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公开(公告)号:US11983479B2
公开(公告)日:2024-05-14
申请号:US17885118
申请日:2022-08-10
发明人: Jung-Chan Yang , Ting-Wei Chiang , Jerry Chang-Jui Kao , Hui-Zhong Zhuang , Lee-Chung Lu , Li-Chun Tien , Meng-Hung Shen , Shang-Chih Hsieh , Chi-Yu Lu
IPC分类号: G06F30/394 , H01L23/522 , H01L23/528 , H01L27/02 , H01L27/118
CPC分类号: G06F30/394 , H01L23/5226 , H01L23/5286 , H01L27/0207 , H01L27/11807 , H01L2027/11887
摘要: A method of fabricating an integrated circuit includes placing a first set of conductive feature patterns on a first level, placing a second set of conductive feature patterns on a second level, placing a first set of via patterns between the second set of conductive feature patterns and the first set of conductive feature patterns, placing a third set of conductive feature patterns on a third level different from the first level and the second level, placing a second set of via patterns between the third set of conductive feature patterns and the second set of conductive feature patterns, and manufacturing the integrated circuit based on at least one of the above patterns of the integrated circuit.
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公开(公告)号:US20210297068A1
公开(公告)日:2021-09-23
申请号:US17339121
申请日:2021-06-04
发明人: Chi-Lin Liu , Ting-Wei Chiang , Jerry Chang-Jui Kao , Hui-Zhong Zhuang , Lee-Chung Lu , Shang-Chih Hsieh , Che Min Huang
IPC分类号: H03K3/3562 , G01R31/3185 , H01L27/092
摘要: In some embodiments, a flip-flop is disposed as an integrated circuit layout on a flip-flop region of a semiconductor substrate. The flip-flop includes a first clock inverter circuit that resides within the flip-flop region, and a second clock inverter circuit residing within the flip-flop region. The first clock inverter circuit and the second clock inverter circuit are disposed on a first line. Master switch circuitry is made up of a first plurality of devices which are circumscribed by a master switch perimeter that resides within the flip-flop region of the integrated circuit layout. The master switch circuitry and the first clock inverter circuit are disposed on a second line perpendicular to the first line. Slave switch circuitry is operably coupled to an output of the master switch circuitry. The slave switch circuitry is made up of a third plurality of devices that are circumscribed by a slave switch perimeter. The slave switch circuitry and the second clock inverter circuit are disposed on a third line that is in parallel with and spaced apart from the second line.
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公开(公告)号:US09171926B2
公开(公告)日:2015-10-27
申请号:US14543991
申请日:2014-11-18
发明人: Kuo-Nan Yang , Chou-Kun Lin , Jerry Chang-Jui Kao , Yi-Chuin Tsai , Chien-Ju Chao , Chung-Hsing Wang
IPC分类号: H01L21/8236 , H01L29/66 , H01L27/02 , H01L27/118 , H01L27/07 , H01L21/8234
CPC分类号: H01L29/66545 , H01L21/823412 , H01L27/0207 , H01L27/0705 , H01L27/11807
摘要: An integrated circuit includes a first and a second standard cell. The first standard cell includes a first gate electrode, and a first channel region underlying the first gate electrode. The first channel region has a first channel doping concentration. The second standard cell includes a second gate electrode, and a second channel region underlying the second gate electrode. The second channel region has a second channel doping concentration. A dummy gate includes a first half and a second half in the first and the second standard cells, respectively. The first half and the second half are at the edges of the first and the second standard cells, respectively, and are abutted to each other. A dummy channel is overlapped by the dummy gate. The dummy channel has a third channel doping concentration substantially equal to a sum of the first channel doping concentration and the second channel doping concentration.
