公开(公告)号：US20190273147A1

公开(公告)日：2019-09-05

申请号：US15909838

申请日：2018-03-01

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yu-Wen CHENG ,  Cheng-Tung LIN ,  Chih-Wei CHANG ,  Hong-Mao LEE ,  Ming-Hsing TSAI ,  Sheng-Hsuan LIN ,  Wei-Jung LIN ,  Yan-Ming TSAI ,  Yu-Shiuan WANG ,  Hung-Hsu CHEN ,  Wei-Yip LOH ,  Ya-Yi CHENG

IPC: H01L29/66 ,  H01L29/08 ,  H01L29/45 ,  H01L21/768 ,  H01L21/02 ,  H01L21/326 ,  H01L29/78

Abstract: Embodiments disclosed herein relate generally to forming an effective metal diffusion barrier in sidewalls of epitaxy source/drain regions. In an embodiment, a structure includes an active area having a source/drain region on a substrate, a dielectric layer over the active area and having a sidewall aligned with the sidewall of the source/drain region, and a conductive feature along the sidewall of the dielectric layer to the source/drain region. The source/drain region has a sidewall and a lateral surface extending laterally from the sidewall of the source/drain region, and the source/drain region further includes a nitrided region extending laterally from the sidewall of the source/drain region into the source/drain region. The conductive feature includes a silicide region along the lateral surface of the source/drain region and along at least a portion of the sidewall of the source/drain region.

公开(公告)号：US20190164822A1

公开(公告)日：2019-05-30

申请号：US15887819

申请日：2018-02-02

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tien-Pei CHOU ,  Ken-Yu CHANG ,  Chun-Chieh WANG ,  Yueh-Ching PAI ,  Yu-Ting LIN ,  Yu-Wen CHENG

IPC: H01L21/768 ,  H01L21/285 ,  H01L23/532 ,  H01L29/78 ,  H01L23/522

CPC classification number: H01L21/76846 ,  C23C16/02 ,  C23C16/0209 ,  C23C16/0227 ,  C23C16/45536 ,  H01L21/28518 ,  H01L21/76804 ,  H01L21/823431 ,  H01L23/5226 ,  H01L23/53209 ,  H01L29/41791 ,  H01L29/785 ,  H01L2029/7858

Abstract: The present disclosure relates generally to techniques for forming a continuous adhesion layer for a contact plug. A method includes forming an opening through a dielectric layer to an active area on a substrate. The method includes performing a first plasma treatment along a sidewall of the opening. The method includes performing an atomic layer deposition (ALD) process to form a metal nitride layer along the sidewall of the opening. The ALD process includes a plurality of cycles. Each cycle includes flowing a precursor to form a metal monolayer along the sidewall and performing a second plasma treatment to treat the metal monolayer with nitrogen. The method includes depositing a conductive material on the metal nitride layer in the opening to form a conductive feature.

公开(公告)号：US20190273023A1

公开(公告)日：2019-09-05

申请号：US15909762

申请日：2018-03-01

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Wei-Yip LOH ,  Chih-Wei CHANG ,  Hong-Mao LEE ,  Chun-Hsien HUANG ,  Yu-Ming HUANG ,  Yan-Ming TSAI ,  Yu-Shiuan WANG ,  Hung-Hsu CHEN ,  Yu-Kai CHEN ,  Yu-Wen CHENG

IPC: H01L21/768 ,  H01L21/8234 ,  H01L29/08 ,  H01L23/522

Abstract: Generally, examples are provided relating to conductive features that include a barrier layer, and to methods thereof. In an embodiment, a metal layer is deposited in an opening through a dielectric layer(s) to a source/drain region. The metal layer is along the source/drain region and along a sidewall of the dielectric layer(s) that at least partially defines the opening. The metal layer is nitrided, which includes performing a multiple plasma process that includes at least one directional-dependent plasma process. A portion of the metal layer remains un-nitrided by the multiple plasma process. A silicide region is formed, which includes reacting the un-nitrided portion of the metal layer with a portion of the source/drain region. A conductive material is disposed in the opening on the nitrided portions of the metal layer.