Method for manufacturing multilayer electronic component
    6.
    发明授权
    Method for manufacturing multilayer electronic component 有权
    多层电子部件的制造方法

    公开(公告)号:US08631549B2

    公开(公告)日:2014-01-21

    申请号:US13051013

    申请日:2011-03-18

    IPC分类号: H01G4/228

    CPC分类号: H01G4/30 H01G4/232

    摘要: A method for manufacturing a laminated ceramic capacitor includes a step of preparing a laminate which has a first principal surface, a second principal surface, a first end surface, a second end surface, a first side surface, and a second side surface and which includes insulating layers and internal electrodes having end portions exposed at the first or second end surface; a step of forming external electrodes on the first and second end surfaces such that plating deposits are formed on the exposed end portions of the internal electrodes so as to be connected to each other; and a step of forming thick end electrodes electrically connected to the external electrodes such that a conductive paste is applied onto edge portions of the first and second principal surfaces and first and second side surfaces of the laminate and then baked.

    摘要翻译: 层压陶瓷电容器的制造方法包括:制备具有第一主表面,第二主表面,第一端面,第二端面,第一侧表面和第二侧表面的层压体的步骤, 绝缘层和具有在第一或第二端面露出的端部的内部电极; 在所述第一和第二端面上形成外部电极的步骤,使得在所述内部电极的所述暴露端部上形成电镀沉积物以彼此连接; 以及形成与外部电极电连接的厚端电极的步骤,使得将导电浆料施加到层压体的第一和第二主表面和第一和第二侧表面的边缘部分上,然后烘烤。

    Multilayer electronic component and method for manufacturing multilayer electronic component
    7.
    发明授权

    公开(公告)号:US07933113B2

    公开(公告)日:2011-04-26

    申请号:US12055372

    申请日:2008-03-26

    IPC分类号: H01G4/228

    CPC分类号: H01G4/30 H01G4/232

    摘要: A method for manufacturing a laminated ceramic capacitor includes a step of preparing a laminate which has a first principal surface, a second principal surface, a first end surface, a second end surface, a first side surface, and a second side surface and which includes insulating layers and internal electrodes having end portions exposed at the first or second end surface; a step of forming external electrodes on the first and second end surfaces such that plating deposits are formed on the exposed end portions of the internal electrodes so as to be connected to each other; and a step of forming thick end electrodes electrically connected to the external electrodes such that a conductive paste is applied onto edge portions of the first and second principal surfaces and first and second side surfaces of the laminate and then baked.

    摘要翻译: 层压陶瓷电容器的制造方法包括:制备具有第一主表面,第二主表面,第一端面,第二端面,第一侧表面和第二侧表面的层压体的步骤, 绝缘层和具有在第一或第二端面露出的端部的内部电极; 在所述第一和第二端面上形成外部电极的步骤,使得在所述内部电极的所述暴露端部上形成电镀沉积物以彼此连接; 以及形成与外部电极电连接的厚端电极的步骤,使得将导电浆料施加到层压体的第一和第二主表面和第一和第二侧表面的边缘部分上,然后烘烤。

    Multilayer electronic component and method for manufacturing the same
    8.
    发明授权
    Multilayer electronic component and method for manufacturing the same 有权
    多层电子元件及其制造方法

    公开(公告)号:US08804303B2

    公开(公告)日:2014-08-12

    申请号:US13439916

    申请日:2012-04-05

    IPC分类号: H01G4/228 H01G4/005

    摘要: A method for manufacturing a multilayer electronic component includes the steps of preparing a laminate including a plurality of laminated insulating layers and a plurality of internal electrodes disposed along interfaces between the insulating layers, edges of the internal electrodes being exposed at a predetermined surface of the laminate, and forming an external electrode on the predetermined surface to electrically connect exposed the edges of the internal electrodes. The step of forming an external electrode includes a plating step of forming a continuous plating film by depositing plating deposits on the edges of the internal electrodes exposed at the predetermined surface and by performing plating growth to be connected to each other, and a heat treatment step of performing a heat treatment at an oxygen partial pressure of about 5 ppm or less and at a temperature of about 600° C. or more.

    摘要翻译: 一种多层电子部件的制造方法,其特征在于,具有:制造层叠绝缘层的多个层叠体和沿着绝缘层的界面配置的多个内部电极的层叠体的工序,在所述层叠体的规定表面露出内部电极的边缘 并且在所述预定表面上形成外部电极以电连接所述内部电极的边缘。 形成外部电极的步骤包括:电镀步骤,通过在暴露于预定表面的内部电极的边缘上沉积电镀沉积物并且通过进行电镀生长彼此连接来形成连续的镀膜;以及热处理步骤 在约5ppm或更低的氧分压和约600℃或更高的温度下进行热处理。

    Multilayer electronic component including a counter diffusion layer
    9.
    发明授权
    Multilayer electronic component including a counter diffusion layer 有权
    多层电子元件包括反扩散层

    公开(公告)号:US08184424B2

    公开(公告)日:2012-05-22

    申请号:US12110484

    申请日:2008-04-28

    IPC分类号: H01G4/228 H01G4/005

    摘要: A multilayer electronic component includes a laminate including insulating layers that are laminated to each other and internal electrodes provided along interfaces between the insulating layers, edges of the internal electrodes being exposed at a predetermined surface of the laminate and an external electrode provided on the predetermined surface. The external electrode includes a plated film which is directly provided on the predetermined surface of the laminate so as to electrically connect edges of the internal electrodes exposed at the predetermined surface of the laminate, and at a boundary portion between each of the internal electrodes and the plated film, a counter diffusion layer is provided, in which a metal component in the plated film and a metal component in the internal electrodes are both detectable, and extend to both sides of the internal electrodes and the plated film, and, at a side of the internal electrodes.

    摘要翻译: 多层电子部件包括层压体,该层压体包括彼此层压的绝缘层和沿着绝缘层之间的界面设置的内部电极,内部电极的边缘暴露在层压体的预定表面处,并且外部电极设置在预定表面上 。 外部电极包括直接设置在层压体的预定表面上的电镀膜,以电连接在层压体的预定表面处暴露的内部电极的边缘,以及在每个内部电极和 提供了一种反扩散层,其中镀膜中的金属成分和内部电极中的金属成分都是可检测的,并且延伸到内部电极和镀膜的两侧,并且在一侧 的内部电极。