摘要翻译: 集成电路包括第一和第二标准单元。 第一标准单元包括第一栅极电极和第一栅极电极下面的第一沟道区域。 第一通道区域具有第一通道掺杂浓度。 第二标准单元包括第二栅极电极和第二栅极电极下面的第二沟道区域。 第二沟道区具有第二沟道掺杂浓度。 虚拟栅极分别包括第一和第二标准单元中的前半部分和第二半部分。 第一半和第二半分别在第一标准单元和第二标准单元的边缘处并且彼此抵接。 虚拟通道由虚拟门重叠。 虚拟通道具有基本上等于第一通道掺杂浓度和第二通道掺杂浓度之和的第三通道掺杂浓度。
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公开(公告)号:US08937358B2
公开(公告)日:2015-01-20
申请号:US13874055
申请日:2013-04-30
发明人: Kuo-Nan Yang , Chou-Kun Lin , Jerry Chang-Jui Kao , Yi-Chuin Tsai , Chien-Ju Chao , Chung-Hsing Wang
CPC分类号: H01L29/66545 , H01L21/823412 , H01L27/0207 , H01L27/0705 , H01L27/11807
摘要: An integrated circuit includes a first and a second standard cell. The first standard cell includes a first gate electrode, and a first channel region underlying the first gate electrode. The first channel region has a first channel doping concentration. The second standard cell includes a second gate electrode, and a second channel region underlying the second gate electrode. The second channel region has a second channel doping concentration. A dummy gate includes a first half and a second half in the first and the second standard cells, respectively. The first half and the second half are at the edges of the first and the second standard cells, respectively, and are abutted to each other. A dummy channel is overlapped by the dummy gate. The dummy channel has a third channel doping concentration substantially equal to a sum of the first channel doping concentration and the second channel doping concentration.
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公开(公告)号:US20140239410A1
公开(公告)日:2014-08-28
申请号:US13829484
申请日:2013-03-14
发明人: Kuo-Nan Yang , Chou-Kun Lin , Jerry Chang-Jui Kao , Yi-Chuin Tsai , Chien-Ju Chao , Chung-Hsing Wang
IPC分类号: H01L27/02
CPC分类号: H01L27/0207 , H01L27/11807
摘要: A die includes a plurality of rows of standard cells. Each of all standard cells in the plurality of rows of standard cells includes a transistor and a source edge, wherein a source region of the transistor is adjacent to the source edge. No drain region of any transistor in the each of all standard cells is adjacent to the source region.
摘要翻译: 芯片包括多行标准单元。 多行标准单元中的每个标准单元包括晶体管和源极边缘,其中晶体管的源极区域与源极边缘相邻。 所有标准单元中的每一个中的任何晶体管的漏极区域都不与源极区域相邻。
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公开(公告)号:US10664565B2
公开(公告)日:2020-05-26
申请号:US15936712
申请日:2018-03-27
发明人: Chi-Lin Liu , Sheng-Hsiung Chen , Jerry Chang-Jui Kao , Fong-Yuan Chang , Lee-Chung Lu , Shang-Chih Hsieh , Wei-Hsiang Ma
IPC分类号: G06F17/50
摘要: A method (of expanding a set of standard cells which comprise a library, the library being stored on a non-transitory computer-readable medium) includes: selecting one ad hoc group amongst ad hoc groups of elementary standard cells which are recurrent resulting in a selected group such that the elementary standard cells in the selected group having connections so as to represent a corresponding logic circuit, each elementary standard cell representing a logic gate, and the selected group corresponding providing a selected logical function which is representable correspondingly as a selected Boolean expression; generating, in correspondence to the selected group, one or more macro standard cells; and adding the one or more macro standard cells to, and thereby expanding, the set of standard cells; and wherein at least one aspect of the method is executed by a processor of a computer.
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公开(公告)号:US09262573B2
公开(公告)日:2016-02-16
申请号:US13791406
申请日:2013-03-08
发明人: Kuo-Nan Yang , Chou-Kun Lin , Jerry Chang-Jui Kao , Yi-Chuin Tsai , Chien-Ju Chao , Chung-Hsing Wang
IPC分类号: G06F17/50
CPC分类号: G06F17/5072 , G06F17/5081
摘要: An embodiment cell shift scheme includes abutting a first transistor cell against a second transistor cell and shifting a place and route boundary away from a polysilicon disposed between the first transistor cell and the second transistor cell. In an embodiment, the cell shift scheme includes shifting the place and route boundary to prevent a mismatch between a layout versus schematic (LVS) netlist and a post-simulation netlist.
