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公开(公告)号：US20240150532A1
公开(公告)日：2024-05-09
申请号：US18054399
申请日：2022-11-10
发明人： Wei-Jung YANG , Meng-Huei CHEN
IPC分类号： C08J5/24 , C08K5/3492
CPC分类号： C08J5/246 , C08K5/3492 , C08J2371/12
摘要： A prepreg and uses thereof are provided. The prepreg includes an organic fiber woven fabric impregnated or coated with a thermally curable resin composition, wherein the thermally curable resin composition includes:
(A) a polyphenylene ether resin having an unsaturated functional group;
(B) a polyfunctional vinyl aromatic copolymer; and
(C) a compound having the structure of formula (I),
wherein, in formula (I), X is a C1-C10 linear or branched alkylene; and
the polyfunctional vinyl aromatic copolymer is prepared by copolymerizing one or more divinyl aromatic compounds with one or more monovinyl aromatic compounds.-
公开(公告)号：US11529797B2
公开(公告)日：2022-12-20
申请号：US15812243
申请日：2017-11-14
发明人： Wen-Ren Chen , Shur-Fen Liu
IPC分类号： B32B15/08 , C08J5/04 , C08J5/12 , B32B37/14 , H05K3/38 , H05K1/03 , B32B37/06 , H05K3/02 , C08J5/24 , B32B37/00 , B32B38/08 , B32B37/18
摘要： A method of manufacturing a metal-clad laminate and uses of the same are provided. The method comprises the following steps: (a) impregnating a reinforcement material with a first fluoropolymer solution, and drying the impregnated reinforcement material under a first temperature to obtain a first prepreg; (b) impregnating the first prepreg with a second fluoropolymer solution, and drying the impregnated first prepreg under a second temperature to obtain a second prepreg; and (c) laminating the second prepreg and a metal-clad to obtain a metal-clad laminate, wherein the first fluoropolymer solution has a first fluoropolymer, the second fluoropolymer solution has a second fluoropolymer, and the first fluoropolymer and the second fluoropolymer are different.
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3.发明授权公开(公告)号：US11414532B2
公开(公告)日：2022-08-16
申请号：US16123509
申请日：2018-09-06
发明人： Chih-Wei Liao , Guan-Syun Tseng , Tsung-Hsien Lin , Ju-Ming Huang
摘要： A resin composition is provided. The resin composition comprises the following constituents: (A) epoxy resin; (B) a compound of formula (I), in formula (I), R1 and R2 are independently —H, —CH3, or —C(CH3); and (C) an optional filler.
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公开(公告)号：US20200216626A1
公开(公告)日：2020-07-09
申请号：US16380833
申请日：2019-04-10
发明人： Shur-Fen LIU , Chin-Hsien HUNG
摘要： A prepreg is provided. The prepreg is prepared by impregnating a liquid crystal polymer non-woven fabric with a thermal-curable resin composition or by coating a thermal-curable resin composition onto a liquid crystal polymer non-woven fabric and drying the impregnated or coated liquid crystal polymer non-woven fabric, wherein the thermal-curable resin composition includes: (A) an unsaturated monomer; and (B) a cyclic olefin copolymer including the following repeating units: (B-1) a repeating unit of formula (I), (B-2) a repeating unit of formula (II), and (B-3) a repeating unit of formula (III), R1 to R22, m, n, o, and p in formulas (I) to (III) are as defined in the specification, wherein based on the total moles of the repeating units (B-1) to (B-3), the content of the repeating unit (B-2) is 19 mol % to 36 mol %, and wherein the weight ratio of the cyclic olefin copolymer (B) to the unsaturated monomer (A) is 0.5 to 7.
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公开(公告)号：US20200181402A1
公开(公告)日：2020-06-11
申请号：US16277069
申请日：2019-02-15
发明人： SHUR-FEN LIU , CHIN-HSIEN HUNG
摘要： A halogen-free low dielectric resin composition is provided. The halogen-free low dielectric resin composition comprises: (A) a resin system, which includes: (a1) a polyphenylene ether resin with unsaturated functional groups, and (a2) a polyfunctional vinyl aromatic copolymer; and (B) an allyl cyclophosphazene compound represented by the following formula (I): in formula (I), t is an integer ranging from 1 to 6, wherein, the polyfunctional vinyl aromatic copolymer (a2) is prepared by copolymerizing one or more divinyl aromatic compounds and one or more monovinyl aromatic compounds.
