公开(公告)号：US20220384222A1

公开(公告)日：2022-12-01

申请号：US17884065

申请日：2022-08-09

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Sheng KUO ,  Chih-Hung HUANG ,  Yi-Fam SHIU ,  Chueng-Jen WANG ,  Hsuan LEE ,  Jiun-Rong PAI

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/66 ,  H01L21/683

Abstract: In certain embodiments, a system includes: a source lane configured to move a first die container between a load port and a source lane staging area; an inspection sensor configured to produce a sensor result based on a die on the first die container; a pass target lane configured to move a second die container between a pass target lane out port and a pass target lane staging area; a fail target lane configured to move a third die container between a fail target lane out port and a fail target lane staging area; and a conveyor configured to move the die from the first die container at the source lane staging area to either the second die container at the pass target lane staging area or the fail target lane staging area based on the sensor result.

公开(公告)号：US20210202277A1

公开(公告)日：2021-07-01

申请号：US16731679

申请日：2019-12-31

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Sheng KUO ,  Yang-Ann CHU ,  Chih-Hung HUANG ,  Guan-Wei HUANG ,  Jiun-Rong PAI ,  Hsuan LEE

IPC: H01L21/677 ,  B65G1/137

Abstract: A system, includes, a semiconductor processing unit, an Automated Materials Handling System (AMHS) vehicle, and a warehouse apparatus, wherein the warehouse apparatus comprises at least one input port, at least one output port, and at least one load/unload port, wherein the warehouse apparatus is configured to perform one of the following: receiving a plurality of tray cassette containers from the AMHS vehicle at the at least one input port, transporting at least one tray cassette in each of a plurality of tray cassette containers to the at least one load/unload port via the at least one input port, transporting at least one first tray from the at least one tray cassette to the semiconductor processing unit via a tray feeder conveyor, and receiving at least one second tray from the semiconductor processing unit via the tray feeder conveyor.

公开(公告)号：US20200058535A1

公开(公告)日：2020-02-20

申请号：US16396426

申请日：2019-04-26

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Tsung-Sheng KUO ,  Chih-Hung HUANG ,  Ming-Hsien TSAI ,  Yang-Ann CHU ,  Hsuan LEE ,  Jiun-Rong PAI

IPC: H01L21/677 ,  B65G47/91

Abstract: A wafer carrier handling apparatus includes a housing, a platform, a moving mechanism and a door storage device. The platform is configured to hold a wafer carrier. The moving mechanism is connected to the housing and configured to move the platform with respect to the housing. The door storage device is disposed above the housing. The door storage device has a first door storage zone. The first door storage zone is configured to allow a door of the wafer carrier to be held thereon.

公开(公告)号：US20220319890A1

公开(公告)日：2022-10-06

申请号：US17849337

申请日：2022-06-24

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Sheng KUO ,  Kai-Chieh HUANG ,  Wei-Ting HSIAO ,  Yang-Ann CHU ,  I-Lun YANG ,  Hsuan LEE

IPC: H01L21/677 ,  B65G47/90 ,  H01L21/67 ,  H01L21/673

Abstract: Apparatus and methods for handling die carriers are disclosed. In one example, a disclosed apparatus includes: a load port configured to load a die carrier operable to hold a plurality of dies into a processing tool; and a lane changer coupled to the load port and configured to move at least one die in the die carrier to an input of the processing tool and transfer the at least one die into the processing tool for processing the at least one die.

公开(公告)号：US20210078809A1

公开(公告)日：2021-03-18

申请号：US17087216

申请日：2020-11-02

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Sheng KUO ,  Chih-Hung HUANG ,  Yi-Fam SHIU ,  Chueng-Jen WANG ,  Hsuan LEE ,  Jiun-Rong PAI

IPC: B65G47/86 ,  B65G15/28

Abstract: In certain embodiments, a system includes: a source lane configured to move a first die container between a load port and a source lane staging area; an inspection sensor configured to produce a sensor result based on a die on the first die container; a pass target lane configured to move a second die container between a pass target lane out port and a pass target lane staging area; a fail target lane configured to move a third die container between a fail target lane out port and a fail target lane staging area; and a conveyor configured to move the die from the first die container at the source lane staging area to either the second die container at the pass target lane staging area or the fail target lane staging area based on the sensor result.

