrate surface and a second substrate surface opposite to each other; an opto-electronic device formed on the substrate; and electrodes for the opto-electronic device which are formed on the first substrate surface. The packaging base has a first base surface and a second base surface opposite to each other, and comprises conductive channels extending from the first base surface to the second base surface. The opto-electronic chip is stacked on the packaging base in such a manner that the first substrate surface faces the packaging base, and the electrodes formed on the first substrate surface of the opto-electronic chip are bonded with corresponding conductive channels in the packaging base.
摘要:
The invention discloses a safety inspection detector and a goods safety inspection system. The safety inspection detector at least comprises a circuit board, a first housing, a second housing, a detection module and a connecting interface. The detection module and the connecting interface are mounted on the circuit board. The first housing is pressed and connected to a first surface of the circuit board, and the second housing is pressed and connected to a second surface of the circuit board. The first housing and the second housing can hermetically wrap the detection module and electronic devices on the circuit board, but bypass the connecting interface to realize leading-out and connection with related interconnected cables by utilizing the connecting interface. The housings can be used for sealing and protecting sensitive electronic devices in the detector, thus being moisture proof and preventing interference.
摘要:
The present disclosure discloses an afterglow detection device and an afterglow detection method. The afterglow detection device comprises: an X-ray tube for emitting an X-ray beam; a first reading circuit for receiving a first detected signal from a to-be-detected detector to form and output a first measurement signal according to the first detected signal, the to-be-detected detector being connected to the first reading circuit and disposed on a beam-out side of the X-ray tube to receive radiation of the X-ray beam and outputting the first detected signal to the first reading circuit at the time of detection; a residual ray detector disposed on a beam-out side of the X-ray tube; a second reading circuit connected to the residual ray detector for receiving a second detected signal from the residual ray detector to form and output a second measurement signal according to the second detected signal.
摘要:
The present application relates to a dual energy detector and a radiation inspection system. The dual energy detector comprises: a detector module mount and a plurality of detector modules. The detector module includes a higher energy detector array and a lower energy detector array, which are juxtaposedly provided on said detector module mount to be independently irradiated. The present application may simplify the arrangement of the photodiodes and printed circuit boards to which the higher and lower energy detector arrays are connected, such that necessary thickness dimension of the detector module mount is reduced, thereby facilitating the installation and use of the dual energy detector of the present application. On the other hand, the radiation beam in the present application may be independently irradiated to the higher and lower energy detector arrays juxtaposed to each other, which reduces to certain extent the mutual restriction during selection of the higher and lower energy detector arrays.
摘要:
The present application relates to a dual energy detector and a radiation inspection system. The dual energy detector comprises: a detector module mount and a plurality of detector modules. The detector module includes a higher energy detector array and a lower energy detector array, which are juxtaposedly provided on said detector module mount to be independently irradiated. The present application may simplify the arrangement of the photodiodes and printed circuit boards to which the higher and lower energy detector arrays are connected, such that necessary thickness dimension of the detector module mount is reduced, thereby facilitating the installation and use of the dual energy detector of the present application. On the other hand, the radiation beam in the present application may be independently irradiated to the higher and lower energy detector arrays juxtaposed to each other, which reduces to certain extent the mutual restriction during selection of the higher and lower energy detector arrays.
摘要:
A radiation detector assembly and a method of manufacturing the same are provided. The radiation detector assembly includes a base and an outer encapsulation layer. The base includes a scintillator having a light-entering surface and a light-exiting surface on both ends thereof, respectively; a reflection layer provided on the light-entering surface and an outer peripheral surface of the scintillator; a photosensor comprising a photosensitive surface and an encapsulation housing, the photosensitive surface is coupled to the light-exiting surface via an optical adhesive; and an inner encapsulation layer adhered to an outer surface of the reflection layer and hermetically encapsulates a coupling portion where the scintillator and the photosensor connected with each other. The outer encapsulation layer is provided on the outer surface of the base.