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公开(公告)号：US07359212B2
公开(公告)日：2008-04-15
申请号：US11243319
申请日：2005-10-05
申请人： Takuya Mayuzumi , Shuji Eguchi , Masahiro Sasaki , Kiyoomi Kadoya
发明人： Takuya Mayuzumi , Shuji Eguchi , Masahiro Sasaki , Kiyoomi Kadoya
CPC分类号： H05K3/284 , B29C45/14639 , H05K1/0215 , H05K3/0061 , H05K3/321 , H05K3/3447 , H05K5/0034 , H05K5/0082 , H05K7/20854 , H05K2201/09054 , H05K2201/10189 , H05K2201/2036 , Y10T29/49146
摘要： A module comprises a metallic terminal pins for connection and a circuit board with electronic components mounted thereon, a circuit board connecting side of the connector. The electronic components and the circuit board with the electronic components mounted thereon are encapsulated with the same resin. A metallic base is united to the module to obtain an electric conduction between the metallic base and the circuit board.
摘要翻译： 模块包括用于连接的金属端子销和安装有电子部件的电路板，连接器的电路板连接侧。 电子部件和安装有电子部件的电路板用相同的树脂封装。 将金属基体与模块结合，以在金属基座和电路板之间获得电导通。
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公开(公告)号：US07924572B2
公开(公告)日：2011-04-12
申请号：US12039472
申请日：2008-02-28
申请人： Takuya Mayuzumi , Shuji Eguchi , Masahiro Sasaki , Kiyoomi Kadoya
发明人： Takuya Mayuzumi , Shuji Eguchi , Masahiro Sasaki , Kiyoomi Kadoya
IPC分类号： H05K5/00
CPC分类号： H05K3/284 , B29C45/14639 , H05K1/0215 , H05K3/0061 , H05K3/321 , H05K3/3447 , H05K5/0034 , H05K5/0082 , H05K7/20854 , H05K2201/09054 , H05K2201/10189 , H05K2201/2036 , Y10T29/49146
摘要： A module comprises a metallic terminal pins for connection and a circuit board with electronic components mounted thereon, a circuit board connecting side of the connector. The electronic components and the circuit board with the electronic components mounted thereon are encapsulated with the same resin. A metallic base is united to the module to obtain an electric conduction between the metallic base and the circuit board.
摘要翻译： 模块包括用于连接的金属端子销和安装有电子部件的电路板，连接器的电路板连接侧。 电子部件和安装有电子部件的电路板用相同的树脂封装。 将金属基体与模块结合，以在金属基座和电路板之间获得电导通。
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公开(公告)号：US20060077643A1
公开(公告)日：2006-04-13
申请号：US11243319
申请日：2005-10-05
申请人： Takuya Mayuzumi , Shuji Eguchi , Masahiro Sasaki , Kiyoomi Kadoya
发明人： Takuya Mayuzumi , Shuji Eguchi , Masahiro Sasaki , Kiyoomi Kadoya
IPC分类号： H05K7/04
CPC分类号： H05K3/284 , B29C45/14639 , H05K1/0215 , H05K3/0061 , H05K3/321 , H05K3/3447 , H05K5/0034 , H05K5/0082 , H05K7/20854 , H05K2201/09054 , H05K2201/10189 , H05K2201/2036 , Y10T29/49146
摘要： A module comprises a metallic terminal pins for connection and a circuit board with electronic components mounted thereon, a circuit board connecting side of the connector. The electronic components and the circuit board with the electronic components mounted thereon are encapsulated with the same resin. A metallic base is united to the module to obtain an electric conduction between the metallic base and the circuit board.