公开(公告)号：US20250062153A1

公开(公告)日：2025-02-20

申请号：US18936869

申请日：2024-11-04

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chien-Fa LEE ,  Hsu-Shui LIU ,  Jiun-Rong PAI ,  Shou-Wen KUO ,  Jian-Hung CHEN ,  M.C. LIN ,  C.C. CHIEN ,  Hsuan LEE ,  Boris HUANG

IPC: H01L21/683 ,  H01L21/02 ,  H01L21/304 ,  H01L21/66

Abstract: A system and method for cleaning ring frames is disclosed. In one embodiment, a ring frame processing system includes: a plurality of blades for mechanically removing tapes and tape residues from surfaces of a ring frame; a plurality of wheel brushes for conditioning the surfaces of the ring frame; and a transport mechanism for transporting the ring frame.

公开(公告)号：US20230298919A1

公开(公告)日：2023-09-21

申请号：US18201099

申请日：2023-05-23

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Sheng KUO ,  Kai-Chieh HUANG ,  Wei-Ting HSIAO ,  Yang-Ann CHU ,  I-Lun YANG ,  Hsuan LEE

IPC: H01L21/677 ,  B65G47/90 ,  H01L21/67 ,  H01L21/673

CPC classification number: H01L21/67745 ,  B65G47/90 ,  H01L21/67294 ,  H01L21/67333

Abstract: Apparatus and methods for handling die carriers are disclosed. In one example, a disclosed apparatus includes: a load port configured to load a die carrier operable to hold a plurality of dies into a processing tool; and a lane changer coupled to the load port and configured to move at least one die in the die carrier to an input of the processing tool and transfer the at least one die into the processing tool for processing the at least one die.

公开(公告)号：US20220262656A1

公开(公告)日：2022-08-18

申请号：US17737750

申请日：2022-05-05

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Sheng KUO ,  Chih-Hung HUANG ,  Hsueh-Lei WANG ,  Yang-Ann CHU ,  Hsuan LEE ,  Jiun-Rong PAI

IPC: H01L21/677 ,  H01L21/673 ,  B65G1/137

Abstract: In an embodiment, a system includes: a warehousing apparatus configured to interface with a semiconductor die processing tool configured to process a semiconductor die singulated from a wafer, wherein the semiconductor die processing tool comprise an in-port and an out-port, wherein the warehousing apparatus is configured to: move a first die vessel that contains the semiconductor die to the in-port from a first die vessel container, wherein the first die vessel container is configured to house the first die vessel; move the first die vessel from the in-port to a buffer region; and move a second die vessel from the buffer region to the out-port.

公开(公告)号：US20210257247A1

公开(公告)日：2021-08-19

申请号：US17308786

申请日：2021-05-05

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chien-Fa LEE ,  Hsu-Shui LIU ,  Jiun-Rong PAI ,  Shou-Wen KUO ,  Jian-Hung CHENG ,  M.C. LIN ,  C.C. CHIEN ,  Hsuan LEE ,  Boris HUANG

IPC: H01L21/683 ,  H01L21/304 ,  H01L21/66 ,  H01L21/02

Abstract: A system and method for cleaning and inspecting ring frames is disclosed here. In one embodiment, a ring frame processing system includes: a cleaning station configured to remove a first tape on a first surface of a ring frame using a first blade, clean first adhesive residues from the first tape on the first surface of the ring frame using a first wheel brush, and remove second adhesive residues from a second tape on a second surface of the ring frame using a second blade; and an inspection station, wherein the inspection station comprises an automated optical inspection system configured to determine the cleanness of the first and second surfaces of the ring frame after cleaning.

公开(公告)号：US20200058534A1

公开(公告)日：2020-02-20

申请号：US16526892

申请日：2019-07-30

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd

Inventor： Tsung-Sheng KUO ,  Kai-Chieh HUANG ,  Wei-ting HSIAO ,  Yang-Ann CHU ,  1-Lun YANG ,  Hsuan LEE

IPC: H01L21/677 ,  H01L21/673 ,  H01L21/67 ,  B65G47/90

Abstract: Apparatus and methods for handling die carriers are disclosed. In one example, a disclosed apparatus includes: a load port configured to load a die carrier operable to hold a plurality of dies into a processing tool; and a lane changer coupled to the load port and configured to move at least one die in the die carrier to an input of the processing tool and transfer the at least one die into the processing tool for processing the at least one die.