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1.发明授权Slurry for slicing silicon ingot and method for slicing silicon ingot using the same 有权用于切片硅锭的浆料及其使用硅锭切片的方法公开(公告)号：US08075647B2
公开(公告)日：2011-12-13
申请号：US12441467
申请日：2006-10-20
CPC分类号： B28D5/007 , B28D5/045 , C09K3/1463 , Y02P70/179
摘要： The invention is a slurry for slicing a silicon ingot, containing a basic material, such as an alkali metal hydroxide, abrasive powder and water, in which the slurry contains the basic material in an amount of from 2 to 6% by mass and glycerin in an amount of from 25 to 55% by mass, based on a total mass of components of the slurry excluding the abrasive powder.
摘要翻译： 本发明是一种用于切割硅锭的浆料，其含有碱性物质如碱金属氢氧化物，磨料粉末和水，其中浆料含有2至6质量％的碱性物质，甘油在 相对于除研磨粉末以外的浆料的总质量，为25〜55质量％。
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公开(公告)号：US08256407B2
公开(公告)日：2012-09-04
申请号：US12666721
申请日：2007-06-27
IPC分类号： B28D1/06
CPC分类号： B24B27/0633 , B23D57/0023 , B23D57/0061 , B28D5/045
摘要： To provide a multi-wire saw that, at the start of cutting of an ingot, prevents a wire from being displaced in grooves of guide rollers due to the wire being lifted. A wire is wound around a plurality of wire guide rollers to be positioned in a feeding direction of an ingot, and in this state, a wire-lifting restraining member that is a body of rotation and restrains the wire from being lifted by being brought into contact with the wire is disposed near the wire guide rollers.
摘要翻译： 为了提供一种多线锯，其在开始切割锭时，由于导线被提升而防止导线在导向辊的槽中移位。 电线缠绕在多个电线导向辊上以沿铸锭的进给方向定位，并且在该状态下，作为转动体的线材举升限制部件被限制，并且通过进入 与导丝线接触设置在导丝辊附近。
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公开(公告)号：US20100163009A1
公开(公告)日：2010-07-01
申请号：US12666721
申请日：2007-06-27
IPC分类号： B28D1/06
CPC分类号： B24B27/0633 , B23D57/0023 , B23D57/0061 , B28D5/045
摘要： To provide a multi-wire saw that, at the start of cutting of an ingot, prevents a wire from being displaced in grooves of guide rollers due to the wire being lifted. A wire is wound around a plurality of wire guide rollers to be positioned in a feeding direction of an ingot, and in this state, a wire-lifting restraining member that is a body of rotation and restrains the wire from being lifted by being brought into contact with the wire is disposed near the wire guide rollers.
摘要翻译： 为了提供一种多线锯，其在开始切割锭时，由于导线被提升而防止导线在导向辊的槽中移位。 电线缠绕在多个电线导向辊上以沿铸锭的进给方向定位，并且在该状态下，作为转动体的线材举升限制部件被限制，并且通过进入 与导丝线接触设置在导丝辊附近。
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4.发明申请SLURRY FOR SLICING SILICON INGOT AND METHOD FOR SLICING SILICON INGOT USING THE SAME 有权用于切割硅芯的浆料以及使用该硅芯片切割硅芯片的方法公开(公告)号：US20100037880A1
公开(公告)日：2010-02-18
申请号：US12441467
申请日：2006-10-10
CPC分类号： B28D5/007 , B28D5/045 , C09K3/1463 , Y02P70/179
摘要： The invention is a slurry for slicing a silicon ingot, containing a basic material, such as an alkali metal hydroxide, abrasive powder and water, in which the slurry contains the basic material in an amount of from 2 to 6% by mass and glycerin in an amount of from 25 to 55% by mass, based on a total mass of components of the slurry excluding the abrasive powder.
