公开(公告)号：US20180151521A1

公开(公告)日：2018-05-31

申请号：US15880568

申请日：2018-01-26

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tzung-Hui Lee ,  Hung-Jui Kuo ,  Ming-Che Ho ,  Tzu-Yun Huang

IPC: H01L23/00

CPC classification number: H01L24/02 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/544 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/19 ,  H01L24/20 ,  H01L2221/68318 ,  H01L2221/68359 ,  H01L2221/68381 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2224/02315 ,  H01L2224/02331 ,  H01L2224/02373 ,  H01L2224/02379 ,  H01L2224/0401 ,  H01L2224/05024 ,  H01L2224/11015 ,  H01L2224/12105 ,  H01L2224/13026 ,  H01L2224/131 ,  H01L2224/14181 ,  H01L2224/16225 ,  H01L2224/16265 ,  H01L2924/014

Abstract: A redistribution circuit structure electrically connected to at least one conductor underneath is provided. The redistribution circuit structure includes a dielectric layer, an alignment, and a redistribution conductive layer. The dielectric layer covers the conductor and includes at least one contact opening for exposing the conductor. The alignment mark is disposed on the dielectric layer. The alignment mark includes a base portion on the dielectric layer and a protruding portion on the base portion, wherein a ratio of a maximum thickness of the protruding portion to a thickness of the base portion is smaller than 25%. The redistribution conductive layer is disposed on the dielectric layer. The redistribution conductive layer includes a conductive via, and the conductive via is electrically connected to the conductor through the contact opening. A method of fabricating the redistribution circuit structure and an integrated fan-out package are also provided.

公开(公告)号：US10163832B1

公开(公告)日：2018-12-25

申请号：US15795281

申请日：2017-10-27

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tzu-Yun Huang ,  Ming-Che Ho

IPC: H01L23/00 ,  H01L25/16

Abstract: A redistribution circuit structure electrically connected to a die underneath is provided. The redistribution circuit structure includes a dielectric layer and a conductive layer. The dielectric layer partially covers the die, so that a conductive pillar of the die is exposed by the dielectric layer. The conductive layer is disposed over the dielectric layer and electrically connected to the die by the conductive pillar. The conductive layer includes a multilayer structure, wherein an average grain size of one layer of the multilayer structure is less than or equal to 2 μm. A method of fabricating the redistribution circuit structure and an integrated fan-out package are also provided.

公开(公告)号：US09899342B2

公开(公告)日：2018-02-20

申请号：US15164888

申请日：2016-05-26

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tzung-Hui Lee ,  Hung-Jui Kuo ,  Ming-Che Ho ,  Tzu-Yun Huang

IPC: H01L23/00

CPC classification number: H01L24/02 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/544 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/19 ,  H01L24/20 ,  H01L2221/68318 ,  H01L2221/68359 ,  H01L2221/68381 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2224/02315 ,  H01L2224/02331 ,  H01L2224/02373 ,  H01L2224/02379 ,  H01L2224/0401 ,  H01L2224/05024 ,  H01L2224/11015 ,  H01L2224/12105 ,  H01L2224/13026 ,  H01L2224/131 ,  H01L2224/14181 ,  H01L2224/16225 ,  H01L2224/16265 ,  H01L2924/014

Abstract: A redistribution circuit structure electrically connected to at least one conductor underneath is provided. The redistribution circuit structure includes a dielectric layer, an alignment, and a redistribution conductive layer. The dielectric layer covers the conductor and includes at least one contact opening for exposing the conductor. The alignment mark is disposed on the dielectric layer. The alignment mark includes a base portion on the dielectric layer and a protruding portion on the base portion, wherein a ratio of a maximum thickness of the protruding portion to a thickness of the base portion is smaller than 25%. The redistribution conductive layer is disposed on the dielectric layer. The redistribution conductive layer includes a conductive via, and the conductive via is electrically connected to the conductor through the contact opening. A method of fabricating the redistribution circuit structure and an integrated fan-out package are also provided.

公开(公告)号：US10074623B2

公开(公告)日：2018-09-11

申请号：US15880568

申请日：2018-01-26

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tzung-Hui Lee ,  Hung-Jui Kuo ,  Ming-Che Ho ,  Tzu-Yun Huang

IPC: H01L23/00

CPC classification number: H01L24/02 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/544 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/19 ,  H01L24/20 ,  H01L2221/68318 ,  H01L2221/68359 ,  H01L2221/68381 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2224/02315 ,  H01L2224/02331 ,  H01L2224/02373 ,  H01L2224/02379 ,  H01L2224/0401 ,  H01L2224/05024 ,  H01L2224/11015 ,  H01L2224/12105 ,  H01L2224/13026 ,  H01L2224/131 ,  H01L2224/14181 ,  H01L2224/16225 ,  H01L2224/16265 ,  H01L2924/014

Abstract: A redistribution circuit structure electrically connected to at least one conductor underneath is provided. The redistribution circuit structure includes a dielectric layer, an alignment, and a redistribution conductive layer. The dielectric layer covers the conductor and includes at least one contact opening for exposing the conductor. The alignment mark is disposed on the dielectric layer. The alignment mark includes a base portion on the dielectric layer and a protruding portion on the base portion, wherein a ratio of a maximum thickness of the protruding portion to a thickness of the base portion is smaller than 25%. The redistribution conductive layer is disposed on the dielectric layer. The redistribution conductive layer includes a conductive via, and the conductive via is electrically connected to the conductor through the contact opening. A method of fabricating the redistribution circuit structure and an integrated fan-out package are also provided.

公开(公告)号：US20170271283A1

公开(公告)日：2017-09-21

申请号：US15164888

申请日：2016-05-26

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tzung-Hui Lee ,  Hung-Jui Kuo ,  Ming-Che Ho ,  Tzu-Yun Huang

IPC: H01L23/00

CPC classification number: H01L24/02 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/544 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/19 ,  H01L24/20 ,  H01L2221/68318 ,  H01L2221/68359 ,  H01L2221/68381 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2224/02315 ,  H01L2224/02331 ,  H01L2224/02373 ,  H01L2224/02379 ,  H01L2224/0401 ,  H01L2224/05024 ,  H01L2224/11015 ,  H01L2224/12105 ,  H01L2224/13026 ,  H01L2224/131 ,  H01L2224/14181 ,  H01L2224/16225 ,  H01L2224/16265 ,  H01L2924/014

Abstract: A redistribution circuit structure electrically connected to at least one conductor underneath is provided. The redistribution circuit structure includes a dielectric layer, an alignment, and a redistribution conductive layer. The dielectric layer covers the conductor and includes at least one contact opening for exposing the conductor. The alignment mark is disposed on the dielectric layer. The alignment mark includes a base portion on the dielectric layer and a protruding portion on the base portion, wherein a ratio of a maximum thickness of the protruding portion to a thickness of the base portion is smaller than 25%. The redistribution conductive layer is disposed on the dielectric layer. The redistribution conductive layer includes a conductive via, and the conductive via is electrically connected to the conductor through the contact opening. A method of fabricating the redistribution circuit structure and an integrated fan-out package are also provided.