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公开(公告)号:US09512329B2
公开(公告)日:2016-12-06
申请号:US14119342
申请日:2012-05-23
申请人: Takeshi Nobukuni , Yoshihiro Kato , Meguru Ito , Tomoki Hamajima
发明人: Takeshi Nobukuni , Yoshihiro Kato , Meguru Ito , Tomoki Hamajima
IPC分类号: B32B15/092 , B32B27/04 , B32B27/20 , B32B27/26 , B32B27/38 , C08L63/00 , C08G59/24 , C08G59/32 , C08G59/38 , C08G59/40 , C08K3/22 , C08K3/26 , C08K3/28 , C08K3/34 , C08K3/36 , C08K3/38 , C08K5/5415 , C09D163/00 , C08J5/24 , H05K1/03
CPC分类号: C09D163/00 , C08G59/245 , C08G59/38 , C08G59/4014 , C08J5/24 , C08J2363/00 , C08J2479/04 , C08J2483/04 , C08L63/00 , H05K1/0353 , H05K1/0373 , H05K2201/012 , H05K2201/0209 , H05K2201/0212 , Y10T428/31529 , Y10T442/2008 , Y10T442/2951 , C08L79/04 , C08L83/04
摘要: A resin composition contains a cyanate ester compound, a maleimide compound, an epoxy resin, a silicone rubber powder, and an inorganic filler. The cyanate ester compound contains a compound represented by the following formula. The silicone rubber powder is contained in an amount of 40 to 150 parts by mass based on 100 parts by mass in total of the cyanate ester compound, the maleimide compound, and the epoxy resin. The inorganic filler is contained in an amount of 100 to 340 parts by mass based on 100 parts by mass in total of the cyanate ester compound, the maleimide compound, and the epoxy resin. A total content of the silicone rubber powder and the inorganic filler is 140 to 380 parts by mass based on 100 parts by mass in total of the cyanate ester compound, the maleimide compound, and the epoxy resin.
摘要翻译: 提供了具有优异的耐热性,阻燃性和成型性,并且能够特别提供具有低热膨胀系数的树脂固化产物的树脂组合物。 根据本发明的树脂组合物含有氰酸酯化合物(A),马来酰亚胺化合物(B),环氧树脂(C),硅橡胶粉末(D)和无机填料(E)。 氰酸酯化合物(A)含有下式(I)表示的化合物。 相对于氰酸酯化合物(A),马来酰亚胺化合物(B)和环氧树脂(C)总计100质量份,硅橡胶粉末(D)的含量为40〜150质量份, 。 相对于氰酸酯化合物(A),马来酰亚胺化合物(B)和环氧树脂(C)的总计100质量份,无机填料(E)的含量为100〜340质量份。 相对于氰酸酯化合物(A),马来酰亚胺化合物(B)和马来酰亚胺化合物(B)的总量为100质量份,硅橡胶粉末(D)和无机填料(E)的总含量为140〜380质量份 环氧树脂(C)。 (其中R表示氢原子或甲基,n表示1以上的整数)
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公开(公告)号:US20140227924A1
公开(公告)日:2014-08-14
申请号:US14119342
申请日:2012-05-23
申请人: Takeshi Nobukuni , Yoshihiro Kato , Meguru Ito , Tomoki Hamajima
发明人: Takeshi Nobukuni , Yoshihiro Kato , Meguru Ito , Tomoki Hamajima
IPC分类号: C09D163/00 , H05K1/03
CPC分类号: C09D163/00 , C08G59/245 , C08G59/38 , C08G59/4014 , C08J5/24 , C08J2363/00 , C08J2479/04 , C08J2483/04 , C08L63/00 , H05K1/0353 , H05K1/0373 , H05K2201/012 , H05K2201/0209 , H05K2201/0212 , Y10T428/31529 , Y10T442/2008 , Y10T442/2951 , C08L79/04 , C08L83/04
摘要: A resin composition contains a cyanate ester compound, a maleimide compound, an epoxy resin, a silicone rubber powder, and an inorganic filler. The cyanate ester compound contains a compound represented by the following formula. The silicone rubber powder is contained in an amount of 40 to 150 parts by mass based on 100 parts by mass in total of the cyanate ester compound, the maleimide compound, and the epoxy resin. The inorganic filler is contained in an amount of 100 to 340 parts by mass based on 100 parts by mass in total of the cyanate ester compound, the maleimide compound, and the epoxy resin. A total content of the silicone rubber powder and the inorganic filler is 140 to 380 parts by mass based on 100 parts by mass in total of the cyanate ester compound, the maleimide compound, and the epoxy resin.
摘要翻译: 树脂组合物含有氰酸酯化合物,马来酰亚胺化合物,环氧树脂,硅橡胶粉末和无机填料。 氰酸酯化合物含有下式表示的化合物。 相对于氰酸酯化合物,马来酰亚胺化合物和环氧树脂的总计100质量份,硅橡胶粉末的含量为40〜150质量份。 相对于氰酸酯化合物,马来酰亚胺化合物和环氧树脂的总计100质量份,无机填料的含量为100〜340质量份。 相对于氰酸酯化合物,马来酰亚胺化合物和环氧树脂的总计100质量份,硅橡胶粉末和无机填料的总含量为140〜380质量份。
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