公开(公告)号：US06289256B1

公开(公告)日：2001-09-11

申请号：US09008611

申请日：1998-01-15

申请人： Takeshi Takeda ,  Yoshihiro Mimura ,  Noriaki Yoshida ,  Akira Kabeshita

发明人： Takeshi Takeda ,  Yoshihiro Mimura ,  Noriaki Yoshida ,  Akira Kabeshita

IPC分类号： G06F1900

CPC分类号： G05B19/416 ,  G05B2219/43155 ,  G05B2219/45029 ,  Y10T29/53178

摘要： A control device controls to move a chucking mechanism part to a first stop height 451 at a first speed, then at a second speed lower than the first speed before the chucking mechanism part comes in touch with a part from the first stop height, and stop when the chucking mechanism part touches the part, thereby to hold the part. So, a shock to the part when the part is held is reduced in the constitution, and the apparatus becomes light-weight because of the elimination of a shock-absorbing mechanism, hence realizing high-speed mounting.

摘要翻译： 控制装置控制将夹紧机构部件以第一速度移动到第一停止高度451，然后以比第一速度低的第二速度移动到夹紧机构部分与第一停止高度部分接触之前，并且停止 当夹紧机构部分接触该部分时，从而保持该部分。 因此，当部件保持时对部件的冲击减小，并且由于消除了减震机构而使设备变得轻巧，从而实现了高速安装。

公开(公告)号：US06466837B1

公开(公告)日：2002-10-15

申请号：US09308889

申请日：1999-07-08

申请人： Yoshihiro Mimura ,  Noriaki Yoshida ,  Akira Kabeshita

发明人： Yoshihiro Mimura ,  Noriaki Yoshida ,  Akira Kabeshita

IPC分类号： G06F700

CPC分类号： H05K13/0478 ,  H05K13/0409 ,  H05K13/0452 ,  H05K13/0812 ,  Y10T29/53178

摘要： A parts mounter including a unit for supplying a part, circuit board supporting means for fastening a circuit board when mounting a part, parts mounting means including a mechanism loaded with a suction nozzle and for vertically moving the suction nozzle when sucking and holding a part, and for positioning the suction nozzle at any position, and nozzle exchanging means including a mechanism for removing and installing a requested suction nozzle from and to the parts mounting means. The parts mounting means further includes a nozzle existence checking sensor for performing detection of conditions of a suction nozzle loaded to the parts mounting means.

摘要翻译： 一种零件安装机，包括用于供应零件的单元，用于在安装零件时紧固电路板的电路板支撑装置，包括装有吸嘴的机构的部件安装装置，以及用于在吸入和保持部件时垂直移动吸嘴， 并且用于将吸嘴定位在任何位置，以及喷嘴更换装置，其包括用于从所述部件安装装置移除和安装所要求的吸嘴的机构。 部件安装装置还包括用于检测装载到部件安装装置的吸嘴的状态的喷嘴存在检查传感器。

公开(公告)号：US07231709B2

公开(公告)日：2007-06-19

申请号：US11431751

申请日：2006-05-11

申请人： Noriaki Yoshida ,  Takeshi Takeda ,  Akira Kabeshita

发明人： Noriaki Yoshida ,  Takeshi Takeda ,  Akira Kabeshita

IPC分类号： B23P19/00

CPC分类号： H05K13/0413 ,  H05K13/0815 ,  Y10T29/49004 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/53052 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53191

摘要： In accordance with a component mounting apparatus, a component stored in a component feeder is held by a component holding member and is then mounted in a mounting position on an object. The apparatus functions to, when a mounting posture of the component in which the component is mounted onto the object is inclined with respect to a basic posture of the component by a mounting angle, hold the component from the component feeder by the component holding member that has preliminarily been rotated to the mounting angle in such a direction as to depart from a reference posture of the component holding member prior to the mounting of the component on the object. And afterwards, the component holding member is rotated in a specified direction to finally return the component holding member to the reference posture, and then the component is mounted on the object.

