公开(公告)号：US20230378132A1

公开(公告)日：2023-11-23

申请号：US18150525

申请日：2023-01-05

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Wen-Wei Shen ,  Sung-Hui Huang ,  Shang-Yun Hou ,  Sen-Bor Jan ,  Szu-Po Huang ,  Kuan-Yu Huang

IPC: H01L25/065 ,  H01L21/56 ,  H01L23/498 ,  H01L23/538 ,  H01L23/00 ,  H01L21/768

CPC classification number: H01L25/0655 ,  H01L21/565 ,  H01L21/563 ,  H01L23/49838 ,  H01L23/5389 ,  H01L24/05 ,  H01L21/76895 ,  H01L23/49827 ,  H01L2224/05569 ,  H01L2224/16146 ,  H01L2924/3511 ,  H01L24/16

Abstract: A semiconductor device includes: a substrate; a plurality of dies attached to a first side of the substrate; a molding material on the first side of the substrate around the plurality of dies; a first redistribution structure on a second side of the substrate opposing the first side, where the first redistribution structure includes dielectric layers and conductive features in the dielectric layers, where the conductive features include conductive lines, vias, and dummy metal patterns isolated from the conductive lines and the vias; and conductive connectors attached to a first surface of the first redistribution structure facing away from the substrate.

公开(公告)号：US20240222218A1

公开(公告)日：2024-07-04

申请号：US18604957

申请日：2024-03-14

Applicant: Taiwan Semiconductor Manufacturing Co, Ltd.

Inventor： Wensen Hung ,  Szu-Po Huang ,  Hsiang-Fan Lee ,  Kim Hong Chen ,  Chi-Hsi Wu ,  Shin-Puu Jeng

IPC: H01L23/36 ,  H01L23/00 ,  H01L23/04 ,  H01L23/10 ,  H01L23/367 ,  H01L23/42 ,  H01L23/498 ,  H01L25/065 ,  H01L25/18

CPC classification number: H01L23/36 ,  H01L23/04 ,  H01L23/10 ,  H01L23/3675 ,  H01L23/3677 ,  H01L23/42 ,  H01L23/49822 ,  H01L23/49827 ,  H01L25/0652 ,  H01L25/0657 ,  H01L23/49816 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L25/18 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/29011 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/33519 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81815 ,  H01L2224/83191 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06568 ,  H01L2225/06589 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/15311 ,  H01L2924/16153 ,  H01L2924/16251 ,  H01L2924/1679 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105

Abstract: A package includes a substrate having a conductive layer, and the conductive layer comprises an exposed portion. A die stack is disposed over the substrate and electrically connected to the conductive layer. A high thermal conductivity material is disposed over the substrate and contacting the exposed portion of the conductive layer. The package further includes a contour ring over and contacting the high thermal conductivity material.

公开(公告)号：US11961779B2

公开(公告)日：2024-04-16

申请号：US17331945

申请日：2021-05-27

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Wensen Hung ,  Szu-Po Huang ,  Hsiang-Fan Lee ,  Kim Hong Chen ,  Chi-Hsi Wu ,  Shin-Puu Jeng

IPC: H01L23/36 ,  H01L23/00 ,  H01L23/04 ,  H01L23/10 ,  H01L23/367 ,  H01L23/42 ,  H01L23/498 ,  H01L25/065 ,  H01L25/18

CPC classification number: H01L23/36 ,  H01L23/04 ,  H01L23/10 ,  H01L23/3675 ,  H01L23/3677 ,  H01L23/42 ,  H01L23/49822 ,  H01L23/49827 ,  H01L25/0652 ,  H01L25/0657 ,  H01L23/49816 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L25/18 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/29011 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/33519 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81815 ,  H01L2224/83191 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06568 ,  H01L2225/06589 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/15311 ,  H01L2924/16153 ,  H01L2924/16251 ,  H01L2924/1679 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/131 ,  H01L2924/014 ,  H01L2224/291 ,  H01L2924/014

Abstract: A package includes a substrate having a conductive layer, and the conductive layer comprises an exposed portion. A die stack is disposed over the substrate and electrically connected to the conductive layer. A high thermal conductivity material is disposed over the substrate and contacting the exposed portion of the conductive layer. The package further includes a contour ring over and contacting the high thermal conductivity material.

公开(公告)号：US20210287956A1

公开(公告)日：2021-09-16

申请号：US17331945

申请日：2021-05-27

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Wensen Hung ,  Szu-Po Huang ,  Hsiang-Fan Lee ,  Kim Hong Chen ,  Chi-Hsi Wu ,  Shin-Puu Jeng

IPC: H01L23/36 ,  H01L23/04 ,  H01L23/10 ,  H01L25/065 ,  H01L23/367 ,  H01L23/42 ,  H01L23/498

Abstract: A package includes a substrate having a conductive layer, and the conductive layer comprises an exposed portion. A die stack is disposed over the substrate and electrically connected to the conductive layer. A high thermal conductivity material is disposed over the substrate and contacting the exposed portion of the conductive layer. The package further includes a contour ring over and contacting the high thermal conductivity material.