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1.
公开(公告)号:US20180174643A1
公开(公告)日:2018-06-21
申请号:US15471937
申请日:2017-03-28
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Chiting CHENG , Yangsyu Lin
IPC: G11C11/417 , H01L27/11 , H01L23/528
CPC classification number: G11C11/417 , G11C5/147 , H01L23/5286 , H01L27/1104 , H01L27/1116 , Y10T307/675 , Y10T307/735
Abstract: A dual rail device includes a first power domain circuit coupled to a first power supply through a first header control switch and a second power domain circuit coupled to a second power supply. The first and second power supplies have different steady-state voltage levels. The first power domain circuit is interfaced to the second power domain circuit. The device also includes a power detector circuit for providing a control signal for the first header control switch responsive to a voltage level of the second power supply.
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公开(公告)号:US20220236894A1
公开(公告)日:2022-07-28
申请号:US17717491
申请日:2022-04-11
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Yu-Hao HSU , Cheng Hung LEE , Chen-Lin YANG , Chiting CHENG , Fu-An WU , Hung-Jen LIAO , Jung-Ping YANG , Jonathan Tsung-Yung CHANG , Wei Min CHAN , Yen-Huei CHEN , Yangsyu LIN , Chien-Chen LIN
Abstract: Various embodiments for configurable memory storage systems are disclosed. The configurable memory storages selectively choose an operational voltage signal from among multiple voltage signals to dynamically control various operational parameters. For example, the configurable memory storages selectively choose a maximum voltage signal from among the multiple voltage signals to maximize read/write speed. As another example, the configurable memory storages selectively choose a minimum voltage signal from among the multiple voltage signals to minimize power consumption.
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公开(公告)号:US20180348264A1
公开(公告)日:2018-12-06
申请号:US15941535
申请日:2018-03-30
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Chia-Chen KUO , Chiting CHENG , Wei-Jer HSIEH
IPC: G01R19/165 , G01R19/04 , G01R19/00 , H03K19/00 , H03K19/0944
CPC classification number: G01R19/16519 , G01R19/0038 , G01R19/04 , H03K19/0013 , H03K19/0944
Abstract: A voltage selection circuit includes: a power detection circuit configured to compare an output voltage with a first input voltage and a second input voltage, respectively; a latch circuit, coupled to the power detection circuit, and configured to flip respective logic states of a pair of output signals when the output voltage is lower than either the first input voltage or the second input voltage; and a selection circuit, coupled to the latch circuit, and configured to use either the first input voltage or the second input voltage as the output voltage based on the respective logic states of the pair of output signals.
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4.
公开(公告)号:US20150262655A1
公开(公告)日:2015-09-17
申请号:US14727931
申请日:2015-06-02
Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor: Wei-Jer HSIEH , Yangsyu LIN , Hsiao Wen LU , Chiting CHENG , Jonathan Tsung-Yung CHANG
IPC: G11C11/419
CPC classification number: G11C11/419 , G11C7/12
Abstract: A device includes a transistor switch coupled between a bit line voltage node and a ground node and a boost signal circuit coupled to a gate node of the transistor switch, where the boost signal circuit providing a boost signal responsive to a write enable signal. The device also includes a first delay element and a first capacitor in series with the first delay element. The first capacitor has a first end coupled to the bit line voltage node and a second end coupled to the gate node through the first delay element.
Abstract translation: 一种器件包括耦合在位线电压节点和接地节点之间的晶体管开关和耦合到晶体管开关的栅极节点的升压信号电路,其中升压信号电路响应写使能信号而提供升压信号。 该装置还包括与第一延迟元件串联的第一延迟元件和第一电容器。 第一电容器具有耦合到位线电压节点的第一端和通过第一延迟元件耦合到栅极节点的第二端。
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公开(公告)号:US20150121030A1
公开(公告)日:2015-04-30
申请号:US14068003
申请日:2013-10-31
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Yangsyu LIN , Hsiao Wen LU , Chiting CHENG , Jonathan Tsung-Yung CHANG
IPC: G06F12/02
CPC classification number: G11C11/419 , G11C7/18
Abstract: A semiconductor memory comprises a plurality of sub banks each including one or more rows of memory bit cells connected to a set of local bit lines, wherein the sub banks share a same set of global bit lines for reading/writing data from/to the memory bit cells of the sub banks. The semiconductor memory chip further comprises a plurality of switch elements for each of the sub banks, wherein each of the switch elements connects the local bit line and the global bit line of a corresponding one of the memory bit cells in the sub bank for data transmission between the local bit line and the global bit line. The semiconductor memory chip further comprises a plurality of bank selection signal lines each connected to the switch elements in a corresponding one of the sub banks, wherein the bank selection signal lines carry a plurality of bank selection signals to select one of the sub banks for data transmission between the local bit lines and the global bit lines.