摘要翻译： 模块包括用于连接的金属端子销和安装有电子部件的电路板，连接器的电路板连接侧。 电子部件和安装有电子部件的电路板用相同的树脂封装。 将金属基体与模块结合，以在金属基座和电路板之间获得电导通。
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公开(公告)号：US20080165511A1
公开(公告)日：2008-07-10
申请号：US12039472
申请日：2008-02-28
申请人： Takuya Mayuzumi , Shuji Eguchi , Masahiro Sasaki , Kiyoomi Kadoya
发明人： Takuya Mayuzumi , Shuji Eguchi , Masahiro Sasaki , Kiyoomi Kadoya
CPC分类号： H05K3/284 , B29C45/14639 , H05K1/0215 , H05K3/0061 , H05K3/321 , H05K3/3447 , H05K5/0034 , H05K5/0082 , H05K7/20854 , H05K2201/09054 , H05K2201/10189 , H05K2201/2036 , Y10T29/49146
摘要： A module comprises a metallic terminal pins for connection and a circuit board with electronic components mounted thereon, a circuit board connecting side of the connector. The electronic components and the circuit board with the electronic components mounted thereon are encapsulated with the same resin. A metallic base is united to the module to obtain an electric conduction between the metallic base and the circuit board.
摘要翻译： 模块包括用于连接的金属端子销和安装有电子部件的电路板，连接器的电路板连接侧。 电子部件和安装有电子部件的电路板用相同的树脂封装。 将金属基体与模块结合，以在金属基座和电路板之间获得电导通。
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公开(公告)号：US20090119913A1
公开(公告)日：2009-05-14
申请号：US12350992
申请日：2009-01-09
申请人： Takuya Mayuzumi , Masahiro Sasaki , Kiyoomi Kadoya
发明人： Takuya Mayuzumi , Masahiro Sasaki , Kiyoomi Kadoya
IPC分类号： H05K3/30
CPC分类号： H05K5/065 , H01L2924/0002 , H05K1/117 , H05K3/284 , H05K5/0034 , H05K2201/10189 , H05K2203/1147 , Y10T29/49146 , Y10T29/49172 , H01L2924/00
摘要： An electronic circuit device comprises: a printed circuit board mounted with electronic components; a resin-molded portion formed of resin so disposed that the electronic components are covered therewith; a convex connector that has metal terminals for connection and is exposed from the resin-molded portion; and a sealing member wrapped around the resin-molded portion.
摘要翻译： 电子电路装置包括：安装有电子部件的印刷电路板; 由树脂形成的树脂模制部分，以便电子部件被覆盖; 具有用于连接的金属端子并从树脂模制部分露出的凸形连接器; 以及缠绕在树脂成型部上的密封构件。
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公开(公告)号：US20060012034A1
公开(公告)日：2006-01-19
申请号：US11178407
申请日：2005-07-12
IPC分类号： H01L23/34
CPC分类号： H05K7/20872 , H05K1/0203 , H05K1/0272 , H05K1/189 , H05K3/284 , H05K5/0034 , H05K2201/064 , H05K2201/066 , H05K2203/1316
摘要： An engine control circuit device which has higher heat resistance and can be installed in a place exposed to severe thermal environments. In an engine control circuit device comprising a circuit board on which a plurality of packaged electronic parts are mounted, and a connector mounted on the circuit board for connection to an external circuit, the device further comprises a resin portion formed of a thermo-setting resin and covering the connector except for a connecting portion thereof and the circuit board, and a cooling pipe integrally molded in the resin portion and allowing a coolant to flow through it, thereby cooling the resin portion.
摘要翻译： 一种发动机控制电路装置，具有较高的耐热性，可以安装在严酷的热环境中。 在包括其上安装有多个封装电子部件的电路板的发动机控制电路装置以及安装在电路板上用于连接到外部电路的连接器的装置还包括由热固性树脂形成的树脂部分 并且除了其连接部分和电路板之外覆盖连接器，以及一体地模制在树脂部分中并允许冷却剂流过其中的冷却管，从而冷却树脂部分。
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公开(公告)号：US20060134937A1
公开(公告)日：2006-06-22
申请号：US11199177
申请日：2005-08-09
申请人： Takuya Mayuzumi , Masahiro Sasaki , Kiyoomi Kadoya
发明人： Takuya Mayuzumi , Masahiro Sasaki , Kiyoomi Kadoya
IPC分类号： H05K1/00
CPC分类号： H05K5/065 , H01L2924/0002 , H05K1/117 , H05K3/284 , H05K5/0034 , H05K2201/10189 , H05K2203/1147 , Y10T29/49146 , Y10T29/49172 , H01L2924/00
摘要： An electronic circuit device comprises: a printed circuit board mounted with electronic components; a resin-molded portion formed of resin so disposed that the electronic components are covered therewith; a convex connector that has metal terminals for connection and is exposed from the resin-molded portion; and a sealing member wrapped around the resin-molded portion.
