公开(公告)号：US20200251365A1

公开(公告)日：2020-08-06

申请号：US16857446

申请日：2020-04-24

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Powen HUANG ,  Yao-Yuan SHANG ,  Kuo-Shu TSENG ,  Yen-Yu CHEN ,  Chun-Chih LIN ,  Yi-Ming DAI

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/673 ,  H01L21/02 ,  G01D7/00 ,  G01D5/00

Abstract: A method for fault detection in a fabrication facility is provided. The method includes moving a wafer carrier along a predetermined path multiple times using a transportation apparatus. The method also includes collecting data associated with an environmental condition within the wafer carrier or around the wafer carrier using a metrology tool on the predetermined path in a previous movement of the transportation apparatus. The method further includes measuring the environmental condition within the wafer carrier or around the wafer carrier using the metrology tool during the movement of the wafer carrier. In addition, the method includes issuing a warning when the measured environmental condition is outside a range of acceptable values. The range of acceptable values is derived from the data collected in the previous movement of the transportation apparatus.

公开(公告)号：US20160293471A1

公开(公告)日：2016-10-06

申请号：US14674120

申请日：2015-03-31

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Yao-Yuan SHANG ,  Kuo-Shu TSENG ,  Chune-Te YANG ,  Chi-Hsin CHAN ,  Chung-Jhieh CHEN

IPC: H01L21/68 ,  H01L21/67 ,  H01L21/677 ,  H01L21/02 ,  H01L21/027 ,  H01L21/66 ,  G06T7/00 ,  H01L21/687

CPC classification number: H01L21/681 ,  G03F7/162 ,  G03F7/168 ,  G06T7/74 ,  G06T2207/30148 ,  H01L21/67051 ,  H01L21/6715 ,  H01L21/67259 ,  H01L21/67742 ,  H01L21/68707

Abstract: A method for positioning a wafer in semiconductor fabrication is provided. The method includes sending a wafer into a processing chamber by a transferring module. The method further includes producing a video image in relation to an edge of the wafer by a monitoring module. The method also includes performing an image analysis on the video image to determine if the edge of the wafer is in a correct position. If the edge of the wafer is not in a correct position a shifting value is calculated and the wafer is moved according to the shifting value.

Abstract translation: 提供了一种用于在半导体制造中定位晶片的方法。 该方法包括通过转移模块将晶片送入处理室。 该方法还包括通过监视模块产生相对于晶片边缘的视频图像。 该方法还包括对视频图像执行图像分析以确定晶片的边缘是否处于正确的位置。 如果晶片的边缘不在正确位置，则计算偏移值，并根据移动值移动晶片。

公开(公告)号：US20160276207A1

公开(公告)日：2016-09-22

申请号：US14658888

申请日：2015-03-16

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd

Inventor： Kuo-Shu TSENG ,  Chih-Hsien HUNG ,  Cheng-Yi LIN ,  You-Feng CHEN ,  Yao-Yuan SHANG

IPC: H01L21/687 ,  B08B9/093 ,  H01L21/67 ,  B08B9/08

CPC classification number: B08B9/00 ,  B08B9/0813 ,  B08B2203/0264 ,  H01L21/67051

Abstract: A cup-wash device is provided. The cup-wash device includes a supporting disk and a base disposed on the supporting disk. The base includes a catchment groove, a first dispensing opening formed on an edge of the base, and a first channel connected with the catchment groove and the first dispensing opening. The cup-wash device also includes a cover disposed on the base and covering the first channel, and the cover has an injection opening connected to the catchment groove.

Abstract translation: 提供洗杯装置。 杯洗装置包括支撑盘和设置在支撑盘上的底座。 基座包括集水槽，形成在基座的边缘上的第一分配开口以及与集流槽和第一分配开口连接的第一通道。 洗杯装置还包括设置在基座上并覆盖第一通道的盖，并且盖具有连接到集水槽的喷射开口。

公开(公告)号：US20150191816A1

公开(公告)日：2015-07-09

申请号：US14146996

申请日：2014-01-03

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Kuo-Shu TSENG ,  Chien-Hua CHEN ,  You-Feng CHEN ,  Yen-Yu CHEN ,  Zhong-Yi CHEN ,  Yung-Haw LIAW

IPC: C23C14/54 ,  H01L21/66 ,  H01L21/67 ,  H01L21/324 ,  H01L21/027

CPC classification number: H01L22/26 ,  H01L21/0276 ,  H01L21/67017 ,  H01L21/67253

Abstract: Embodiments of mechanisms for processing a wafer are provided. A method for processing a wafer includes placing the wafer into a processing assembly and heating the wafer. The method also includes producing an exhaust flow from the processing assembly via a fluid-conduit assembly. The method further includes detecting an exhaust pressure of the exhaust flow in the fluid-conduit assembly and producing a first signal and a second signal corresponding to the exhaust pressure. In addition, the method includes regulating the exhaust flow in response to the first signal and controlling the processing assembly in response to the second signal.

