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公开(公告)号：US10563006B2
公开(公告)日：2020-02-18
申请号：US15664156
申请日：2017-07-31
IPC分类号： C08G59/62 , C08G59/40 , H05K1/03 , C08G59/32 , C08G59/34 , C08G59/68 , C08J5/24 , C08L63/04 , H05K1/02 , C08L63/00 , C08K3/36
摘要： A resin composition is provided. The resin composition comprises an epoxy resin (A) and a first hardener (B) of the following formula (I): wherein Ar, R and n are as defined in the specification, and the molar ratio of the epoxy group of the epoxy resin to the active functional group of the first hardener ranges from about 1:0.4 to about 1:1.6.
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公开(公告)号：US11339258B2
公开(公告)日：2022-05-24
申请号：US16009266
申请日：2018-06-15
发明人： Chih-Wei Liao , Guan-Syun Tseng , Tsung-Hsien Lin , Ju-Ming Huang , Chen-Hua Yu
IPC分类号： C08J5/24 , C09D163/00 , C09D5/18 , B32B15/092 , H05K1/03 , H05K1/02 , H05K3/02 , C08L63/00 , B32B15/08 , B32B15/098 , B32B15/14 , C08G8/04 , C08G59/40 , C08G8/12 , C08J7/04 , C08L61/04 , C08L61/06 , C08K5/00 , C08K5/51 , C08K5/53 , C08K3/013 , C08K5/49 , C08K5/5313 , C09D161/04 , C09D161/06
摘要： A resin composition is provided. The resin composition comprises the following components: (A) a halogen-free epoxy resin; (B) a hardener; and (C) a phosphorus-containing phenolic resin of the following formula (I): wherein m, n, l, R1, and R2 are as defined in the specification.
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公开(公告)号：US10994516B2
公开(公告)日：2021-05-04
申请号：US15859829
申请日：2018-01-02
发明人： Chih-Wei Liao , Hsien-Te Chen , Tsung-Hsien Lin , Ju-Ming Huang
摘要： A resin composition is provided. The resin composition comprises the following components: (A) epoxy resin; (B) a cross-linking agent; (C) bismaleimide resin (BMI) represented by the following formula (I): wherein R1 is an organic group; and (D) a resin represented by the following formula (II): wherein n is an integer of 1 to 10.
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4.发明申请公开(公告)号：US20180044467A1
公开(公告)日：2018-02-15
申请号：US15664156
申请日：2017-07-31
CPC分类号： C08G59/621 , C08G59/3218 , C08G59/34 , C08G59/4014 , C08G59/4071 , C08G59/686 , C08J5/24 , C08J2363/00 , C08J2363/04 , C08J2463/00 , C08J2463/04 , C08J2463/08 , C08L63/00 , C08L63/04 , C08L2203/20 , C08L2205/02 , C08L2205/025 , C08L2205/035 , C08L2205/05 , H05K1/02 , H05K1/0326 , C08K3/36
摘要： A resin composition is provided. The resin composition comprises an epoxy resin (A) and a first hardener (B) of the following formula (I): wherein Ar, R and n are as defined in the specification, and the molar ratio of the epoxy group of the epoxy resin to the active functional group of the first hardener ranges from about 1:0.4 to about 1:1.6.
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5.发明授权公开(公告)号：US11414532B2
公开(公告)日：2022-08-16
申请号：US16123509
申请日：2018-09-06
发明人： Chih-Wei Liao , Guan-Syun Tseng , Tsung-Hsien Lin , Ju-Ming Huang
摘要： A resin composition is provided. The resin composition comprises the following constituents: (A) epoxy resin; (B) a compound of formula (I), in formula (I), R1 and R2 are independently —H, —CH3, or —C(CH3); and (C) an optional filler.
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公开(公告)号：US11001759B2
公开(公告)日：2021-05-11
申请号：US16009627
申请日：2018-06-15
IPC分类号： C09K21/12 , C08K5/5399 , C08K5/521 , C08K5/5313 , C08K3/36 , C08J3/24 , C08J5/24 , H05K1/03 , H05K3/02 , B32B5/02 , C08K5/523
摘要： A resin composition is provided. The resin composition comprises the following constituents: (A) an epoxy resin, which has at least two epoxy functional groups per molecule; (B) a reactive flame retardant with (a DOPO functional group) in structure; and (C) a non-reactive phosphorus-containing flame retardant, which is compatible with the other constituents of the resin composition.
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