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    Single bodied platen housing a detection module for CMP systems
    1.
    发明授权
    Single bodied platen housing a detection module for CMP systems 有权

    公开(公告)号：US11571782B2

    公开(公告)日：2023-02-07

    申请号：US16672099

    申请日：2019-11-01

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Tsung-Lung Lai ,  Cheng-Ping Chen ,  Shih-Chung Chen ,  Sheng-Tai Peng ,  Rong-Long Hung

    IPC: B24B37/16 ,  B24B49/12 ,  B24B37/013

    Abstract: The present disclosure provides a chemical mechanical polishing system having a unitary platen. The platen includes one or more recesses within the platen to house various components for the polishing/planarization process. In one embodiment, the platen includes a first recess and a second recess. The first recess is located under the second recess. An end point detector is placed in the first recess and a detector cover may be placed in the second recess. A sealing mean is provided in a space between the end point detector and the detector cover to prevent any external or foreign materials from coming in contact with the end point detector. A fastener used for fastening the detector cover to the platen also provides addition protection to prevent foreign materials from coming in contact with components received in the recesses.

    SINGLE BODIED PLATEN HOUSING A DETECTION MODULE FOR CMP SYSTEMS
    2.
    发明申请
    SINGLE BODIED PLATEN HOUSING A DETECTION MODULE FOR CMP SYSTEMS 有权

    公开(公告)号：US20230133331A1

    公开(公告)日：2023-05-04

    申请号：US18149489

    申请日：2023-01-03

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Tsung-Lung Lai ,  Cheng-Ping Chen ,  Shih-Chung Chen ,  Sheng-Tai Peng ,  Rong-Long Hung

    IPC: B24B37/16 ,  B24B49/12 ,  B24B37/013

    Abstract: The present disclosure provides a chemical mechanical polishing system having a unitary platen. The platen includes one or more recesses within the platen to house various components for the polishing/planarization process. In one embodiment, the platen includes a first recess and a second recess. The first recess is located under the second recess. An end point detector is placed in the first recess and a detector cover may be placed in the second recess. A sealing mean is provided in a space between the end point detector and the detector cover to prevent any external or foreign materials from coming in contact with the end point detector. A fastener used for fastening the detector cover to the platen also provides addition protection to prevent foreign materials from coming in contact with components received in the recesses.

    Single bodied platen housing a detection module for CMP systems
    4.
    发明授权
    Single bodied platen housing a detection module for CMP systems 有权

    公开(公告)号：US11975421B2

    公开(公告)日：2024-05-07

    申请号：US18149489

    申请日：2023-01-03

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Tsung-Lung Lai ,  Cheng-Ping Chen ,  Shih-Chung Chen ,  Sheng-Tai Peng ,  Rong-Long Hung

    IPC: B24B37/16 ,  B24B37/013 ,  B24B49/12

    CPC classification number: B24B37/16 ,  B24B37/013 ,  B24B49/12

    Abstract: The present disclosure provides a chemical mechanical polishing system having a unitary platen. The platen includes one or more recesses within the platen to house various components for the polishing/planarization process. In one embodiment, the platen includes a first recess and a second recess. The first recess is located under the second recess. An end point detector is placed in the first recess and a detector cover may be placed in the second recess. A sealing mean is provided in a space between the end point detector and the detector cover to prevent any external or foreign materials from coming in contact with the end point detector. A fastener used for fastening the detector cover to the platen also provides addition protection to prevent foreign materials from coming in contact with components received in the recesses.

    MONOLITHIC PLATEN
    5.
    发明申请
    MONOLITHIC PLATEN 有权

    公开(公告)号：US20210268624A1

    公开(公告)日：2021-09-02

    申请号：US17318765

    申请日：2021-05-12

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Tsung-Lung Lia ,  Cheng-Ping Chen ,  Shih-Chung Chen ,  Sheng-Tai Peng

    IPC: B24B37/30 ,  H01L21/67 ,  H01L21/306 ,  B24B37/04 ,  H01L21/677

    Abstract: In an embodiment, a chemical mechanical planarization (CMP) system includes: a monolithic platen within a platen housing, wherein the monolithic platen is formed of a single piece of material, wherein the monolithic platen includes: a first portion within a first opening, and a second portion within a second opening, wherein the first portion has a different diameter than the second portion; and a polishing fluid delivery module above the monolithic platen, wherein the polishing fluid delivery module is configured to deliver slurry to the monolithic platen during performance of CMP.

    Monolithic platen
    6.
    发明授权
    Monolithic platen 有权

    公开(公告)号：US11020837B2

    公开(公告)日：2021-06-01

    申请号：US15965685

    申请日：2018-04-27

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Tsung-Lung Lai ,  Cheng-Ping Chen ,  Shih-Chung Chen ,  Sheng-Tai Peng

    IPC: B24B37/30 ,  B24B37/04 ,  H01L21/67 ,  H01L21/306 ,  H01L21/677

    Abstract: In an embodiment, a chemical mechanical planarization (CMP) system includes: a monolithic platen within a platen housing, wherein the monolithic platen is formed of a single piece of material, wherein the monolithic platen includes: a first portion within a first opening, and a second portion within a second opening, wherein the first portion has a different diameter than the second portion; and a polishing fluid delivery module above the monolithic platen, wherein the polishing fluid delivery module is configured to deliver slurry to the monolithic platen during performance of CMP.

    SINGLE BODIED PLATEN HOUSING A DETECTION MODULE FOR CMP SYSTEMS
    8.
    发明申请
    SINGLE BODIED PLATEN HOUSING A DETECTION MODULE FOR CMP SYSTEMS 审中-公开

    公开(公告)号：US20200164481A1

    公开(公告)日：2020-05-28

    申请号：US16672099

    申请日：2019-11-01

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Tsung-Lung Lai ,  Cheng-Ping Chen ,  Shih-Chung Chen ,  Sheng-Tai Peng ,  Rong-Long Hung

    IPC: B24B37/16 ,  B24B37/013 ,  B24B49/12

    Abstract: The present disclosure provides a chemical mechanical polishing system having a unitary platen. The platen includes one or more recesses within the platen to house various components for the polishing/planarization process. In one embodiment, the platen includes a first recess and a second recess. The first recess is located under the second recess. An end point detector is placed in the first recess and a detector cover may be placed in the second recess. A sealing mean is provided in a space between the end point detector and the detector cover to prevent any external or foreign materials from coming in contact with the end point detector. A fastener used for fastening the detector cover to the platen also provides addition protection to prevent foreign materials from coming in contact with components received in the recesses.

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