公开(公告)号：US20120268086A1

公开(公告)日：2012-10-25

申请号：US13340707

申请日：2011-12-30

申请人： WEI-CHIEH CHOU ,  DUEN-YI HO ,  CHUN-JEN CHEN ,  TSUNG-SHENG HUANG

发明人： WEI-CHIEH CHOU ,  DUEN-YI HO ,  CHUN-JEN CHEN ,  TSUNG-SHENG HUANG

IPC分类号： G05F1/12 ,  H03F3/45

CPC分类号： H02M3/33523 ,  H02M2001/0003

摘要： A power supply device includes a power supply unit and a feedback control unit. The power supply unit is configured for generating an electric potential to be provided to a load. The feedback control unit detects the electric potential and adjusts relevant parameters of the electrical potential to achieve predetermined values. The feedback control unit includes a first feedback circuit and a second feedback circuit electrically connected in series.

摘要翻译： 电源装置包括电源单元和反馈控制单元。 电源单元被配置为产生要提供给负载的电位。 反馈控制单元检测电位并调整电位的相关参数以实现预定值。 反馈控制单元包括串联电连接的第一反馈电路和第二反馈电路。

公开(公告)号：US20110238233A1

公开(公告)日：2011-09-29

申请号：US12774685

申请日：2010-05-05

申请人： TSUNG-SHENG HUANG ,  CHUN-JEN CHEN ,  DUEN-YI HO ,  WEI-CHIEH CHOU

发明人： TSUNG-SHENG HUANG ,  CHUN-JEN CHEN ,  DUEN-YI HO ,  WEI-CHIEH CHOU

IPC分类号： G06F19/00

CPC分类号： G06F17/5063

摘要： A system for optimizing a current overload protection circuit includes an input device, a data storage device, a central processing device, and a display. The central processing device includes a storage module, a control module, and a calculation module. The storage module stores a VI application therein. The control module receives instructions from the input device and selects virtual electronic components of the current overload protection circuit from the data storage device and connection of the selected electronic components. The current overload protection circuit is completed and run in the VI application; electronic components significantly affecting the maximum protection current are labeled. The calculation module calculates normal distribution samples of the current overload protection circuit based on the labeled electronic components. The display shows whether the current overload protection circuit meets a process capability standard.

摘要翻译： 用于优化电流过载保护电路的系统包括输入装置，数据存储装置，中央处理装置和显示器。 中央处理装置包括存储模块，控制模块和计算模块。 存储模块在其中存储VI应用。 控制模块从输入设备接收指令，并从数据存储设备中选择电流过载保护电路的虚拟电子部件，并选择电子部件的连接。 电流过载保护电路在VI应用中完成并运行; 显着影响最大保护电流的电子元件被标记。 计算模块基于标记的电子元件计算电流过载保护电路的正态分布样本。 显示屏显示电流过载保护电路是否符合过程能力标准。

公开(公告)号：US20130284508A1

公开(公告)日：2013-10-31

申请号：US13563856

申请日：2012-08-01

申请人： WEI-CHIEH CHOU ,  CHUN-JEN CHEN ,  DUEN-YI HO ,  TSUNG-SHENG HUANG ,  PO-CHUAN HSIEH ,  CHUN-NENG LIAO

发明人： WEI-CHIEH CHOU ,  CHUN-JEN CHEN ,  DUEN-YI HO ,  TSUNG-SHENG HUANG ,  PO-CHUAN HSIEH ,  CHUN-NENG LIAO

IPC分类号： H05K1/11

CPC分类号： H05K1/0216 ,  H05K2201/09618

摘要： A printed circuit board (PCB) includes a power layer and a signal layer. A signal line is arranged on the signal layer. A power via extends through the power layer and the signal layer, and is electrically connected to the power layer and the signal layer. A number of through holes is defined in the PCB, through the power layer and the signal layer, and arranged between the signal line and the power via. The through holes are insulated from the power via. The inside wall of the power via is made of conductive material.

摘要翻译： 印刷电路板（PCB）包括功率层和信号层。 信号线布置在信号层上。 功率通孔延伸通过功率层和信号层，并且电连接到功率层和信号层。 在PCB中通过功率层和信号层定义了多个通孔，并布置在信号线和电源通孔之间。 通孔与电源通孔绝缘。 电源通孔的内壁由导电材料制成。

公开(公告)号：US20120261175A1

公开(公告)日：2012-10-18

申请号：US13156348

申请日：2011-06-09

申请人： TSUNG-SHENG HUANG ,  CHUN-JEN CHEN ,  DUEN-YI HO ,  WEI-CHIEH CHOU

发明人： TSUNG-SHENG HUANG ,  CHUN-JEN CHEN ,  DUEN-YI HO ,  WEI-CHIEH CHOU

IPC分类号： H05K1/11

CPC分类号： H05K1/0265 ,  H05K1/117 ,  H05K2201/0784 ,  H05K2201/09972

摘要： A printed circuit board includes a first circuit area, a second circuit area, a plurality of connectors, and a connecting terminal. The first circuit area is electrically connected to the second circuit area via the connectors. The connecting terminal is placed on one side of the first circuit area for electrically connecting with a load. An imaginary center line of the connecting terminal is perpendicular to the one side of the printed circuit board. The less a horizontal distance between the center line of connecting terminal and one of the connectors, the larger a vertical distance between the side of the printed circuit board and the one of the connector.

