公开(公告)号：US12004288B2

公开(公告)日：2024-06-04

申请号：US17184793

申请日：2021-02-25

Applicant: Teradyne, Inc.

Inventor： Andrew Westwood

IPC: G01R31/00 ,  G01R1/04 ,  G01R31/28 ,  H01P3/08 ,  H05K1/02

CPC classification number: H05K1/0222 ,  G01R1/0433 ,  G01R1/0466 ,  G01R1/0483 ,  G01R31/2886 ,  H01P3/08 ,  H05K1/0251 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/14 ,  H05K2201/09609 ,  H05K2201/09754 ,  H05K2201/09809

Abstract: An example printed circuit board (PCB) includes a substrate having layers of a dielectric material, where the layers of dielectric material include a first layer and a second layer; a conductive trace that is between the first layer and the second layer and that is parallel to the first layer and the second layer along at least part of a length of the conductive trace; and a conductive via that extends at least part-way through the layers of dielectric material and that connects electrically to the conductive trace, where the conductive via is configured also to connect electrically to a signal input to receive or to transmit a signal that has a center frequency span.

公开(公告)号：US11812557B2

公开(公告)日：2023-11-07

申请号：US17273249

申请日：2019-09-04

Applicant: Pilkington Group Limited

Inventor： Stephen Roland Day

IPC: H05K1/18 ,  H05K1/14 ,  H05K3/00 ,  H05K3/28

CPC classification number: H05K1/187 ,  H05K1/147 ,  H05K3/0097 ,  H05K3/284 ,  H05K2201/09754 ,  H05K2201/10106 ,  H05K2201/10151

Abstract: A method of making an electrical device is described. The method comprises the steps: (i) providing a layer of interlayer material having a first major surface and a second opposing major surface; (ii) positioning at least a first electrically operable component on the first major surface of the first layer of interlayer material, the first electrically operable component being mounted on a first circuit board; and (iii) providing a layer of adhesive material, preferably as a liquid, to cover at least a portion of the first major surface of the layer of interlayer material and at least a portion of the first electrically operable component and/or at least a portion of the first circuit board such that following step (iii) the first electrically operable component is fixed on the layer of interlayer material by at least a portion of the layer of adhesive material.

公开(公告)号：US20180098431A1

公开(公告)日：2018-04-05

申请号：US15689206

申请日：2017-08-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jin Yong PARK ,  Jeong Geun KIM ,  Si Young PARK

IPC: H05K1/18 ,  H01R4/58 ,  H05K1/11 ,  H05K3/34

CPC classification number: H05K1/184 ,  H01R4/58 ,  H01R12/52 ,  H01R12/57 ,  H01R12/58 ,  H01R12/73 ,  H05K1/0213 ,  H05K1/115 ,  H05K1/145 ,  H05K3/341 ,  H05K3/3457 ,  H05K7/142 ,  H05K2201/09072 ,  H05K2201/09754 ,  H05K2201/0999 ,  H05K2201/10189 ,  H05K2201/1028 ,  H05K2201/10295 ,  H05K2201/10303 ,  H05K2201/10409

Abstract: In accordance with an aspect of the present disclosure, a contact structure for an electronic device may include a printed circuit board (PCB) including at least one hole vertically formed through the PCB, a housing (e.g., a mechanical part) on which the PCB is seated, and a contact element, at least part of which is brought into contact with the housing disposed on a side of the hole of the PCB and below the same. The contact element may include a contact part soldered on a peripheral portion around the hole, and a protrusion passing through the hole and making contact with the housing disposed below the PCB.

公开(公告)号：US20170094800A1

公开(公告)日：2017-03-30

申请号：US15279080

申请日：2016-09-28

Applicant: TactoTek Oy

Inventor： Antti KERANEN ,  Mikko HEIKKINEN ,  Pasi RAAPPANA ,  Jarmo SAASKI

IPC: H05K1/18 ,  H05K1/11 ,  H05K1/16 ,  H05K3/46 ,  H05K3/12 ,  H05K3/28 ,  H05K3/00 ,  H05K1/02 ,  H05K3/40

CPC classification number: H05K1/189 ,  H05K1/0269 ,  H05K1/028 ,  H05K1/111 ,  H05K1/118 ,  H05K1/16 ,  H05K3/0044 ,  H05K3/12 ,  H05K3/28 ,  H05K3/4092 ,  H05K3/46 ,  H05K2201/0129 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/09754 ,  H05K2203/0228 ,  H05K2203/1316

Abstract: A multilayer structure includes a flexible substrate film having a first side and opposite second side, a number of conductive traces, optionally defining contact pads and/or conductors, printed on the first side for establishing a desired predetermined circuit design, a plastic layer molded onto the first side so as to enclose the circuit between the plastic layer and the first side, and a connector in a form of a flexible flap for providing external electrical connection to the embedded circuit from the second, opposite side, the connector defined by a portion of the substrate film accommodating at least part of one or more of the printed conductive traces and cut partially loose from the surrounding substrate material to establish the flap, whose loose end is bendable away from the molded plastic layer to facilitate establishment of the electrical connection with external element, wire or connector, via the associated gap.

