DEVICE AND METHOD FOR DATA-WRITING

    公开(公告)号:US20210174841A1

    公开(公告)日:2021-06-10

    申请号:US17183215

    申请日:2021-02-23

    Abstract: A device includes several first switching units and several second switching units. Each of the first switching units transmits in response to a first select signal, an auxiliary signal. Each of the second switching units is coupled to a corresponding one of the first switching units and transmits in response to a second select signal, a write voltage to a corresponding one of multiple circuit cells. The second switching units are coupled with each other in a node which receives the write voltage.

    DEVICE AND METHOD FOR DATA-WRITING
    3.
    发明申请

    公开(公告)号:US20190019541A1

    公开(公告)日:2019-01-17

    申请号:US16133283

    申请日:2018-09-17

    Abstract: A device includes a circuit cell, a voltage regulator, a first switching unit, a second switching unit, and a third switching unit. The voltage regulator is configured to output a write voltage. The first switching unit is configured to generate, in response to a control voltage, a current represented by an auxiliary signal. The second switching unit is configured to receive the auxiliary signal, and to turn on to transmit the auxiliary signal to the circuit cell. The third switching unit is configured to receive the write voltage, and to turn on to transmit the write voltage to the circuit cell.

    COOLING SYSTEM FOR 3D IC
    6.
    发明申请
    COOLING SYSTEM FOR 3D IC 有权
    3D IC冷却系统

    公开(公告)号:US20150059362A1

    公开(公告)日:2015-03-05

    申请号:US14013125

    申请日:2013-08-29

    Abstract: A system and method of cooling a three dimensional integrated circuit (3D IC) using at least one thermoelectric cooler which is connected to the 3D IC by a plurality of conductive pillars. In some embodiments a controller controls power supply to the thermoelectric cooler, and a temperature monitor provides a temperature input to the controller. In some embodiments the controller maintains a temperature of a 3D IC within a predetermined range by cycling power to the thermoelectric cooler.

    Abstract translation: 使用至少一个热电冷却器来冷却三维集成电路(3D IC)的系统和方法,其通过多个导电柱连接到3D IC。 在一些实施例中,控制器控制对热电冷却器的供电,并且温度监视器向控制器提供温度输入。 在一些实施例中,控制器通过循环到热电冷却器的功率将3D IC的温度保持在预定范围内。

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