摘要翻译： 本发明是一种用于切割硅锭的浆料，其含有碱性物质如碱金属氢氧化物，磨料粉末和水，其中浆料含有2至6质量％的碱性物质，甘油在 相对于除研磨粉末以外的浆料的总质量，为25〜55质量％。
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公开(公告)号：US07306508B2
公开(公告)日：2007-12-11
申请号：US10540020
申请日：2004-10-22
申请人： Takafumi Kawasaki , Hirozoh Tsuruta , Hirokazu Nishida , Seiichi Mimura , Masayuki Hamayasu , Hisashi Tominaga
发明人： Takafumi Kawasaki , Hirozoh Tsuruta , Hirokazu Nishida , Seiichi Mimura , Masayuki Hamayasu , Hisashi Tominaga
CPC分类号： B28D5/007 , B24B27/0633 , B28D5/045 , H01L21/304 , Y02P70/179
摘要： A multi-wire saw according to the present invention cuts a workpiece while supplying a slurry containing an alkali or mixed acid to a cutting interface between the workpiece and a wire, and includes: a storage tank with a heating mechanism for storing and heating the slurry; a thermal insulating pipe for transporting the slurry sent with a pump from the storage tank with a heating mechanism to a position before a position where the wire is incorporated into the workpiece, while keeping the slurry at a predetermined temperature; a thermostat for keeping a temperature in a vicinity of the workpiece fixed to a stage at the predetermined temperature; and a wire heating mechanism for heating the wire to the predetermined temperature. Consequently, the cutting resistance decreases during cutting machining of a silicon ingot, and the variation in the cutting resistance also decreases, whereby a high-quality wafer can be obtained at a high efficiency and a low cost.
摘要翻译： 根据本发明的多线锯在将含有碱或混合酸的浆料供给到工件和线材之间的切割界面的同时切割工件，并且包括：具有用于储存和加热浆料的加热机构的储罐 ; 绝热管，用于将具有加热机构的从所述储存罐输送的浆料输送到所述线材并入所述工件的位置之前，同时将所述浆料保持在预定温度; 用于将工件附近的温度固定在预定温度的台上的恒温器; 以及用于将线材加热到预定温度的线材加热机构。 因此，在硅锭的切割加工期间切削阻力降低，并且切削阻力的变化也降低，从而可以以高效率和低成本获得高质量的晶片。
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公开(公告)号：US20060249134A1
公开(公告)日：2006-11-09
申请号：US10540020
申请日：2004-10-22
申请人： Takafumi Kawasaki , Hirozoh Tsuruta , Hirokazu Nishida , Seiichi Mimura , Masayuki Hamayasu , Hisashi Tominaga
发明人： Takafumi Kawasaki , Hirozoh Tsuruta , Hirokazu Nishida , Seiichi Mimura , Masayuki Hamayasu , Hisashi Tominaga
IPC分类号： B28D1/08
CPC分类号： B28D5/007 , B24B27/0633 , B28D5/045 , H01L21/304 , Y02P70/179
摘要： A multi-wire saw according to the present invention cuts a workpiece while supplying a slurry containing an alkali or mixed acid to a cutting interface between the workpiece and a wire, and includes: a storage tank with a heating mechanism for storing and heating the slurry; a thermal insulating pipe for transporting the slurry sent with a pump from the storage tank with a heating mechanism to a position before a position where the wire is incorporated into the workpiece, while keeping the slurry at a predetermined temperature; a thermostat for keeping a temperature in a vicinity of the workpiece fixed to a stage at the predetermined temperature; and a wire heating mechanism for heating the wire to the predetermined temperature. Consequently, the cutting resistance decreases during cutting machining of a silicon ingot, and the variation in the cutting resistance also decreases, whereby a high-quality wafer can be obtained at a high efficiency and a low cost.
摘要翻译： 根据本发明的多线锯在将含有碱或混合酸的浆料供给到工件和线材之间的切割界面的同时切割工件，并且包括：具有用于储存和加热浆料的加热机构的储罐 ; 绝热管，用于将具有加热机构的从所述储存罐输送的浆料输送到所述线材并入所述工件的位置之前，同时将所述浆料保持在预定温度; 用于将工件附近的温度固定在预定温度的台上的恒温器; 以及用于将线材加热到预定温度的线材加热机构。 因此，在硅锭的切割加工期间切削阻力降低，并且切削阻力的变化也降低，从而可以以高效率和低成本获得高质量的晶片。
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7.发明申请Slurry for slicing silicon ingot and method for slicing silicon ingot using same 审中-公开用于切片硅锭的浆料和使用该硅锭切片硅锭的方法公开(公告)号：US20060075687A1
公开(公告)日：2006-04-13
申请号：US10540480
申请日：2004-10-12
CPC分类号： C09K3/1463 , B28D5/007 , Y02P70/179 , Y10T83/04
摘要： In a slurry for cutting a silicon ingot according to the present invention, a content of a basic material is at least 3.5% by mass with respect to the total mass of a liquid component of a slurry, organic amine is contained in a mass ratio of 0.5 to 5.0 with respect to water in a liquid component of the slurry, and pH of the slurry is 12 or more. Furthermore, according to a method of cutting a silicon ingot according to the present invention, the above-mentioned slurry for cutting a silicon ingot is used at 65° C. to 95° C. Consequently, the cutting resistance during cutting processing of a silicon ingot is reduced, and a wafer of high quality can be obtained efficiently.
