摘要:
A semiconductor integrated circuit designing method capable of minimizing a parasitic capacitance generated by an overhead in conductive lines, especially a gate line, a semiconductor integrated circuit according to the designing method, and a fabricating method thereof are provided. A method of designing a semiconductor integrated circuit having a FinFET architecture, includes: performing a pre-simulation of the semiconductor integrated circuit to be designed; designing a layout of components of the semiconductor integrated circuit based on a result of the pre-simulation, the components comprising first and second device areas and a first conductive line extending across the first and second device areas; modifying a first cutting area, that is arranged between the first and second device areas and electrically cuts the first conductive line, according to at least one design rule to minimize an overhead of the first conductive line created by the first cutting area.
摘要:
A semiconductor memory device for reducing a precharge time is provided. The semiconductor memory device may include a sense amplifier, a precharge unit and an equalizing circuit. The sense amplifier may sense and amplify a difference between data transmitted through a first bit line and data transmitted through a second bit line in response to a sense amplifier enable signal. The precharge unit may precharge voltage levels of the first bit line and the second bit line to a precharge voltage level in response to a precharge enable signal. The equalizing circuit may be connected to the sense amplifier and the precharge unit and may control the voltage levels of the first bit line and the second bit line to be equal to each other in response to the sense amplifier enable signal. The semiconductor memory device may reduce a time required to perform a precharge operation and/or minimize an increase of the circuit size.
摘要:
A semiconductor memory device for reducing a precharge time is provided. The semiconductor memory device may include a sense amplifier, a precharge unit and an equalizing circuit. The sense amplifier may sense and amplify a difference between data transmitted through a first bit line and data transmitted through a second bit line in response to a sense amplifier enable signal. The precharge unit may precharge voltage levels of the first bit line and the second bit line to a precharge voltage level in response to a precharge enable signal. The equalizing circuit may be connected to the sense amplifier and the precharge unit and may control the voltage levels of the first bit line and the second bit line to be equal to each other in response to the sense amplifier enable signal. The semiconductor memory device may reduce a time required to perform a precharge operation and/or minimize an increase of the circuit size.
摘要:
When first memory cells connected to a bit line are selected, the bit-line sense amplifier amplifies the voltage levels of the bit line and the complementary bit line using the first current path and the second current path, wherein the first current path is formed between the output node of the sensing enable unit and the bit line in response to the voltage level of the complementary bit line and the first addressing signal, and the second current path is formed between the output node of the sensing enable unit and the complementary bit line in response to the voltage level of the bit line and the second addressing signal.
摘要:
Provided are a low power consumption data input/output circuit of an embedded memory device and a data input/output method of the circuit. The embedded memory device includes sub memory cell blocks that share word lines. The data input/output circuit includes input/output lines, bit line sense amplifying unit groups, and data input/output units. Each pair of the input/output lines is arranged in each of the sub memory cell blocks. The bit line sense amplifying unit groups are connected between the sub memory cell blocks and the pairs of input/output lines and mutually transmit data signals between the sub memory cell blocks and the pairs of input/output lines in response to first control signals. Each of the data input/output units is connected to each of input/output line groups each including a first predetermined number of pairs of the input/output lines, selects as a data output path some of the input/output lines included in each of the input/output line groups in response to second control signals, pre-discharges the residual input/output lines to a ground voltage, and receives and transmits the data signals to the sub memory cell blocks via the selected input/output lines.
摘要:
A semiconductor device having a reduced number of column redundancy fuse boxes include a plurality of memory blocks having normal and redundant memory cells, a plurality of normal column selection line drivers, a plurality of redundant column selection line drivers, and a column redundancy fuse box. In particular, the normal and redundant column selection line drivers all include fuses. The column redundancy fuse box is connected in common to the plurality of redundant column selection line drivers. Also, the redundancy fuse box comprises a repair address determining portion for pre-latching a repair address and comparing input addresses with the latched repair address to determine whether the input address is the same as the repair address, and a redundancy enable signal generating portion for generating a redundancy enable signal in response to the output signals of the repair address determining portion.
摘要:
A semiconductor device having a reduced number of column redundancy fuse boxes include a plurality of memory blocks having normal and redundant memory cells, a plurality of normal column selection line drivers, a plurality of redundant column selection line drivers, and a column redundancy fuse box. In particular, the normal and redundant column selection line drivers all include fuses. The column redundancy fuse box is connected in common to the plurality of redundant column selection line drivers. Also, the redundancy fuse box comprises a repair address determining portion for pre-latching a repair address and comparing input addresses with the latched repair address to determine whether the input address is the same as the repair address, and a redundancy enable signal generating portion for generating a redundancy enable signal in response to the output signals of the repair address determining portion.
摘要:
Merged Memory and Logic (MML) integrated circuits include data path width reducing circuits and methods that are responsive to a test mode signal. In particular, MML circuits include a memory block, a logic block and a first plurality of output data paths that interconnect the memory block and the logic block. A data path width reducing circuit is responsive to a test mode signal, to serially provide output data on the first plurality of output data paths to at least one MML integrated circuit output pad, wherein the number of MML integrated circuit output pads is less than the first plurality. The external data path of the MML integrated circuit is thereby reduced during the test mode. The MML integrated circuit may also include a second plurality of input data paths that interconnect the memory block and the logic block. The data path width reducing circuit also serially provides input data from at least one MML integrated circuit input pad to the second plurality of input data paths wherein the number of MML integrated circuit input pads is less than the second plurality. Preferably, the first and second pluralities are identical and the number of MML integrated circuit input pads and output pads are identical.
摘要:
When first memory cells connected to a bit line are selected, the bit-line sense amplifier amplifies the voltage levels of the bit line and the complementary bit line using the first current path and the second current path, wherein the first current path is formed between the output node of the sensing enable unit and the bit line in response to the voltage level of the complementary bit line and the first addressing signal, and the second current path is formed between the output node of the sensing enable unit and the complementary bit line in response to the voltage level of the bit line and the second addressing signal.
摘要:
A sense amplifier includes: a bit line and a complementary bit line; a data input/output line and a complementary data input/output line; first and second transistors which are connected in series between the data input/output line and the bit line; and third and fourth transistors which are connected in series between the complementary data input/output line and the complementary bit line, where the gate of the first transistor is connected to the complementary data input/output line, the gate of the third transistor is connected to the data input/output line, and a write column select line enable signal is input to the gates of the second and fourth transistors. Since the sense amplifier can write data before data of adjacent bit line pairs are amplified in a semiconductor memory device, the write timing can be reduced.