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公开(公告)号：US10662352B2
公开(公告)日：2020-05-26
申请号：US15956976
申请日：2018-04-19
发明人： Shur-fen Liu , Chin-Hsien Hung
IPC分类号： C09J123/36 , C09J123/26 , B32B3/30 , B32B5/02 , B32B7/12 , B32B15/20 , H05K3/02 , H05K1/03 , H05K3/38 , C09J123/08 , H05K1/09
摘要： An adhesive composition is provided including the following components: (A) an unsaturated monomer; and (B) an olefin copolymer comprising the following repeating units: (B-1) a repeating unit of formula (I), (B-2) a repeating unit of formula (II), and (B-3) a repeating unit of formula (III), R1 to R21, m, n, o, and p in formulas (I) to (III) are as defined in the specification, wherein based on the total moles of the repeating units (B-1), (B-2) and (B-3), the amount of the repeating unit (B-2) ranges from 19 mol % to 36 mol %; and wherein the weight ratio of the olefin copolymer (B) to the unsaturated monomer (A) ranges from 2 to 20.
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公开(公告)号：US20200053877A1
公开(公告)日：2020-02-13
申请号：US16145822
申请日：2018-09-28
发明人： Shur-Fen LIU , Chin-Hsien HUNG , Wei-Jung YANG , Chang-Chih LIU
IPC分类号： H05K1/03 , C08L9/00 , C08K5/3492 , C08F236/06 , C08F236/08 , C08F4/34
摘要： A dielectric composite is provided. The dielectric composite includes:at least one first dielectric layer; and at least one second dielectric layer, wherein the first dielectric layer has a thermal coefficient of dielectric constant (TCDk) not higher than −150 ppm/° C., and the second dielectric layer has a TCDK not lower than 50 ppm/° C.; and the dielectric composite has a dielectric constant (Dk) not lower than 4, and a TCDk ranging from 0 to −150 ppm/° C.
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8.发明申请公开(公告)号：US20190241733A1
公开(公告)日：2019-08-08
申请号：US16133083
申请日：2018-09-17
发明人： Chih-Wei LIAO , Ju-Ming HUANG , Guan-Syun TSENG
CPC分类号： C08L63/00 , C08K3/22 , C08K3/28 , C08K3/36 , C08K5/0066 , C08K5/18 , C08K5/3492 , C08K5/42 , C08L2201/02 , C08L2203/20 , H05K1/0373
摘要： A resin composition is provided. The resin composition includes the following constituents: (A) an epoxy resin; (B) an amino group-containing hardener; and (C) a compound of formula (I), wherein, R11 to R16 and A1 to A2 in formula (I) are as defined in the specification, and the amount of the compound (C) of formula (I) is about 10 parts by weight to about 85 parts by weight per 100 parts by weight of the epoxy resin (A).
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公开(公告)号：US10059841B2
公开(公告)日：2018-08-28
申请号：US14808393
申请日：2015-07-24
发明人： Shur-Fen Liu , Meng-Huei Chen
CPC分类号： C08L71/126 , B32B5/00 , B32B5/02 , B32B5/26 , B32B15/14 , B32B15/20 , B32B27/00 , B32B2250/40 , B32B2260/021 , B32B2260/046 , B32B2262/101 , B32B2307/204 , B32B2307/306 , B32B2307/3065 , B32B2307/542 , B32B2307/714 , B32B2307/7246 , B32B2307/726 , B32B2457/08 , C08G65/48 , C08J5/24 , C08J2371/12 , C08L2201/02 , C08L2312/00 , H05K3/0011
摘要： A resin composition is provided. The resin composition comprises: (a) a resin of formula (I): and (b) a solvent, wherein, X, Y, R1 to R4, A1, A2, m and n are as defined in the specification.
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公开(公告)号：US20180030267A1
公开(公告)日：2018-02-01
申请号：US15298568
申请日：2016-10-20
发明人： Shur-Fen Liu , Meng-Huei Chen
摘要： A resin composition is provided. The resin composition comprises the following components: (a) a thermal-curable resin system, which has a dielectric loss (Df) of not higher than 0.008 at 10 GHz and comprises a bismaleimide resin of the following formula (I), wherein M1 and the Z1 groups are as defined in the specification; and (b) an organic compound of the following formula (II) or formula (III), wherein R′, R11 to R19 and R21 to R28 are as defined in the specification, and wherein the amount of the organic compound (b) ranges from 1 wt % to 30 wt % based on the total weight of the resin system (a) and the organic compound (b).
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