公开(公告)号：US20120138923A1

公开(公告)日：2012-06-07

申请号：US13379670

申请日：2010-04-06

申请人： Takeshi Hara ,  Hirohiko Nishiki ,  Yoshimasa Chikawa ,  Kazuo Nakagawa ,  Yoshifumi Ohta ,  Tetsuya Aita ,  Masahiko Suzuki ,  Okifumi Nakagawa ,  Yoshiyuki Miyajima ,  Yuuji Mizuno ,  Hinae Mizuno ,  Michiko Takei ,  Yoshiyuki Harumoto

发明人： Takeshi Hara ,  Hirohiko Nishiki ,  Yoshimasa Chikawa ,  Kazuo Nakagawa ,  Yoshifumi Ohta ,  Tetsuya Aita ,  Masahiko Suzuki ,  Okifumi Nakagawa ,  Yoshiyuki Miyajima ,  Yuuji Mizuno ,  Hinae Mizuno ,  Michiko Takei ,  Yoshiyuki Harumoto

IPC分类号： H01L29/786 ,  H01L21/336

CPC分类号： H01L27/1288 ,  H01L27/1225 ,  H01L29/7869

摘要： The present invention provides a thin film transistor including an oxide semiconductor layer (4) for electrically connecting a signal electrode (6a) and a drain electrode (7a), the an oxide semiconductor layer being made from an oxide semiconductor; and a barrier layer (6b) made from at least one selected from the group consisting of Ti, Mo, W, Nb, Ta, Cr, nitrides thereof, and alloys thereof, the barrier layer (6b) being in touch with the signal electrode (6a) and the oxide semiconductor layer (4) and separating the signal electrode (6a) from the oxide semiconductor layer (4). Because of this configuration, the thin film transistor can form and maintain an ohmic contact between the first electrode and the channel layer, thereby being a thin film transistor with good properties.

摘要翻译： 本发明提供了一种薄膜晶体管，其包括用于电连接信号电极（6a）和漏电极（7a）的氧化物半导体层（4），所述氧化物半导体层由氧化物半导体制成; 以及由选自Ti，Mo，W，Nb，Ta，Cr，氮化物中的至少一种及其合金制成的阻挡层（6b），阻挡层（6b）与信号电极 （6a）和氧化物半导体层（4），并且将信号电极（6a）与氧化物半导体层（4）分离。 由于这种结构，薄膜晶体管可以在第一电极和沟道层之间形成并保持欧姆接触，从而成为具有良好性能的薄膜晶体管。

公开(公告)号：US09024311B2

公开(公告)日：2015-05-05

申请号：US13379670

申请日：2010-04-06

申请人： Takeshi Hara ,  Hirohiko Nishiki ,  Yoshimasa Chikama ,  Kazuo Nakagawa ,  Yoshifumi Ohta ,  Tetsuya Aita ,  Masahiko Suzuki ,  Okifumi Nakagawa ,  Yoshiyuki Miyajima ,  Michiko Takei ,  Yoshiyuki Harumoto ,  Hinae Mizuno

发明人： Takeshi Hara ,  Hirohiko Nishiki ,  Yoshimasa Chikama ,  Kazuo Nakagawa ,  Yoshifumi Ohta ,  Tetsuya Aita ,  Masahiko Suzuki ,  Okifumi Nakagawa ,  Yoshiyuki Miyajima ,  Yuuji Mizuno ,  Michiko Takei ,  Yoshiyuki Harumoto

IPC分类号： H01L29/786 ,  H01L21/336 ,  H01L27/12

CPC分类号： H01L27/1288 ,  H01L27/1225 ,  H01L29/7869

摘要： The present invention provides a thin film transistor including an oxide semiconductor layer (4) for electrically connecting a signal electrode (6a) and a drain electrode (7a), the an oxide semiconductor layer being made from an oxide semiconductor; and a barrier layer (6b) made from at least one selected from the group consisting of Ti, Mo, W, Nb, Ta, Cr, nitrides thereof, and alloys thereof, the barrier layer (6b) being in touch with the signal electrode (6a) and the oxide semiconductor layer (4) and separating the signal electrode (6a) from the oxide semiconductor layer (4). Because of this configuration, the thin film transistor can form and maintain an ohmic contact between the first electrode and the channel layer, thereby being a thin film transistor with good properties.

