Abstract:
A memory architecture includes: a plurality of cell arrays each of which comprises a plurality of bit cells, wherein each of bit cells of the plurality of cell arrays uses a respective variable resistance dielectric layer to transition between first and second logic states; and a control logic circuit, coupled to the plurality of cell arrays, and configured to cause a first information bit to be written into respective bit cells of a pair of cell arrays as an original logic state of the first information bit and a logically complementary logic state of the first information bit, wherein the respective variable resistance dielectric layers are formed by using a same recipe of deposition equipment and have different diameters.
Abstract:
A system and method of cooling a three dimensional integrated circuit (3D IC) using at least one thermoelectric cooler which is connected to the 3D IC by a plurality of conductive pillars. In some embodiments a controller controls power supply to the thermoelectric cooler, and a temperature monitor provides a temperature input to the controller. In some embodiments the controller maintains a temperature of a 3D IC within a predetermined range by cycling power to the thermoelectric cooler.
Abstract:
A bit line, which is coupled to a resistive element of a memory cell is set to a first voltage level. The memory cell may be an MRAM cell or an RRAM cell. The resistive element is configured to have a first resistance in a first state of the memory cell and a second resistance in a second state of the memory cell. A source line, which is selectively coupled to the memory cell by an access transistor, is set to a second voltage level. A word line signal is asserted to apply a first bias voltage across the resistive element. The applied first bias voltage initiates a write operation at the memory cell. The word line signal is deasserted after a variable time duration based on a detection, during the write operation, of a current through the resistive element.
Abstract:
A circuit includes a memory array having a plurality of memory cells; a control logic circuit, coupled to the memory array, and configured to use a first voltage signal to cause a first memory cell of the plurality of memory cells to transition from a first resistance state to a second resistance state, and a second voltage signal to cause the first memory cell to transition from the second resistance state to a third resistance state; and a counter circuit, coupled to the control logic circuit, and configured to increment a count by one in response to the first memory cell's transition from the first to the second resistance state, and again increment the count by one in response to the first memory cell's transition from the second to the third resistance state.
Abstract:
A memory architecture includes: a plurality of cell arrays each of which comprises a plurality of bit cells, wherein each of bit cells of the plurality of cell arrays uses a respective variable resistance dielectric layer to transition between first and second logic states; and a control logic circuit, coupled to the plurality of cell arrays, and configured to cause a first information bit to be written into respective bit cells of a pair of cell arrays as an original logic state of the first information bit and a logically complementary logic state of the first information bit, wherein the respective variable resistance dielectric layers are formed by using a same recipe of deposition equipment and have different diameters.
Abstract:
A device is disclosed that includes a driver and a plurality of resistive memory cells each being electrically connected to the driver through a first line. The driver has a variable resistance corresponding to various locations of a conducted resistive memory cell, relative to the driver, in the plurality of resistive memory cells.
Abstract:
A memory architecture includes: a first memory macro comprising a first plurality of memory cells that each comprises a first variable resistance dielectric layer with a first geometry parameter; and a second memory macro comprising a second plurality of memory cells that each comprises a second variable resistance dielectric layer with a second geometry parameter, wherein the first geometry parameter is different from the second geometry parameter thereby causing the first and second memory macros to have first and second endurances. The first and second variable resistance dielectric layers are formed using a single process recipe. The first endurance comprises a maximum number of cycles for which the first plurality of memory cells can transition between first and second logical states, and the second endurance comprises a maximum number of cycles for which the second plurality of memory cells can transition between the first and second logical states.
Abstract:
A memory assist apparatus includes a detection circuit and a compensation circuit. The detection circuit is configured to provide a detection signal indicating whether a bit line configured to provide read access to a data bit stored at a memory bit cell has a voltage below a predetermined threshold. The compensation circuit is configured to pull down the voltage of the bit line if the detection signal indicates that the voltage of the bit line is below the predetermined threshold.
Abstract:
A device is disclosed. The device includes a first memory cell, a second memory cell, a first pair of a driver and a sinker, and a second pair of a driver and a sinker. The first memory cell is coupled between the first pair of the driver and the sinker through a first line and a second line. The second memory cell is coupled between the second pair of the driver and the sinker through a third line and a fourth line. The first pair of the driver and the sinker are configured to be controlled to have resistances depending on a row location of the first memory cell in a memory column.
Abstract:
A thermometer circuit configured to estimate a monitored temperature is disclosed. The circuit includes an adjustable resistor presenting a first resistance value that is temperature-independent and a second resistance value that is temperature-dependent, wherein a first current signal is conducted across the resistor when it presents the first resistance value and a second current signal is conducted across the resistor when it presents the second resistance value; a plurality of gated conductors coupled to the resistor; and a control circuit, coupled to the resistor and the plurality of gated conductors, and configured to selectively deactivate at least one of the plurality of gated conductors to compare the first and second current signals to estimate the monitored temperature.