摘要翻译： 印刷电路板包括第一电路区域，第二电路区域，多个连接器以及连接端子。 第一电路区域经由连接器电连接到第二电路区域。 连接端子位于第一电路区域的一侧，用于与负载电连接。 连接端子的假想中心线垂直于印刷电路板的一侧。 连接端子的中心线与其中一个连接器之间的水平距离越小，印刷电路板的侧面和连接器中的一个之间的垂直距离越大。

公开(公告)号：US20120243194A1

公开(公告)日：2012-09-27

申请号：US13087488

申请日：2011-04-15

申请人： TSUNG-SHENG HUANG ,  CHUN-JEN CHEN ,  DUEN-YI HO ,  WEI-CHIEH CHOU

发明人： TSUNG-SHENG HUANG ,  CHUN-JEN CHEN ,  DUEN-YI HO ,  WEI-CHIEH CHOU

IPC分类号： H05K1/18

CPC分类号： H05K7/00 ,  H05K1/0201 ,  H05K1/0265 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/0979

摘要： A printed circuit board includes a top layer and a bottom layer. A power supply and an electronic component are located on the top layer. The power supply is connected to the top layer and the bottom layer through a first via. A number of second vias extends through the top layer and the bottom layer, and is electrically connected to the top layer and the bottom layer. A right-angled triangular void area without vias defined therein is formed on the printed circuit board, between the second vias and the electronic component. The second vias are arranged on a hypotenuse of the void area.

摘要翻译： 印刷电路板包括顶层和底层。 电源和电子元件位于顶层。 电源通过第一通孔连接到顶层和底层。 多个第二通孔延伸穿过顶层和底层，并且电连接到顶层和底层。 在印刷电路板上，在第二通孔和电子部件之间形成没有限定在其中的通孔的直角三角形空隙区域。 第二个通孔布置在空隙区域的斜边上。

公开(公告)号：US20130007690A1

公开(公告)日：2013-01-03

申请号：US13441849

申请日：2012-04-07

申请人： TSUNG-SHENG HUANG ,  CHUN-JEN CHEN ,  DUEN-YI HO ,  WEI-CHIEH CHOU ,  SHIN-TING YEN

发明人： TSUNG-SHENG HUANG ,  CHUN-JEN CHEN ,  DUEN-YI HO ,  WEI-CHIEH CHOU ,  SHIN-TING YEN

IPC分类号： G06F17/50

CPC分类号： G06F17/5036 ,  G06F2217/78

摘要： An electronic device reads a layout file of a printed circuit board (PCB) to be manufactured from a storage device, obtains length information and section area information of copper cladding distributed on power source areas and ground trace areas in each of one or more layers of the PCB to be manufactured by analyzing the layout file, and calculates power loss in each of the one or more layers according to the length information, the section area information, a resistance value of the copper cladding, and preset parameters of a power supply module and an integrated circuit (IC) load to be located on the PCB. In response to a determination that the power loss in the layer exceeds a preset range, the electronic device indicates the locations of the power source areas and the ground trace areas of a layer in the PCB layout file which need to be redesigned.

摘要翻译： 电子设备读取要从存储装置制造的印刷电路板（PCB）的布局文件，获得在一个或多个层中的每一个中的电源区域和地面迹线区域上分布的铜包层的长度信息和截面面积信息 通过分析布局文件来制造PCB，并且根据长度信息，截面面积信息，铜包层的电阻值和电源模块的预设参数来计算一个或多个层中的每一个中的功率损耗 以及位于PCB上的集成电路（IC）负载。 响应于层中的功率损耗超过预设范围的确定，电子设备指示需要重新设计的PCB布局文件中的层的电源区域和地面迹线区域的位置。

公开(公告)号：US20120292090A1

公开(公告)日：2012-11-22

申请号：US13166790

申请日：2011-06-22

申请人： TSUNG-SHENG HUANG ,  CHUN-JEN CHEN ,  DUEN-YI HO ,  WEI-CHIEH CHOU

发明人： TSUNG-SHENG HUANG ,  CHUN-JEN CHEN ,  DUEN-YI HO ,  WEI-CHIEH CHOU

IPC分类号： H05K1/11

CPC分类号： H05K1/0265 ,  H05K1/11 ,  H05K2201/09663 ,  H05K2201/09845

摘要： A printed circuit board (PCB) comprising a first circuit area, a second circuit area, a plurality of connecting elements, and a plurality of connecting terminals placed on the first circuit area, wherein the first circuit area are electrically connected to the second circuit area through the plurality of connecting elements, the plurality of connecting elements are arranged in sequence to extend toward the plurality of connecting terminals, to form shortest current paths from the second circuit area via corresponding one of the connecting elements to the connecting terminals, respectively, and each shortest current path between the corresponding one of the connecting elements and the corresponding one of the connecting terminals is uncoated with conductive material.