Abstract translation: 提供了用于处理晶片的机构的实施例。 用于处理晶片的方法包括将晶片放置在处理组件中并加热晶片。 该方法还包括经由流体 - 导管组件从处理组件产生排气流。 该方法还包括检测流体 - 导管组件中排气流的排气压力，并产生对应于排气压力的第一信号和第二信号。 此外，该方法包括响应于第一信号调节排气流量并响应于第二信号控制处理组件。

公开(公告)号：US20210202284A1

公开(公告)日：2021-07-01

申请号：US17100218

申请日：2020-11-20

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Tzu-Yang LIN ,  Cheng-Han WU ,  Chen-Yu LIU ,  Kuo-Shu TSENG ,  Shang-Sheng LI ,  Chen Yi HSU ,  Yu-Cheng CHANG

IPC: H01L21/67

Abstract: A lithography includes a storage tank that stores process chemical fluid, an anti-collision frame, and an integrated sensor assembly. The storage tank includes a dispensing port positioned at a lowest part of the storage tank in a gravity direction. The anti-collision frame is coupled to the storage tank. An integrated sensor assembly is disposed on at least one of the anti-collision frame and the storage tank to measure a variation in fluid quality in response to fluid quality measurement of fluid.

公开(公告)号：US20190164792A1

公开(公告)日：2019-05-30

申请号：US15879651

申请日：2018-01-25

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Powen HUANG ,  Yao-Yuan SHANG ,  Kuo-Shu TSENG ,  Yen-Yu CHEN ,  Chun-Chih LIN ,  Yi-Ming DAI

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/673 ,  H01L21/02 ,  G01D7/00 ,  G01D5/00

Abstract: A method for fault detection in a fabrication facility is provided. The method includes moving a wafer carrier using a transportation apparatus. The method further includes measuring an environmental condition within the wafer carrier or around the wafer carrier using a metrology tool positioned on the wafer carrier during the movement of the wafer carrier. The method also includes issuing a warning when the detected environmental condition is outside a range of acceptable values.

公开(公告)号：US20190163070A1

公开(公告)日：2019-05-30

申请号：US15877646

申请日：2018-01-23

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yao-Yuan SHANG ,  Kuo-Shu TSENG ,  Yen-Yu CHEN ,  Chun-Chih LIN ,  Yi-Ming DAI

IPC: G03F7/20

CPC classification number: G03F7/7085 ,  G03F7/70508 ,  G03F7/70733 ,  G03F7/70883

Abstract: A method for fault detection in a fabrication system is provided. The method includes transferring a reticle carrier containing a reticle from an original position to a destination position. The method further includes detecting environmental condition in the reticle carrier during the transfer of the reticle carrier using a metrology tool that is positioned at the reticle carrier. The method also includes issuing a warning when the detected environmental condition is outside a range of acceptable values.

公开(公告)号：US20170049221A1

公开(公告)日：2017-02-23

申请号：US14831502

申请日：2015-08-20

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Kuo-Shu TSENG ,  Yao-Yuan SHANG

IPC: A46B13/08

CPC classification number: A46B13/02 ,  A46B13/008

Abstract: A brush for back surface treatment (BST) is provided. The brush includes a base portion and a brushing portion. The brushing portion is connected to the base portion. The brushing portion has a plurality of gutters disposed on a surface away from the base portion, in which at least one of the gutters has at least one open end located at least partially on a perimeter of the surface.

Abstract translation: 提供背面处理刷（BST）。 刷子包括基部和刷涂部分。 刷洗部分连接到基部。 刷涂部分具有多个沟槽，其布置在远离基部的表面上，其中至少一个沟槽具有至少部分地位于表面的周边上的至少一个开口端。

公开(公告)号：US20150214027A1

公开(公告)日：2015-07-30

申请号：US14163045

申请日：2014-01-24

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd

Inventor： Kuo-Shu TSENG ,  Yao-Yuan SHANG ,  You-Feng CHEN

IPC: H01L21/02 ,  H01L21/67

CPC classification number: H01L21/67253 ,  H01L21/67046

Abstract: Embodiments of a wafer cleaning system and method are provided. A brush element is configured to clean a backside of the wafer. The backside has a clear area and an unclear area, and some contaminants are located in the unclear area. A control device performs a first cleaning process to the brush element when the brush element is located at the clear area, and the control device performs a second cleaning process when the brush element is located at the unclear area. The contaminants are cleaned by an enhanced cleaning process. Since the contaminants are cleaned, the backside of the wafer is flatter, and quality of the exposed photoresist on the wafer is improved.

Abstract translation: 提供了晶圆清洗系统和方法的实施例。 刷元件构造成清洁晶片的背面。 背面有一个清晰的区域和不清楚的区域，一些污染物位于不清楚的区域。 当刷元件位于透明区域时，控制装置对刷元件执行第一清洁处理，并且当刷元件位于不清楚区域时，控制装置执行第二清洁处理。 通过增强的清洁过程清洁污染物。 由于污染物被清洁，晶片的背面更平坦，并且提高了晶片上暴露的光致抗蚀剂的质量。

公开(公告)号：US20150179483A1

公开(公告)日：2015-06-25

申请号：US14135017

申请日：2013-12-19

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Kuo-Shu TSENG ,  You-Feng CHEN ,  Yen-Yu CHEN

IPC: H01L21/67 ,  B05B7/24

CPC classification number: H01L21/6715

Abstract: Embodiments of a photoresist supply system including a photoresist nozzle device are provided. The photoresist nozzle device includes a tube including a first segment, a curved segment connected to the first segment, and a second segment connected to the curved segment. The photoresist nozzle device also includes a nozzle connected to the second segment.

Abstract translation: 提供了包括光致抗蚀剂喷嘴装置的光致抗蚀剂供应系统的实施例。 光致抗蚀剂喷嘴装置包括管，其包括第一段，连接到第一段的弯曲段和连接到弯曲段的第二段。 光致抗蚀剂喷嘴装置还包括连接到第二段的喷嘴。