摘要翻译： 根据部件安装装置，存储在部件供给器中的部件由部件保持部件保持，然后安装在物体上的安装位置。 该装置用于当将部件安装到物体上的部件的安装姿势相对于部件的基本姿势倾斜安装角度时，通过部件保持部件将部件从部件供给器保持， 在将部件安装在物体上之前，已经预先沿着防止部件保持部件的基准姿势的方向旋转到安装角度。 然后，使部件保持部件沿指定方向旋转，最终将部件保持部件返回到基准姿势，然后将部件安装在被检体上。

公开(公告)号：US06314640B1

公开(公告)日：2001-11-13

申请号：US08996907

申请日：1997-12-23

申请人： Noriaki Yoshida ,  Takeshi Takeda ,  Akira Kabeshita

发明人： Noriaki Yoshida ,  Takeshi Takeda ,  Akira Kabeshita

IPC分类号： H05K330

CPC分类号： H05K13/0413 ,  H05K13/0815 ,  Y10T29/49004 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/53052 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53191

摘要： In accordance with a component mounting method, a component stored in a component feeder is held by a component holding member and then is mounted in a mounting position on n object. The method includes, when a mounting posture of the component in which the component is mounted onto the object is inclined with respect to a basic posture of the component by a mounting angle, the operation of holding the component from the component feeder by the component holding member that has preliminarily been rotated to the mounting angle in such a direction as to depart from a reference posture of the component holding member prior to the mounting of the component on the object. And afterwards, the component holding member is rotated in a specified direction to finally return the component holding member to the reference posture, and then the component is mounted on the object.

摘要翻译： 根据部件安装方法，存储在部件供给器中的部件由部件保持部件保持，然后安装在n个物体上的安装位置。 该方法包括：当将部件安装到物体上的部件的安装姿势相对于部件的基本姿势倾斜安装角度时，通过部件保持部件保持部件的部件的操作 在将部件安装在物体上之前，已经预先将旋转到安装角度的方向朝向与零件保持部件的基准姿势相脱离的方向。 然后，使部件保持部件沿指定方向旋转，最终将部件保持部件返回到基准姿势，然后将部件安装在被检体上。

公开(公告)号：US20060200974A1

公开(公告)日：2006-09-14

申请号：US11431751

申请日：2006-05-11

申请人： Noriaki Yoshida ,  Takeshi Takeda ,  Akira Kabeshita

发明人： Noriaki Yoshida ,  Takeshi Takeda ,  Akira Kabeshita

IPC分类号： B23P19/00 ,  H05K3/30

CPC分类号： H05K13/0413 ,  H05K13/0815 ,  Y10T29/49004 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/53052 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53191

摘要： In accordance with a component mounting method, a component stored in a component feeder is held by a component holding member and is then mounted in a mounting position on an object. The method includes, when a mounting posture of the component in which the component is mounted onto the object is inclined with respect to a basic posture of the component by a mounting angle, the operation of holding the component from the component feeder by the component holding member that has preliminarily been rotated to the mounting angle in such a direction as to depart from a reference posture of the component holding member prior to the mounting of the component on the object. And afterwards, the component holding member is rotated in a specified direction to finally return the component holding member to the reference posture, and then the component is mounted on the object.

公开(公告)号：US07065866B2

公开(公告)日：2006-06-27

申请号：US09956793

申请日：2001-09-21

申请人： Noriaki Yoshida ,  Takeshi Takeda ,  Akira Kabeshita

发明人： Noriaki Yoshida ,  Takeshi Takeda ,  Akira Kabeshita

IPC分类号： H05K3/30 ,  B23P19/00

CPC分类号： H05K13/0413 ,  H05K13/0815 ,  Y10T29/49004 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/53052 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53191

摘要： In accordance with a component mounting method, a component stored in a component feeder is held by a component holding member and is then mounted in a mounting position on an object. The method includes, when a mounting posture of the component in which the component is mounted onto the object is inclined with respect to a basic posture of the component by a mounting angle, the operation of holding the component from the component feeder by the component holding member that has preliminarily been rotated to the mounting angle in such a direction as to depart from a reference posture of the component holding member prior to the mounting of the component on the object. And afterwards, the component holding member is rotated in a specified direction to finally return the component holding member to the reference posture, and then the component is mounted on the object.

