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16 条记录 (耗时 0.02 秒)

    Method for assembling testing equipment for semiconductor substrate
    1.
    发明申请
    Method for assembling testing equipment for semiconductor substrate 失效
    组装半导体衬底检测设备的方法

    公开(公告)号：US20060240581A1

    公开(公告)日：2006-10-26

    申请号：US11407267

    申请日：2006-04-20

    申请人： Takeyuki Suzuki ,  Ryo Ujike

    发明人： Takeyuki Suzuki ,  Ryo Ujike

    IPC分类号： H01L21/66 ,  G01R31/26

    CPC分类号： G01R31/31905 ,  G01R31/2886 ,  Y10T29/49155 ,  Y10T29/49204 ,  Y10T29/49222

    摘要： Upon an assembly of a probe head unit, the relative positions of the probe pins 28ai to those of the electrode group 24E in the pitch-changing substrate 24 are determined by making the positions of the through-holes 26A, 26B, 26C and 26D in the contact block 26 to coincide with the positioning marks 24MA, 24MB, 24MC and 24MD in the pitch-changing substrate 24.

    摘要翻译： 在探针头单元的组装时，通过使通孔26A，26B的位置确定探针28a的位置与俯仰改变基底24中的电极组24E的相对位置， 26C和26D与变桨基板24中的定位标记24 MA，24 MB，24 MC和24 MD重合。

    MANUFACTURING METHOD FOR PROBE CONTACT
    2.
    发明申请
    MANUFACTURING METHOD FOR PROBE CONTACT 失效
    探针接触的制造方法

    公开(公告)号：US20100050431A1

    公开(公告)日：2010-03-04

    申请号：US12516155

    申请日：2008-09-02

    申请人： Takeyuki Suzuki ,  Ryo Ujike ,  Yoshinori Wakabayashi

    发明人： Takeyuki Suzuki ,  Ryo Ujike ,  Yoshinori Wakabayashi

    IPC分类号： H01R43/16

    CPC分类号： G01R3/00 ,  G01R1/06716 ,  Y10T29/49121 ,  Y10T29/49204 ,  Y10T29/49218 ,  Y10T29/4979

    摘要： To make the fracturing position controlled conveniently with high precision when the substrate end of the probe contact is fractured and cut off.By compressing the front face of the substrate end portion with the pushing member, brittle fracture is generated on the substrate along the carved groove, and the substrate end portion is cut off from the substrate. The fracturing position in the above-mentioned fracturing is controlled so as to be along the fracturing position whose extension puts thereon the stress concentrating ends of two fracturing control structures. Here, the fracturing control structure is located with high positional precision on the front face of the substrate through the alignment technique of photolithography. In this way, resilient armatures constituted of the tips projected from the fracturing position coming to be the end of the substrate 11a can be stably formed with high precision.

    摘要翻译： 当探头接触的基板端部断裂并切断时，使压裂位置以高精度方便地进行控制。 通过用推动部件压缩基板端部的前表面，沿着雕刻槽在基板上产生脆性断裂，并且将基板端部与基板切断。 上述断裂中的断裂位置被控制为沿着断裂位置，其延伸部将两个压裂控制结构的应力集中端部置于其上。 这里，压裂控制结构通过光刻的对准技术在基板的正面上位置精度高。 以这种方式，可以以高精度稳定地形成由从作为基板11a的端部的压裂位置突出的端部构成的弹性电枢。

    Manufacturing method for probe contact
    3.
    发明授权
    Manufacturing method for probe contact 失效
    探针接触的制造方法

    公开(公告)号：US08312626B2

    公开(公告)日：2012-11-20

    申请号：US12516155

    申请日：2008-09-02

    申请人： Takeyuki Suzuki ,  Ryo Ujike ,  Yoshinori Wakabayashi

    发明人： Takeyuki Suzuki ,  Ryo Ujike ,  Yoshinori Wakabayashi

    IPC分类号： H01R43/04

    CPC分类号： G01R3/00 ,  G01R1/06716 ,  Y10T29/49121 ,  Y10T29/49204 ,  Y10T29/49218 ,  Y10T29/4979

    摘要： To make the fracturing position controlled conveniently with high precision when the substrate end of the probe contact is fractured and cut off.By compressing the front face of the substrate end portion with the pushing member, brittle fracture is generated on the substrate along the carved groove, and the substrate end portion is cut off from the substrate. The fracturing position in the above-mentioned fracturing is controlled so as to be along the fracturing position whose extension puts thereon the stress concentrating ends of two fracturing control structures. Here, the fracturing control structure is located with high positional precision on the front face of the substrate through the alignment technique of photolithography. In this way, resilient armatures constituted of the tips projected from the fracturing position coming to be the end of the substrate 11a can be stably formed with high precision.