摘要翻译: 实施例小区移位方案包括将第一晶体管单元抵靠第二晶体管单元并将位置和布线边界移离设置在第一晶体管单元和第二晶体管单元之间的多晶硅。 在一个实施例中,小区移位方案包括移动位置和路由边界以防止布局与示意图(LVS)网表和后仿真网表之间的不匹配。
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公开(公告)号:US09047433B2
公开(公告)日:2015-06-02
申请号:US13874027
申请日:2013-04-30
发明人: Kuo-Nan Yang , Chou-Kun Lin , Jerry Chang-Jui Kao , Yi-Chuin Tsai , Chien-Ju Chao , Chung-Hsing Wang
IPC分类号: G06F17/50
CPC分类号: G06F17/5072
摘要: A die includes at least one standard cell, which includes a first boundary and a second boundary opposite to the first boundary. The first boundary and the second boundary are parallel to a first direction. The at least one standard cell further includes a first plurality of FinFETs including first semiconductor fins parallel to the first direction. The die further includes at least one memory macro, which has a third boundary and a fourth boundary opposite to the third boundary. The third boundary and the fourth boundary are parallel to the first direction. The at least one memory macro includes a second plurality of FinFETs including second semiconductor fins parallel to the first direction. All semiconductor fins in the at least one standard cell and the at least one memory macro have pitches equal to integer times of a minimum pitch of the first and the second semiconductor fins.
摘要翻译: 芯片包括至少一个标准单元,其包括与第一边界相对的第一边界和第二边界。 第一边界和第二边界平行于第一方向。 所述至少一个标准单元还包括第一多个FinFET,其包括平行于所述第一方向的第一半导体鳍片。 芯片还包括至少一个存储器宏,其具有与第三边界相反的第三边界和第四边界。 第三边界和第四边界与第一方向平行。 至少一个存储器宏包括第二多个FinFET,其包括平行于第一方向的第二半导体鳍片。 所述至少一个标准单元和所述至少一个存储器宏中的所有半导体鳍具有等于所述第一和第二半导体鳍的最小间距的整数倍的间距。
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公开(公告)号:US20140258952A1
公开(公告)日:2014-09-11
申请号:US13791406
申请日:2013-03-08
发明人: Kuo-Nan Yang , Chou-Kun Lin , Jerry Chang-Jui Kao , Yi-Chuin Tsai , Chien-Ju Chao , Chung-Hsing Wang
IPC分类号: G06F17/50
CPC分类号: G06F17/5072 , G06F17/5081
摘要: An embodiment cell shift scheme includes abutting a first transistor cell against a second transistor cell and shifting a place and route boundary away from a polysilicon disposed between the first transistor cell and the second transistor cell. In an embodiment, the cell shift scheme includes shifting the place and route boundary to prevent a mismatch between a layout versus schematic (LVS) netlist and a post-simulation netlist.
摘要翻译: 实施例小区移位方案包括将第一晶体管单元抵靠第二晶体管单元并将位置和布线边界移离设置在第一晶体管单元和第二晶体管单元之间的多晶硅。 在一个实施例中,小区移位方案包括移动位置和路由边界以防止布局与示意图(LVS)网表和后仿真网表之间的不匹配。
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公开(公告)号:US20140245248A1
公开(公告)日:2014-08-28
申请号:US13874027
申请日:2013-04-30
发明人: Kuo-Nan Yang , Chou-Kun Lin , Jerry Chang-Jui Kao , Yi-Chuin Tsai , Chien-Ju Chao , Chung-Hsing Wang
IPC分类号: G06F17/50
CPC分类号: G06F17/5072
摘要: A die includes at least one standard cell, which includes a first boundary and a second boundary opposite to the first boundary. The first boundary and the second boundary are parallel to a first direction. The at least one standard cell further includes a first plurality of FinFETs including first semiconductor fins parallel to the first direction. The die further includes at least one memory macro, which has a third boundary and a fourth boundary opposite to the third boundary. The third boundary and the fourth boundary are parallel to the first direction. The at least one memory macro includes a second plurality of FinFETs including second semiconductor fins parallel to the first direction. All semiconductor fins in the at least one standard cell and the at least one memory macro have pitches equal to integer times of a minimum pitch of the first and the second semiconductor fins.
摘要翻译: 芯片包括至少一个标准单元,其包括与第一边界相对的第一边界和第二边界。 第一边界和第二边界平行于第一方向。 所述至少一个标准单元还包括第一多个FinFET,其包括平行于所述第一方向的第一半导体鳍片。 芯片还包括至少一个存储器宏,其具有与第三边界相反的第三边界和第四边界。 第三边界和第四边界与第一方向平行。 至少一个存储器宏包括第二多个FinFET,其包括平行于第一方向的第二半导体鳍片。 所述至少一个标准单元和所述至少一个存储器宏中的所有半导体鳍片具有等于所述第一和第二半导体鳍片的最小间距的整数倍的间距。
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