公开(公告)号：US20240222218A1

公开(公告)日：2024-07-04

申请号：US18604957

申请日：2024-03-14

Applicant: Taiwan Semiconductor Manufacturing Co, Ltd.

Inventor： Wensen Hung ,  Szu-Po Huang ,  Hsiang-Fan Lee ,  Kim Hong Chen ,  Chi-Hsi Wu ,  Shin-Puu Jeng

IPC: H01L23/36 ,  H01L23/00 ,  H01L23/04 ,  H01L23/10 ,  H01L23/367 ,  H01L23/42 ,  H01L23/498 ,  H01L25/065 ,  H01L25/18

CPC classification number: H01L23/36 ,  H01L23/04 ,  H01L23/10 ,  H01L23/3675 ,  H01L23/3677 ,  H01L23/42 ,  H01L23/49822 ,  H01L23/49827 ,  H01L25/0652 ,  H01L25/0657 ,  H01L23/49816 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L25/18 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/29011 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/33519 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81815 ,  H01L2224/83191 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06568 ,  H01L2225/06589 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/15311 ,  H01L2924/16153 ,  H01L2924/16251 ,  H01L2924/1679 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105

Abstract: A package includes a substrate having a conductive layer, and the conductive layer comprises an exposed portion. A die stack is disposed over the substrate and electrically connected to the conductive layer. A high thermal conductivity material is disposed over the substrate and contacting the exposed portion of the conductive layer. The package further includes a contour ring over and contacting the high thermal conductivity material.

公开(公告)号：US11961779B2

公开(公告)日：2024-04-16

申请号：US17331945

申请日：2021-05-27

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Wensen Hung ,  Szu-Po Huang ,  Hsiang-Fan Lee ,  Kim Hong Chen ,  Chi-Hsi Wu ,  Shin-Puu Jeng

IPC: H01L23/36 ,  H01L23/00 ,  H01L23/04 ,  H01L23/10 ,  H01L23/367 ,  H01L23/42 ,  H01L23/498 ,  H01L25/065 ,  H01L25/18

CPC classification number: H01L23/36 ,  H01L23/04 ,  H01L23/10 ,  H01L23/3675 ,  H01L23/3677 ,  H01L23/42 ,  H01L23/49822 ,  H01L23/49827 ,  H01L25/0652 ,  H01L25/0657 ,  H01L23/49816 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L25/18 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/29011 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/33519 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81815 ,  H01L2224/83191 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06568 ,  H01L2225/06589 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/15311 ,  H01L2924/16153 ,  H01L2924/16251 ,  H01L2924/1679 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/131 ,  H01L2924/014 ,  H01L2224/291 ,  H01L2924/014

Abstract: A package includes a substrate having a conductive layer, and the conductive layer comprises an exposed portion. A die stack is disposed over the substrate and electrically connected to the conductive layer. A high thermal conductivity material is disposed over the substrate and contacting the exposed portion of the conductive layer. The package further includes a contour ring over and contacting the high thermal conductivity material.

公开(公告)号：US20210287956A1

公开(公告)日：2021-09-16

申请号：US17331945

申请日：2021-05-27

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Wensen Hung ,  Szu-Po Huang ,  Hsiang-Fan Lee ,  Kim Hong Chen ,  Chi-Hsi Wu ,  Shin-Puu Jeng

IPC: H01L23/36 ,  H01L23/04 ,  H01L23/10 ,  H01L25/065 ,  H01L23/367 ,  H01L23/42 ,  H01L23/498

Abstract: A package includes a substrate having a conductive layer, and the conductive layer comprises an exposed portion. A die stack is disposed over the substrate and electrically connected to the conductive layer. A high thermal conductivity material is disposed over the substrate and contacting the exposed portion of the conductive layer. The package further includes a contour ring over and contacting the high thermal conductivity material.