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公开(公告)号：US07934312B2
公开(公告)日：2011-05-03
申请号：US12350992
申请日：2009-01-09
申请人： Takuya Mayuzumi , Masahiro Sasaki , Kiyoomi Kadoya
发明人： Takuya Mayuzumi , Masahiro Sasaki , Kiyoomi Kadoya
IPC分类号： H05K3/30
CPC分类号： H05K5/065 , H01L2924/0002 , H05K1/117 , H05K3/284 , H05K5/0034 , H05K2201/10189 , H05K2203/1147 , Y10T29/49146 , Y10T29/49172 , H01L2924/00
摘要： An electronic circuit device comprises: a printed circuit board mounted with electronic components; a resin-molded portion formed of resin so disposed that the electronic components are covered therewith; a convex connector that has metal terminals for connection and is exposed from the resin-molded portion; and a sealing member wrapped around the resin-molded portion.
摘要翻译： 电子电路装置包括：安装有电子部件的印刷电路板; 由树脂形成的树脂模制部分，以便电子部件被覆盖; 具有用于连接的金属端子并从树脂模制部分露出的凸形连接器; 以及缠绕在树脂成型部上的密封构件。
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公开(公告)号：US07514784B2
公开(公告)日：2009-04-07
申请号：US11199177
申请日：2005-08-09
申请人： Takuya Mayuzumi , Masahiro Sasaki , Kiyoomi Kadoya
发明人： Takuya Mayuzumi , Masahiro Sasaki , Kiyoomi Kadoya
IPC分类号： H01L23/34
CPC分类号： H05K5/065 , H01L2924/0002 , H05K1/117 , H05K3/284 , H05K5/0034 , H05K2201/10189 , H05K2203/1147 , Y10T29/49146 , Y10T29/49172 , H01L2924/00
摘要： An electronic circuit device comprises: a printed circuit board mounted with electronic components; a resin-molded portion formed of resin so disposed that the electronic components are covered therewith; a convex connector that has metal terminals for connection and is exposed from the resin-molded portion; and a sealing member wrapped around the resin-molded portion.
摘要翻译： 电子电路装置包括：安装有电子部件的印刷电路板; 由树脂形成的树脂模制部分，以便电子部件被覆盖; 具有用于连接的金属端子并从树脂模制部分露出的凸形连接器; 以及缠绕在树脂成型部上的密封构件。
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公开(公告)号：US07417873B2
公开(公告)日：2008-08-26
申请号：US11322426
申请日：2006-01-03
申请人： Kiyoomi Kadoya , Masahiro Sasaki , Takuya Mayuzumi
发明人： Kiyoomi Kadoya , Masahiro Sasaki , Takuya Mayuzumi
CPC分类号： B60R16/0239 , B29C45/14377 , B29C45/14655 , H01L21/565 , H01L25/165 , H01L2924/0002 , H05K1/189 , H05K3/0061 , H05K3/284 , H05K5/0034 , H05K2201/09745 , H05K2201/10189 , H05K2201/10371 , H05K2201/1056 , H05K2203/1316 , H05K2203/1572 , H01L2924/00
摘要： In resin-molded engine control unit, a coil, an electrolytic capacitor, a microprocessor, electronic parts and a connector terminal are mounted on a board. Inside a cover fixed on the board, a resin-free region is formed. The coil, the electrolytic capacitor and the microprocessor, which should not be sealed with resin, are mounted in the resin-free region, while the board and the electronic parts which are not capped by the cover are sealed with a resin.
摘要翻译： 在树脂模制发动机控制单元中，线圈，电解电容器，微处理器，电子部件和连接器端子安装在板上。 在固定在板上的盖内，形成无树脂的区域。 不用树脂密封的线圈，电解电容器和微处理器安装在无树脂区域中，而未被盖子盖住的板和电子部件用树脂密封。
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