公开(公告)号：US09496602B2

公开(公告)日：2016-11-15

申请号：US14263749

申请日：2014-04-28

Applicant: Apple Inc.

Inventor： Darshan R. Kasar

IPC: H05K1/00 ,  H05K1/18 ,  H05K7/00 ,  H01Q1/24 ,  H05K3/28 ,  H05K9/00 ,  H01Q1/42

CPC classification number: H01Q1/243 ,  H01Q1/42 ,  H05K1/189 ,  H05K3/284 ,  H05K9/0024 ,  H05K2201/09754 ,  H05K2203/1316 ,  H05K2203/1327 ,  H05K2203/1476

Abstract: Circuitry such as electrical components and wires and traces on flexible printed circuits can be embedded within injection-molded plastic structures. The electrical components can include integrated circuits, connectors, and system-in-package circuit modules. The system-in-package circuit modules may include components mounted on a substrate and covered with plastic. The connectors may include a connector for mating with a corresponding connector on an electronic device or a battery. The injection-molded plastic structures may form a housing. The housing may form part of an electronic device, an external case that receives an electronic device, or other structures. A near-field communications antenna may be embedded within a plastic housing. Signal wires and plastic fibers may be interlaced to form a mesh that is embedded in the plastic housing or other injection molded plastic structure.

Abstract translation: 诸如电气部件和电线以及柔性印刷电路上的迹线的电路可以嵌入注射成型的塑料结构内。 电气部件可以包括集成电路，连接器和系统级封装电路模块。 系统级封装电路模块可以包括安装在基板上并被塑料覆盖的部件。 连接器可以包括用于与电子设备或电池上的相应连接器配合的连接器。 注射成型的塑料结构可以形成外壳。 壳体可以形成电子设备的一部分，接收电子设备的外部壳体或其他结构。 近场通信天线可以嵌入在塑料外壳内。 信号线和塑料纤维可以交织以形成嵌入在塑料外壳或其它注模塑料结构中的网状物。

公开(公告)号：US20150319850A1

公开(公告)日：2015-11-05

申请号：US14269736

申请日：2014-05-05

Applicant: Tim Gruhl

Inventor： Tim Gruhl

IPC: H05K1/02 ,  H05K3/40 ,  B29C67/00 ,  H05K3/46

CPC classification number: H05K1/0284 ,  B29C64/106 ,  B29L2031/3425 ,  H01L21/4846 ,  H05K3/1241 ,  H05K3/4007 ,  H05K3/4084 ,  H05K3/46 ,  H05K3/4611 ,  H05K3/4664 ,  H05K2201/0382 ,  H05K2201/09036 ,  H05K2201/09754 ,  H05K2201/2009 ,  H05K2203/013

Abstract: In an embodiment, a method includes forming a printed circuit board by depositing a first plurality of layers and forming an interconnect integral to the printed circuit board by depositing a second plurality of layers on at least a portion of the first plurality of layers. The interconnect includes a stabilizing structure and a contact positioned within the stabilizing structure. The stabilizing structure includes a first material and the contact includes a second material that is different than the first material.

Abstract translation: 在一个实施例中，一种方法包括通过沉积第一多个层并通过在第一多个层的至少一部分上沉积第二多个层来形成与印刷电路板一体的互连来形成印刷电路板。 互连包括稳定结构和位于稳定结构内的接触。 所述稳定结构包括第一材料，并且所述触点包括不同于所述第一材料的第二材料。

公开(公告)号：US20150313035A1

公开(公告)日：2015-10-29

申请号：US14651159

申请日：2013-10-11

Applicant: ROBERT BOSCH GMBH

Inventor： Markus Kroeckel ,  Richard Gueckel

IPC: H05K7/14

CPC classification number: H05K7/1417 ,  H05K1/117 ,  H05K5/006 ,  H05K5/0069 ,  H05K2201/09063 ,  H05K2201/09754

Abstract: The invention relates to an electronic arrangement having a directly contactable circuit board (2), said electronic arrangement comprising: a circuit board (2) that includes at least one electric contact for electric contacting, a housing (3) inside which the circuit board (2) is arranged, and a plug shroud (33) that is arranged on the housing (3). The circuit board (2) includes a first circuit board half (24) that has a support (4) for supporting the circuit board (4), and a second circuit board half (25). The circuit board (2) is supported on the support (4) in such a way that the support (4) defines a swivel region, in particular a swivel axis of the circuit board (2), about which the circuit board (2) can swivel.