摘要翻译： 本发明提供了一种薄膜晶体管，其包括用于电连接信号电极（6a）和漏电极（7a）的氧化物半导体层（4），所述氧化物半导体层由氧化物半导体制成; 以及由选自Ti，Mo，W，Nb，Ta，Cr，氮化物中的至少一种及其合金制成的阻挡层（6b），阻挡层（6b）与信号电极 （6a）和氧化物半导体层（4），并且将信号电极（6a）与氧化物半导体层（4）分离。 由于这种结构，薄膜晶体管可以在第一电极和沟道层之间形成并保持欧姆接触，从而成为具有良好性能的薄膜晶体管。

公开(公告)号：US20070121304A1

公开(公告)日：2007-05-31

申请号：US11604336

申请日：2006-11-27

申请人： Naofumi Okayama ,  Yoshiyuki Miyajima ,  Kiyozumi Gotou

发明人： Naofumi Okayama ,  Yoshiyuki Miyajima ,  Kiyozumi Gotou

IPC分类号： H05K7/00

CPC分类号： H05K7/02 ,  H01R12/7023 ,  H01R12/7058 ,  H05K1/119 ,  H05K3/301 ,  H05K3/306 ,  H05K2201/09854 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/10598 ,  H05K2201/10863 ,  H05K2201/2027

摘要： The invention provides a printed circuit board capable of preventing an electronic component from tilting or uplifting without adopting special structures in an existing electronic component. The printed circuit board has an engagement portion and terminal holes and for mounting an electronic component, comprising narrowed portions and having substantially the same width as the mounting leg portions and connecting terminals of the electronic component, and guidance portions having a width wider than the narrowed portion, wherein the mounting leg portions and connecting terminals are inserted to the guidance portion, and the electronic component is moved via sliding motion, by which the mounting leg portions and the connecting terminals are supported tightly in the narrowed portion. Thus, it becomes possible to prevent the displacement or tilt of the electronic component.

摘要翻译： 本发明提供一种印刷电路板，其能够防止电子部件在现有电子部件中不采用特殊结构而倾斜或抬起。 印刷电路板具有接合部分和端子孔，并且用于安装电子部件，包括狭窄部分，并且具有与电子部件的安装腿部和连接端子基本相同的宽度，以及宽度比狭窄宽度的引导部分 其中安装脚部分和连接端子被插入到引导部分中，并且电子部件通过滑动运动移动，安装脚部分和连接端子紧紧地被支撑在狭窄部分中。 因此，可以防止电子部件的位移或倾斜。

公开(公告)号：US06853091B2

公开(公告)日：2005-02-08

申请号：US10627710

申请日：2003-07-28

申请人： Yoshiyuki Miyajima

发明人： Yoshiyuki Miyajima

IPC分类号： B23K1/00 ,  H05K1/02 ,  H05K1/11 ,  H05K3/34 ,  H01K23/48

CPC分类号： H05K1/116 ,  B23K1/0016 ,  B23K2101/42 ,  H05K1/0201 ,  H05K3/3447 ,  H05K3/3452 ,  H05K2201/062 ,  H05K2201/09381 ,  H05K2201/0969 ,  H05K2201/0989

摘要： A printed circuit board having circuit patterns printed thereon has a plurality of composite lands each including a first land having a terminal hole formed at its center for inserting the terminal of a selected electric or electronic part or device, and a plurality of second lands each being contiguous to and extending outwards from the first land. The areas contiguous to the contours of the first and second lands have no conductive foils, such as copper foils, thereon such that the substrate surface of the printed circuit board is exposed in these areas. The exposed areas are effective to confine the thermal energy in the limited areas for soldering. And the composite land shape defines a ridged cone-like solder lump, which can fixedly grip the terminal of the part or device.

摘要翻译： 具有印刷电路图案的印刷电路板具有多个复合凸台，每个复合凸台包括第一凸台，该第一凸台具有形成在其中心的端子孔，用于插入所选择的电气或电子部件或装置的端子，以及多个第二凸台 与第一个土地相邻并向外延伸。 与第一和第二焊盘的轮廓相邻的区域在其上没有导电箔，例如铜箔，使得印刷电路板的衬底表面暴露在这些区域中。 暴露的区域有效地将热能限制在有限的焊接区域。 并且复合平台形状限定了脊状的锥形焊料块，其可以固定地夹持部件或装置的端子。