公开(公告)号：US6094808A

公开(公告)日：2000-08-01

申请号：US192400

申请日：1998-11-16

申请人： Yoshihiro Mimura ,  Noriaki Yoshida ,  Takeshi Takeda ,  Kanji Hata

发明人： Yoshihiro Mimura ,  Noriaki Yoshida ,  Takeshi Takeda ,  Kanji Hata

IPC分类号： H05K13/04 ,  H05K3/30

CPC分类号： H05K13/0452 ,  H05K13/0408 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/53022 ,  Y10T29/53178 ,  Y10T29/53191 ,  Y10T29/53261

摘要： An electronic component mounting apparatus for sucking up an electronic component and placing it onto a board with a suction nozzle, includes a step of switching over air pressure switching timings for the suction nozzle when the component is sucked with the suction nozzle and when the sucked component is mounted on the board. The air pressure switching timings are switched according to a velocity of up and down movement of the suction nozzle and independently for each of when the component is sucked with the suction nozzle and when the sucked component is mounted on the board. An electronic component mounting apparatus includes a suction nozzle for sucking an electronic component and placing it onto a board, a device for moving up and down the suction nozzle for suction and mounting of the electronic component, an air pressure switching unit for switching air pressure to the suction nozzle at an electronic component suction position and an electronic component mounting position, and a switching drive unit for performing switching control of the air pressure switching unit independently for each of when the component is sucked with the suction nozzle and when the sucked component is mounted on the board.

摘要翻译： 一种用于吸附电子部件并将其放置在具有吸嘴的板上的电子部件安装装置，包括当用吸嘴吸取部件时切换吸嘴的空气压力切换定时的步骤，以及当吸入部件 安装在板上。 空气压力切换定时根据吸嘴的上下运动速度进行切换，并且独立地用于当吸附有吸入部件的部件和吸附部件安装在基板上时。 一种电子部件安装装置，包括：吸引电子部件并将其放置在基板上的吸嘴，将吸引和吸附电子部件的吸嘴上下移动的装置，将气压切换为 电子部件吸引位置处的吸嘴和电子部件安装位置，以及开关驱动单元，其用于当部件被吸嘴吸引时，分别独立地执行空气压力切换单元的切换控制，并且当吸入部件为 安装在板上。

公开(公告)号：US5867897A

公开(公告)日：1999-02-09

申请号：US601324

申请日：1996-02-16

申请人： Yoshihiro Mimura ,  Noriaki Yoshida ,  Takeshi Takeda ,  Kanji Hata

发明人： Yoshihiro Mimura ,  Noriaki Yoshida ,  Takeshi Takeda ,  Kanji Hata

IPC分类号： H05K13/04

CPC分类号： H05K13/0408 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/53178 ,  Y10T29/53191

摘要： An electronic component mounting method for sucking up an electronic component and placing it onto a board with a suction nozzle, includes a step of switching over air pressure switching timings for the suction nozzle when the component is sucked with the suction nozzle and when the sucked component is mounted on the board according to a velocity of up and down movement of the suction nozzle and independently for each of when the component is sucked with the suction nozzle and when the sucked component is mounted on the board. An electronic component mounting apparatus includes a suction nozzle for sucking an electronic component and placing it onto a board, a device for moving up and down the suction nozzle for suction and mounting of the electronic component, an air pressure switching unit for switching air pressure to the suction nozzle at an electronic component suction position and an electronic component mounting position, and a switching drive unit for performing switching control of the air pressure switching unit independently for each of when the component is sucked with the suction nozzle and when the sucked component is mounted on the board.