Abstract translation: 本发明涉及一种具有可直接接触的电路板（2）的电子装置，所述电子装置包括：电路板（2），包括至少一个用于电接触的电触点;壳体（3），电路板 2）布置，并且布置在壳体（3）上的塞子罩（33）。 电路板（2）包括具有用于支撑电路板（4）的支撑件（4）和第二电路板半部（25）的第一电路板半部（24）。 电路板（2）支撑在支撑件（4）上，使得支撑件（4）限定了电路板（2）的旋转区域，特别是电路板（2）的旋转轴线， 可以旋转。

公开(公告)号：US20140301032A1

公开(公告)日：2014-10-09

申请号：US14245343

申请日：2014-04-04

Applicant: PNY Technologies, Inc.

Inventor： Robert Stone ,  Joseph Pluchino

IPC: G06F1/18

CPC classification number: G06F1/185 ,  G06K19/07732 ,  H05K3/368 ,  H05K2201/09754 ,  H05K2201/0999

Abstract: A reduced length memory card is provided. The memory card, comprising a memory circuit, a housing for said memory circuit, said housing defining a first end, a second end opposite the first end and insertable into a port of a digital device, and opposing sidewalls between the first end and the second end, and a plurality of electrical contacts in electrical communication with said memory circuit, said contacts exposed through apertures formed in a bottom surface of the housing extending between the first end and the second end, wherein the memory card is electrically compatible with a Secure Digital (SD) standard, and wherein a length of the card extending between the first end and the second end is less than a width of the card extending between the opposing sidewalls. The memory could comprise an extraction ridge along the first end of the card and exposed when the card is inserted into the port of the digital device.

Abstract translation: 提供了缩小的存储卡。 所述存储卡包括存储器电路，用于所述存储器电路的外壳，所述壳体限定第一端，与所述第一端相对的第二端并可插入数字设备的端口中，以及所述第一端和所述第二端之间的相对的侧壁 端部以及与所述存储器电路电连通的多个电触头，所述触点通过形成在壳体的底表面中的孔在第一端和第二端之间暴露，其中存储卡与安全数字 （SD）标准，并且其中在第一端和第二端之间延伸的卡的长度小于在相对侧壁之间延伸的卡的宽度。 存储器可以包括沿着卡的第一端的提取脊，并且当卡被插入数字设备的端口时被暴露。

公开(公告)号：US20140174790A1

公开(公告)日：2014-06-26

申请号：US14191613

申请日：2014-02-27

Applicant: YAZAKI CORPORATION

Inventor： Mamoru SAWAI

IPC: H05K1/02

CPC classification number: H05K1/0213 ,  H05K1/056 ,  H05K3/40 ,  H05K3/4092 ,  H05K3/44 ,  H05K2201/09754 ,  H05K2201/10924 ,  Y10T29/49158 ,  Y10T29/49165

Abstract: A wiring substrate includes a wiring board having a main face and a side face substantially perpendicular to the main face; a circuit pattern which is formed on the main face of the wiring board; a soaking plate which is disposed in an intermediate layer of the wiring board; and a plurality of protruding terminals are disposed in the intermediate layer and are projected outwardly from the side face. The protruding terminals are electrically connected in the intermediate layer to each other.

Abstract translation: 布线基板包括具有主面和大致垂直于主面的侧面的布线板; 形成在布线基板的主面上的电路图案; 浸渍板，其布置在所述布线板的中间层中; 并且多个突出端子设置在中间层中并且从侧面向外突出。 突出端子在中间层中彼此电连接。

公开(公告)号：US20130065450A1

公开(公告)日：2013-03-14

申请号：US13365004

申请日：2012-02-02

Applicant: Chun-Nan Su ,  Chun-Ching Peng

Inventor： Chun-Nan Su ,  Chun-Ching Peng

IPC: H01R24/28 ,  H05K3/30

CPC classification number: H05K5/0278 ,  H01R13/6658 ,  H01R24/62 ,  H01R43/20 ,  H05K3/4015 ,  H05K2201/09754 ,  H05K2201/1028 ,  H05K2201/1056 ,  Y10T29/49139

Abstract: The present invention discloses a USB application device including a body, a circuit board, a plurality of first electrical pins and a plurality of electrical elements. The circuit board is disposed in the body. The plurality of first electrical pins are disposed on the circuit board and expended to the body such that the plurality of first electrical pins are partly exposed to the body. A space is formed between the plurality of first electrical pins and circuit board such that the plurality of electrical elements can be disposed on the space. The length of the circuit board therefore becomes shorter, and the volume of the USB application device is reduced.

Abstract translation: 本发明公开了一种USB应用设备，包括主体，电路板，多个第一电引脚和多个电元件。 电路板设置在体内。 多个第一电引脚设置在电路板上并消耗到主体，使得多个第一电引脚部分地暴露于主体。 在多个第一电引脚和电路板之间形成空间，使得多个电气元件可以设置在该空间上。 因此，电路板的长度变短，并且USB应用装置的体积减小。