公开(公告)号：US20170297904A1

公开(公告)日：2017-10-19

申请号：US15205619

申请日：2016-07-08

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Shiang-Chi Lin ,  Jung-Huei Peng ,  Yu-Chia Liu ,  Yi-Chien Wu

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0038 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2203/04 ,  B81B2207/012 ,  B81B2207/07 ,  B81C1/00285 ,  B81C2201/013 ,  B81C2201/016 ,  B81C2203/0109 ,  B81C2203/035 ,  B81C2203/0714 ,  B81C2203/0792

Abstract: A microelectromechanical systems (MEMS) package with high gettering efficiency is provided. A MEMS device is arranged over a logic chip, within a cavity that is hermetically sealed. A sensing electrode is arranged within the cavity, between the MEMS device and the logic chip. The sensing electrode is electrically coupled to the logic chip and is a conductive getter material configured to remove gas molecules from the cavity. A method for manufacturing the MEMS package is also provided.

公开(公告)号：US09938134B2

公开(公告)日：2018-04-10

申请号：US15205619

申请日：2016-07-08

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Shiang-Chi Lin ,  Jung-Huei Peng ,  Yu-Chia Liu ,  Yi-Chien Wu ,  Wei Siang Tan

IPC: B81B7/00 ,  B81C1/00 ,  B81B3/00 ,  H01L23/02 ,  H01L21/54 ,  H01L21/322 ,  H01L23/26 ,  H01L29/84 ,  H01L21/50

CPC classification number: B81B7/0038 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2203/04 ,  B81B2207/012 ,  B81B2207/07 ,  B81C1/00285 ,  B81C2201/013 ,  B81C2201/016 ,  B81C2203/0109 ,  B81C2203/035 ,  B81C2203/0714 ,  B81C2203/0792

Abstract: A microelectromechanical systems (MEMS) package with high gettering efficiency is provided. A MEMS device is arranged over a logic chip, within a cavity that is hermetically sealed. A sensing electrode is arranged within the cavity, between the MEMS device and the logic chip. The sensing electrode is electrically coupled to the logic chip and is a conductive getter material configured to remove gas molecules from the cavity. A method for manufacturing the MEMS package is also provided.