摘要翻译： 一种用于吸附电子部件并将其放置在具有吸嘴的板上的电子部件安装方法包括当用吸嘴吸取部件时切换吸嘴的空气压力切换定时的步骤，以及当吸入部件 根据吸嘴的上下运动速度安装在板上，并且独立地用于当吸附有吸嘴的部件和吸附部件安装在板上时的每一个。 一种电子部件安装装置，包括：吸引电子部件并将其放置在基板上的吸嘴，将吸引和吸附电子部件的吸嘴上下移动的装置，将气压切换为 电子部件吸引位置处的吸嘴和电子部件安装位置，以及开关驱动单元，其用于当部件被吸嘴吸引时，分别独立地执行空气压力切换单元的切换控制，并且当吸入部件为 安装在板上。

公开(公告)号：US20060000085A1

公开(公告)日：2006-01-05

申请号：US11222153

申请日：2005-09-09

申请人： Akira Kabeshita ,  Naoto Mimura ,  Noriaki Yoshida ,  Yoshihiko Misawa ,  Takeyuki Kawase ,  Tetsutarou Hachimura ,  Toshiro Nishiwaki ,  Taira Ishii ,  Mitsuo Kawate ,  Hideaki Watanabe

发明人： Akira Kabeshita ,  Naoto Mimura ,  Noriaki Yoshida ,  Yoshihiko Misawa ,  Takeyuki Kawase ,  Tetsutarou Hachimura ,  Toshiro Nishiwaki ,  Taira Ishii ,  Mitsuo Kawate ,  Hideaki Watanabe

IPC分类号： B23P19/00

CPC分类号： H05K13/0061 ,  H05K13/085 ,  Y10T29/53178 ,  Y10T29/53191 ,  Y10T29/53396

摘要： A first mounting unit and a second mounting unit capable of performing component holding, component recognition, and component placement for two boards independently of each other are provided. A first conveyance path for loading and unloading the first board, and a second conveyance path for loading and unloading the second board, are independently arranged.

摘要翻译： 提供能够彼此独立地执行用于两个板的部件保持，部件识别和部件放置的第一安装单元和第二安装单元。 独立地布置用于装载和卸载第一板的第一输送路径和用于装载和卸载第二板的第二输送路径。

公开(公告)号：US06374484B1

公开(公告)日：2002-04-23

申请号：US09486661

申请日：2000-02-28

申请人： Noriaki Yoshida ,  Makoto Sueki ,  Koji Odera ,  Yoshihiro Yoshida ,  Osamu Okuda ,  Naoyuki Kitamura ,  Akira Kabeshita

发明人： Noriaki Yoshida ,  Makoto Sueki ,  Koji Odera ,  Yoshihiro Yoshida ,  Osamu Okuda ,  Naoyuki Kitamura ,  Akira Kabeshita

IPC分类号： H01R4300

CPC分类号： H05K13/0452 ,  H05K13/08 ,  Y10T29/49131 ,  Y10T29/5313 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53191 ,  Y10T29/53261

摘要： According to the present invention, a control device and a circuit board moving device controlled in operation by the control device for holding a circuit board are provided, whereby the circuit board moving device is moved to bring a component mount position on the circuit board closest to a recognition device after the circuit board moving device is moved to bring the component mount position closest to a component feed position. In the state, a circuit board mark formed on the circuit board is detected, thereby recognizing a position of the circuit board. A transfer distance for the component by a component hold device from the recognition device to the component mount position is thus shortened, enabling high-speed mounting with higher accuracy.

摘要翻译： 根据本发明，提供一种由控制装置控制的控制装置和电路板移动装置，用于保持电路板，由此移动电路板移动装置以使电路板上的部件安装位置最接近 移动电路板移动装置之后的识别装置使部件安装位置最接近部件进给位置。 在该状态下，检测形成在电路板上的电路板标记，从而识别电路板的位置。 因此，通过部件保持装置从识别装置到部件安装位置的部件的传送距离因此缩短，能够以更高的精度实现高速安装。