摘要翻译： 在根据本发明的用于切割硅锭的浆料中，碱性物质的含量相对于浆料的液体成分的总质量为至少3.5质量％，以质量比计含有有机胺 相对于浆液的液体成分中的水为0.5〜5.0，浆料的pH为12以上。 此外，根据本发明的硅锭的切割方法，上述用于切割硅锭的浆料在65℃〜95℃下使用。因此，在硅的切割加工过程中的切削阻力 锭减少，可以有效地获得高质量的晶片。
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公开(公告)号：US07927853B2
公开(公告)日：2011-04-19
申请号：US11473272
申请日：2006-06-23
CPC分类号： C12N9/93
摘要： It is intended to obtain DNA ligase improved in binding ability and reactivity with DNA, particularly thermostable DNA ligase improved in binding ability and reactivity with DNA. The present invention provides a DNA ligase mutant improved in binding ability and reactivity with DNA, which is obtained by partially or completely deleting a C-terminal helix portion of DNA ligase. Particularly, the mutant is derived from a thermostable bacterium.
摘要翻译： 旨在获得提高与DNA的结合能力和反应性的DNA连接酶，特别是耐热DNA连接酶，其与DNA的结合能力和反应性提高。 本发明提供了通过部分或完全缺失DNA连接酶的C末端螺旋部分获得的与DNA的结合能力和反应性提高的DNA连接酶突变体。 特别地，突变体来自耐热细菌。
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公开(公告)号：US20070037190A1
公开(公告)日：2007-02-15
申请号：US11473272
申请日：2006-06-23
CPC分类号： C12N9/93
摘要： It is intended to obtain DNA ligase improved in binding ability and reactivity with DNA, particularly thermostable DNA ligase improved in binding ability and reactivity with DNA. The present invention provides a DNA ligase mutant improved in binding ability and reactivity with DNA, which is obtained by partially or completely deleting a C-terminal helix portion of DNA ligase. Particularly, the mutant is derived from a thermostable bacterium.
摘要翻译： 旨在获得提高与DNA的结合能力和反应性的DNA连接酶，特别是耐热DNA连接酶，其与DNA的结合能力和反应性提高。 本发明提供了通过部分或完全缺失DNA连接酶的C末端螺旋部分获得的与DNA的结合能力和反应性提高的DNA连接酶突变体。 特别地，突变体来自耐热细菌。
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公开(公告)号：US20090061481A1
公开(公告)日：2009-03-05
申请号：US12028372
申请日：2008-02-08
申请人： Hirokazu Nishida , Maiko Tanabe
发明人： Hirokazu Nishida , Maiko Tanabe
CPC分类号： C12N9/93
摘要： Disclosed is a modified hyperthermophilic DNA ligase having improved DNA binding ability and reactivity. The modified hyperthermophilic DNA ligase has an amino acid sequence corresponding to the amino acid sequence of a heat-resistant DNA ligase derived from a thermophilic bacterium, a hyperthermophilic bacterium, a thermophilic archaebacterium, or a hyperthermophilic archaebacterium, except with at least two of charged amino acids in the C-terminal helix region each being substituted by alanine, threonine, or serine residues.
摘要翻译： 公开了具有改进的DNA结合能力和反应性的改良的超嗜热DNA连接酶。 修饰的超嗜热DNA连接酶具有对应于源自嗜热细菌，嗜热细菌，嗜热古细菌或超嗜热古细菌的耐热DNA连接酶的氨基酸序列的氨基酸序列，除了至少两个带电氨基 C-末端螺旋区域中的酸各自被丙氨酸，苏氨酸或丝氨酸残基取代。
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