公开(公告)号：US20170371092A1

公开(公告)日：2017-12-28

申请号：US15672684

申请日：2017-08-09

申请人： TactoTek Oy

发明人： Antti KERANEN ,  Jarmo SAASKI ,  Tuomas HEIKKILA ,  Paavo NISKALA ,  Kari SEVERINKANGAS ,  Sami TORVINEN

IPC分类号： F21V8/00

CPC分类号： G02B6/0065 ,  G02B6/0036 ,  G02B6/0051 ,  G02B6/006 ,  G02B6/0091

摘要： A method for manufacturing an electronic product, including obtaining a flexible, optically substantially transparent or translucent, substrate sheet, printing, by an additive printed electronics process, a plurality of electrical conductors on the substrate sheet, printing or disposing, a plurality of electronic components including optoelectronic light emissive components on the substrate sheet, at least some of the printed conductors being configured to provide electrical current thereto, providing at least one graphic on the substrate sheet, the at least one graphic configured to enable outcoupling of light, and attaching a flexible, optically substantially transparent, lightguide sheet to the substrate sheet to establish a multi-layer structure, the light emitted by the light emissive components being received by the lightguide sheet, propagating therewithin, and then being at least partly emitted to the environment through the at least one graphic.

公开(公告)号：US20210007222A1

公开(公告)日：2021-01-07

申请号：US17026960

申请日：2020-09-21

申请人： TactoTek Oy

发明人： Tero HEIKKINEN ,  Antti KERANEN ,  Mikko HEIKKINEN ,  Jarmo SAASKI

IPC分类号： H05K1/03 ,  F21V3/00 ,  F21V8/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/28 ,  H05K3/46

摘要： Integrated multilayer structure for hosting electronics, including a first substrate—including organic, electrically substantially insulating natural material including and exhibiting a related naturally grown or natural textile based surface texture, said first substrate having a first side facing a predefined front side of the structure, said first side of the first substrate being optionally configured to face a user and/or use environment of the structure or of its host device, and an opposite second side, a plastic layer, optionally including thermoplastic or thermoset plastics, molded onto said second side of the first substrate so as to at least partially cover it, and circuitry provided on the second side of the first substrate, said circuitry being at least partially embedded in the molded material of the plastic layer. Related method of manufacture is presented.

公开(公告)号：US20200068714A1

公开(公告)日：2020-02-27

申请号：US16113388

申请日：2018-08-27

申请人： TactoTek Oy

发明人： Janne ASIKKALA ,  Tomi SIMULA ,  Antti KERANEN

IPC分类号： H05K1/18 ,  H05K3/12 ,  H05K3/00

摘要： A method for manufacturing an integrated multilayer structure includes obtaining a substrate film having first and second sides, providing at least on the first side one or more first functional features, arranging at least one layer upon at least the first side; removing, at least a portion of the substrate film so that space is released in the structure wherein a detachment-enhancing feature provided to the substrate film is configured to facilitate the removal of the at least a portion of the substrate film such that the adjacent remaining film material, if any, the arranged layer and the one or more first functional features are preserved and preferably remain substantially intact; and providing at least one second functional feature into the space released for use so that the at least one second functional feature operatively connects with at least one of the one or more first functional features.

公开(公告)号：US20170094800A1

公开(公告)日：2017-03-30

申请号：US15279080

申请日：2016-09-28

申请人： TactoTek Oy

发明人： Antti KERANEN ,  Mikko HEIKKINEN ,  Pasi RAAPPANA ,  Jarmo SAASKI

IPC分类号： H05K1/18 ,  H05K1/11 ,  H05K1/16 ,  H05K3/46 ,  H05K3/12 ,  H05K3/28 ,  H05K3/00 ,  H05K1/02 ,  H05K3/40

CPC分类号： H05K1/189 ,  H05K1/0269 ,  H05K1/028 ,  H05K1/111 ,  H05K1/118 ,  H05K1/16 ,  H05K3/0044 ,  H05K3/12 ,  H05K3/28 ,  H05K3/4092 ,  H05K3/46 ,  H05K2201/0129 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/09754 ,  H05K2203/0228 ,  H05K2203/1316

摘要： A multilayer structure includes a flexible substrate film having a first side and opposite second side, a number of conductive traces, optionally defining contact pads and/or conductors, printed on the first side for establishing a desired predetermined circuit design, a plastic layer molded onto the first side so as to enclose the circuit between the plastic layer and the first side, and a connector in a form of a flexible flap for providing external electrical connection to the embedded circuit from the second, opposite side, the connector defined by a portion of the substrate film accommodating at least part of one or more of the printed conductive traces and cut partially loose from the surrounding substrate material to establish the flap, whose loose end is bendable away from the molded plastic layer to facilitate establishment of the electrical connection with external element, wire or connector, via the associated gap.