    摘要翻译： 当探头接触的基板端部断裂并切断时，使压裂位置以高精度方便地进行控制。 通过用推动部件压缩基板端部的前表面，沿着雕刻槽在基板上产生脆性断裂，并且将基板端部与基板切断。 上述断裂中的断裂位置被控制为沿着断裂位置，其延伸部将两个压裂控制结构的应力集中端部置于其上。 这里，压裂控制结构通过光刻的对准技术在基板的正面上位置精度高。 以这种方式，可以以高精度稳定地形成由从作为基板11a的端部的压裂位置突出的端部构成的弹性电枢。

    Socket for electronic element
    5.
    发明授权
    Socket for electronic element 失效

    公开(公告)号：US06540538B2

    公开(公告)日：2003-04-01

    申请号：US10147978

    申请日：2002-05-20

    申请人： Kazunori Nakano ,  Ryo Ujike

    发明人： Kazunori Nakano ,  Ryo Ujike

    IPC分类号： H01R1122

    CPC分类号： H01R12/89

    摘要： A socket of the invention includes a socket body, a plurality of contacts respectively having a movable piece and a stationary piece, a slidable contact moving member and a lever having a pushing portion and a pressing member. A plurality of contact displacing portions of the contact moving member are respectively positioned between the movable and stationary piece of each contact. The contact moving member is urged to prevent the contact displacing portion from moving each movable piece. The pressing member includes a curved fulcrum portion and an operating portion curved oppositely to the fulcrum portion. A first restricting portion of the socket body is in contact with the fulcrum portion and a second restricting portion of the contact moving member can be in contact with the fulcrum portion. The operating portion of the pressing member abuts to the contact moving member.

    Socket for semiconductor device
    7.
    发明授权
    Socket for semiconductor device 有权
    半导体器件插座

    公开(公告)号：US07118386B2

    公开(公告)日：2006-10-10

    申请号：US10735882

    申请日：2003-12-16

    申请人： Masaru Sato ,  Ryo Ujike

    发明人： Masaru Sato ,  Ryo Ujike

    IPC分类号： H01R12/00

    CPC分类号： G01R1/0466 ,  G01R1/0483 ,  G01R31/2863 ,  H01L23/32 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Lengths of arms of pressing members held at a lower end of an arm section of a cover member are determined in correspondence to the retention of semiconductor devices having contour dimensions different from each other, and are shorter than a length of the arm section so that part of the pressing members is projected outside through a recess of the socket body.

    摘要翻译： 保持在盖构件的臂部的下端的按压构件的臂的长度对应于具有彼此不同的轮廓尺寸的半导体器件的保持来确定，并且比臂部的长度短，从而部分 的按压构件通过插座主体的凹部突出到外部。

    Socket for electronic element
    8.
    发明授权
    Socket for electronic element 有权
    电子元件插座

    公开(公告)号：US06796823B1

    公开(公告)日：2004-09-28

    申请号：US10358288

    申请日：2003-02-05

    申请人： Kazunori Nakano ,  Ryo Ujike

    发明人： Kazunori Nakano ,  Ryo Ujike

    IPC分类号： H01R1362

    CPC分类号： H01R12/89

    摘要： A socket of the invention includes a socket body, a plurality of contacts respectively having a movable piece and a stationary piece, a slidable contact moving member and a lever having a pushing portion and a pressing member. A plurality of contact displacing portions of the contact moving member are respectively positioned between the movable and stationary piece of each contact. The contact moving member is urged to prevent the contact displacing portion from moving each movable piece. The pressing member includes a curved fulcrum portion and an operating portion curved oppositely to the fulcrum portion. A first restricting portion of the socket body is in contact with the fulcrum portion and a second restricting portion of the contact moving member can be in contact with the fulcrum portion. The operating portion of the pressing member abuts to the contact moving member.

    摘要翻译： 本发明的插座包括插座主体，分别具有可移动件和固定件的多个触点，可滑动触点移动元件和具有推动部分和按压元件的杠杆。 接触移动构件的多个接触位移部分分别位于每个接触件的可移动和固定件之间。 推动接触移动构件以防止接触移动部分移动每个可动件。 按压构件包括弯曲支点部分和与支点部分相对弯曲的操作部分。 插座主体的第一限制部分与支点部分接触，接触移动部件的第二限制部分可与支点部分接触。 按压构件的操作部分抵靠接触移动构件。