摘要翻译： 一种印刷电路板（PCB），包括第一电路区域，第二电路区域，多个连接元件和放置在第一电路区域上的多个连接端子，其中第一电路区域电连接到第二电路区域 通过多个连接元件，多个连接元件依次布置成朝向多个连接端子延伸，以形成从第二电路区域经由对应的一个连接元件到连接端子的最短电流路径，以及 连接元件与对应的一个连接端子之间的每个最短电流路径都不用导电材料涂覆。

公开(公告)号：US20110093831A1

公开(公告)日：2011-04-21

申请号：US12790857

申请日：2010-05-31

申请人： TSUNG-SHENG HUANG ,  CHUN-JEN CHEN ,  DUEN-YI HO ,  WEI-CHIEH CHOU ,  HSIEN-CHUAN LIANG ,  SHOU-KUO HSU

发明人： TSUNG-SHENG HUANG ,  CHUN-JEN CHEN ,  DUEN-YI HO ,  WEI-CHIEH CHOU ,  HSIEN-CHUAN LIANG ,  SHOU-KUO HSU

IPC分类号： G06F17/50

CPC分类号： G06F17/5036

摘要： A system and method that can analyze a temperature rise of a printed circuit board (PCB). The system and method receives attribute parameters of the PCB from an input device, and generates a temperature rise formula according to the received attribute parameters. Additionally, the system and method calculates a temperature rise of a local area surrounding each component on the PCB according to the temperature rise formula.

摘要翻译： 可以分析印刷电路板（PCB）的温度升高的系统和方法。 该系统和方法从输入装置接收PCB的属性参数，并根据接收的属性参数生成温升公式。 另外，该系统和方法根据温升公式计算PCB上每个部件周围的局部区域的温度上升。

公开(公告)号：US20120241207A1

公开(公告)日：2012-09-27

申请号：US13097104

申请日：2011-04-29

申请人： TSUNG-SHENG HUANG ,  CHUN-JEN CHEN ,  DUEN-YI HO ,  WEI-CHIEH CHOU

发明人： TSUNG-SHENG HUANG ,  CHUN-JEN CHEN ,  DUEN-YI HO ,  WEI-CHIEH CHOU

IPC分类号： H05K1/11

CPC分类号： H05K1/025 ,  H05K1/0265 ,  H05K3/429 ,  H05K2201/0979

摘要： A printed circuit board (PCB) includes first to fourth layers. A power supply is arranged on the first layer. An electronic component is arranged on the fourth layer. A first via and a second via extend through the PCB and are electrically connected to the electronic component. The PCB further includes third to seventh vias. A length of a transmission path of the current flows from the power supply to electronic component through the third via and the seventh via is almost the same as a length of a transmission path of the current flows from the power supply to the electronic component through the fourth to sixth vias.

摘要翻译： 印刷电路板（PCB）包括第一至第四层。 电源设置在第一层上。 电子部件布置在第四层上。 第一通孔和第二通孔延伸穿过PCB并且电连接到电子部件。 PCB还包括第三至第七个通孔。 通过第三通孔和第七通孔从电源流向电子部件的电流的传输路径的长度与电流从电源流向电子部件的传输路径的长度几乎相同 第四至第六个通道。

公开(公告)号：US20110186337A1

公开(公告)日：2011-08-04

申请号：US12730238

申请日：2010-03-24

申请人： WEI-CHIEH CHOU ,  CHUN-JEN CHEN ,  DUEN-YI HO ,  TSUNG-SHENG HUANG

发明人： WEI-CHIEH CHOU ,  CHUN-JEN CHEN ,  DUEN-YI HO ,  TSUNG-SHENG HUANG

IPC分类号： H05K1/09

CPC分类号： H05K1/09

摘要： A printed circuit board (PCB) can prevent electrostatic discharge. A number of vias are embedded in the PCB. A circular insulated member is disposed between each via and the number of vias. Each via includes a layer of metal coated on an inner wall of a corresponding insulated member and a through hole bounded by the corresponding insulated member. An acute angle between two tangents which pass through a point of intersection of two overlapped insulated members is greater than twenty degrees.

摘要翻译： 印刷电路板（PCB）可以防止静电放电。 多个通孔嵌入在PCB中。 在每个通孔和多个通孔之间设置圆形绝缘构件。 每个通孔包括涂覆在相应的绝缘构件的内壁上的金属层和由对应的绝缘构件限定的通孔。 通过两个重叠绝缘部件的交点的两个切线之间的锐角大于二十度。