公开(公告)号：US20150308639A1

公开(公告)日：2015-10-29

申请号：US14264273

申请日：2014-04-29

申请人： Tactotek Oy

发明人： Antti KERANEN ,  Jarmo SAASKI ,  Tuomas HEIKKILA ,  Paavo NISKALA ,  Kari SEVERINKANGAS ,  Sami TORVINEN

IPC分类号： F21K99/00 ,  F21V8/00

CPC分类号： G02B6/0065 ,  G02B6/0036 ,  G02B6/0051 ,  G02B6/006 ,  G02B6/0091

摘要： A method for manufacturing an electronic product, includes: obtaining a flexible, optically substantially transparent or translucent, substrate sheet; printing a number of electrical conductors on the substrate sheet in accordance with a predefined schematic; printing or disposing a number of electronic components including optoelectronic light emissive, preferably LED (light-emitting diode), components on the substrate sheet in accordance with the schematic, wherein at least some of the printed conductors are configured to provide electrical current thereto; and attaching a flexible, optically substantially transparent, lightguide sheet to the substrate so as to establish a functional multi-layer structure, where the light emitted by the light emissive components is incoupled to the lightguide, propagates therewithin, and is at least partly outcoupled to the environment through the substrate sheet. Related arrangement and electronic device are presented.

摘要翻译： 一种电子产品的制造方法，包括：获得柔性光学上基本上透明或半透明的基片; 根据预定示意图在基片上印刷多个电导体; 根据示意图，在基板上打印或布置包括光电发光，优选LED（发光二极管））的多个电子部件，其中至少一些印刷导体被配置为向其提供电流; 以及将柔性的光学上基本上透明的光导薄片附接到所述基底上，以便建立功能性多层结构，其中由所述光发射组件发射的光被耦合到所述光导，在其中传播，并且至少部分地耦合到 通过基板的环境。 介绍了相关的布置和电子设备。

公开(公告)号：US20190069408A1

公开(公告)日：2019-02-28

申请号：US15687095

申请日：2017-08-25

申请人： TactoTek Oy

发明人： Antti KERANEN ,  Ronald Haag ,  Mikko HEIKKINEN

IPC分类号： H05K1/18 ,  H05K1/02

摘要： Integrated multilayer structure (100, 200, 300, 400, 500, 600, 700) comprising a first substrate film (102) having a first side (102A), said first substrate film comprising electrically substantially insulating material, said first substrate film preferably being formable and optionally thermoplastic, a plastic layer (112) molded onto said first side of the first substrate film so as to at least partially cover it, and circuitry (104, 106, 204, 205), optionally comprising an electronic, electromechanical and/or electro-optical component, provided on the second side of the first substrate film, said circuitry being functionally connected to the first side of the first substrate film.

公开(公告)号：US20190069403A1

公开(公告)日：2019-02-28

申请号：US15687157

申请日：2017-08-25

申请人： TactoTek Oy

发明人： Tero HEIKKINEN ,  Antti KERANEN ,  Mikko HEIKKINEN ,  Jarmo SAASKI

IPC分类号： H05K1/03 ,  H05K1/18 ,  H05K1/02 ,  H05K3/28 ,  H05K3/46 ,  F21V3/00 ,  F21V8/00

摘要： Integrated multilayer structure (100, 400) for hosting electronics, comprising a first substrate (102) comprising organic, electrically substantially insulating natural material including and exhibiting a related naturally grown or natural textile based surface texture, said first substrate having a first side (102A) facing a predefined front side of the structure, said first side of the first substrate being optionally configured to face a user and/or use environment of the structure or of its host device, and an opposite second side (102B), a plastic layer (112), optionally comprising thermoplastic or thermoset plastics, molded onto said second side of the first substrate so as to at least partially cover it, and circuitry (104, 104B) provided on the second side of the first substrate, said circuitry being at least partially embedded in the molded material of the plastic layer. Related method of manufacture is presented.