Abstract translation: 半导体存储器包括多个子存储体,每个子存储体包括连接到一组局部位线的一行或多行存储器位单元,其中子存储体共享用于从/向存储器读/写数据的全局位线集合 子库的位单元。 半导体存储器芯片还包括用于每个子存储体的多个开关元件,其中每个开关元件连接子库中对应的一个存储单元的局部位线和全局位线,用于数据传输 在本地位线和全局位线之间。 半导体存储器芯片还包括多个存储体选择信号线,每条存储体选择信号线连接到相应的一个子存储体中的开关元件,其中存储体选择信号线传送多个存储体选择信号以选择一个子存储体用于数据 局部位线与全局位线之间的传输。
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公开(公告)号:US20200081636A1
公开(公告)日:2020-03-12
申请号:US16685722
申请日:2019-11-15
Applicant: Taiwan Semiconductor Manufacturing Co. Ltd.
Inventor: Yu-Hao HSU , Cheng Hung LEE , Chen-Lin YANG , Chiting CHENG , Fu-An WU , Hung-Jen LIAO , Jung-Ping YANG , Jonathan Tsung-Yung CHANG , Wei Min CHAN , Yen-Huei CHEN , Yangsyu LIN , Chien-Chen LIN
Abstract: Various embodiments for configurable memory storage systems are disclosed. The configurable memory storages selectively choose an operational voltage signal from among multiple operational voltage signals to dynamically control various operational parameters. For example, the configurable memory storages selectively choose a maximum operational voltage signal from among the multiple operational voltage signals to maximize read/write speed. As another example, the configurable memory storages selectively choose a minimum operational voltage signal from among the multiple operational voltage signals to minimize power consumption.
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公开(公告)号:US20210200452A1
公开(公告)日:2021-07-01
申请号:US17201931
申请日:2021-03-15
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Yu-Hao HSU , Cheng Hung LEE , Chen-Lin YANG , Chiting CHENG , Fu-An WU , Hung-Jen LIAO , Jung-Ping YANG , Jonathan Tsung-Yung CHANG , Wei Min CHAN , Yen-Huei CHEN , Yangsyu LIN , Chien-Chen LIN
Abstract: Various embodiments for configurable memory storage systems are disclosed. The configurable memory storages selectively choose an operational voltage signal from among multiple operational voltage signals to dynamically control various operational parameters. For example, the configurable memory storages selectively choose a maximum operational voltage signal from among the multiple operational voltage signals to maximize read/write speed. As another example, the configurable memory storages selectively choose a minimum operational voltage signal from among the multiple operational voltage signals to minimize power consumption.
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公开(公告)号:US20210057423A1
公开(公告)日:2021-02-25
申请号:US17080617
申请日:2020-10-26
Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor: Yangsyu LIN , Chi-Lung LEE , Chien-Chi TIEN , Chiting CHENG
IPC: H01L27/11 , H01L27/02 , H01L27/092 , G11C11/419 , H01L23/522 , G11C11/412 , H01L23/528
Abstract: A static random access memory (SRAM) periphery circuit includes a first n-type transistor and a second n-type transistor that are disposed in a first well region of first conductivity type, the first well region occupies a first distance in a row direction equal to a bitcell-pitch of an SRAM array. The SRAM periphery circuit includes a first p-type transistor and a second p-type transistor that are disposed in a second well region of second conductivity type. The second well region occupies a second distance in the row direction equal to the bitcell-pitch of the SRAM array. The second well region is disposed adjacent to the first well region in the row direction.
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公开(公告)号:US20200020700A1
公开(公告)日:2020-01-16
申请号:US16502790
申请日:2019-07-03
Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor: Yangsyu LIN , Chi-Lung LEE , Chien-Chi TIEN , Chiting CHENG
IPC: H01L27/11 , H01L27/02 , H01L27/092 , H01L23/528 , H01L23/522 , G11C11/412 , G11C11/419
Abstract: A static random access memory (SRAM) periphery circuit includes a first n-type transistor and a second n-type transistor that are disposed in a first well region of first conductivity type, the first well region occupies a first distance in a row direction equal to a bitcell-pitch of an SRAM array. The SRAM periphery circuit includes a first p-type transistor and a second p-type transistor that are disposed in a second well region of second conductivity type. The second well region occupies a second distance in the row direction equal to the bitcell-pitch of the SRAM array. The second well region is disposed adjacent to the first well region in the row direction.
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公开(公告)号:US20170264276A1
公开(公告)日:2017-09-14
申请号:US15065166
申请日:2016-03-09
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Mahmut Sinangil , Hsin-Hsin KO , Chiting CHENG , Yen-Huei CHEN , Hung-Jen LIAO , Jonathan Tsung-Yung CHANG
IPC: H03K3/356 , H03K19/0185
CPC classification number: H03K3/356113 , H03K19/018521
Abstract: A level shifter circuit is provided that uses a boosting circuit. The boosting circuit is configured to improve the operation of the level shifter circuit when the high voltages of voltage domains across the level shifter circuit are widely separated. A circuit apparatus includes a core level shifter circuit that changes a first voltage of an input signal to a second voltage of an output signal. The circuit apparatus further includes a first boosting circuit that is coupled to the core level shifter circuit and generates a first transient voltage applied to the core level shifter circuit when the input signal transitions from a low value to a high value. The circuit apparatus also includes a second boosting circuit that is coupled to the core level shifter circuit and generates a second transient voltage applied to the core level shifter circuit when the input signal transitions from a high value to a low value.
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