公开(公告)号：US20170221862A1

公开(公告)日：2017-08-03

申请号：US15485294

申请日：2017-04-12

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Chung-Cheng CHOU ,  Po-Hao LEE ,  Jonathan Tehan CHEN

IPC: H01L25/065 ,  H01L23/38 ,  F25B21/02

CPC classification number: H01L25/0657 ,  F25B21/02 ,  F25B2321/0212 ,  H01L23/38 ,  H01L2225/06513 ,  H01L2225/06544 ,  H01L2225/06589 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A system and method of cooling a three dimensional integrated circuit (3D IC) using at least one thermoelectric cooler which is connected to the 3D IC by a plurality of conductive pillars. In some embodiments a controller controls power supply to the thermoelectric cooler, and a temperature monitor provides a temperature input to the controller. In some embodiments the controller maintains a temperature of a 3D IC within a predetermined range by cycling power to the thermoelectric cooler.

公开(公告)号：US20210224154A1

公开(公告)日：2021-07-22

申请号：US17222919

申请日：2021-04-05

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chien-Yin LIU ,  Yu-Der CHIH ,  Hsueh-Chih YANG ,  Jonathan Tehan CHEN ,  Kuan-Chun CHEN

IPC: G06F11/10 ,  G11C16/26 ,  G11C29/42 ,  G11C29/52

Abstract: A method includes: retrieving a first word comprising a plurality of data bits and a plurality of parity bits that correspond to the first word, wherein the plurality of data bits form N−1 groups and the plurality of parity bits form a first group different from the N−1 groups, and N is a positive integer greater than 2; receiving a request to update respective data bits of a first one of the N−1 groups; and providing a second word comprising updated data bits that form a second one of the N−1 groups and a plurality of updated parity bits that correspond to the second word, wherein the plurality of updated parity bits form a second group that has a same group index as the first one of the N−1 groups.

公开(公告)号：US20190163568A1

公开(公告)日：2019-05-30

申请号：US15965883

申请日：2018-04-28

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chien-Yin LIU ,  Yu-Der CHIH ,  Hsueh-Chu YANG ,  Jonathan Tehan CHEN ,  Kuan-Chun CHEN

IPC: G06F11/10 ,  G11C16/26 ,  G11C11/56 ,  G11C29/42 ,  G11C29/52

Abstract: A method includes: retrieving a first word comprising a plurality of data bits and a plurality of parity bits that correspond to the first word, wherein the plurality of data bits form N−1 groups and the plurality of parity bits form a first group different from the N−1 groups, and N is a positive integer greater than 2; receiving a request to update respective data bits of a first one of the N−1 groups; and providing a second word comprising updated data bits that form a second one of the N−1 groups and a plurality of updated parity bits that correspond to the second word, wherein the plurality of updated parity bits form a second group that has a same group index as the first one of the N−1 groups.

公开(公告)号：US20150059362A1

公开(公告)日：2015-03-05

申请号：US14013125

申请日：2013-08-29

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chung-Cheng CHOU ,  Po-Hao LEE ,  Jonathan Tehan CHEN

IPC: F25B21/02

CPC classification number: H01L25/0657 ,  F25B21/02 ,  F25B2321/0212 ,  H01L23/38 ,  H01L2225/06513 ,  H01L2225/06544 ,  H01L2225/06589 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A system and method of cooling a three dimensional integrated circuit (3D IC) using at least one thermoelectric cooler which is connected to the 3D IC by a plurality of conductive pillars. In some embodiments a controller controls power supply to the thermoelectric cooler, and a temperature monitor provides a temperature input to the controller. In some embodiments the controller maintains a temperature of a 3D IC within a predetermined range by cycling power to the thermoelectric cooler.

Abstract translation: 使用至少一个热电冷却器来冷却三维集成电路（3D IC）的系统和方法，其通过多个导电柱连接到3D IC。 在一些实施例中，控制器控制对热电冷却器的供电，并且温度监视器向控制器提供温度输入。 在一些实施例中，控制器通过循环到热电冷却器的功率将3D IC的温度保持在预定范围内。