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    Temperature sensor
    3.
    发明授权
    Temperature sensor 有权
    温度感应器

    公开(公告)号：US08256956B2

    公开(公告)日：2012-09-04

    申请号：US12437646

    申请日：2009-05-08

    申请人： Tatsuya Suzuki ,  Mitsunori Oi ,  Takashi Maeda ,  Norimichi Saito ,  Toshinori Nishi ,  Go Hanzawa ,  Takeshi Morita

    发明人： Tatsuya Suzuki ,  Mitsunori Oi ,  Takashi Maeda ,  Norimichi Saito ,  Toshinori Nishi ,  Go Hanzawa ,  Takeshi Morita

    IPC分类号： G01K1/08 ,  G01K7/16

    CPC分类号： G01K1/12 ,  G01K13/02

    摘要： A temperature sensor including a temperature sensing element (102) having a temperature sensing unit (103) and a pair of device electrode wires (104) extending from the temperature sensing unit; a sheath member (106) including a sheath wire (108) connected at a junction (110) to one of the device electrode wires and a sheath outer pipe (107) retaining the sheath wire in an insulating material (114); an inner tube (112) which has a bottomed cylindrical shape, the inner tube accommodating the temperature sensing element and the junction in a bottom portion side of the inner tube serving as a leading end of the temperature sensor, and extending in an extension direction of the device electrode wire and the sheath wire; and an outer tube (120) which has a bottomed cylindrical shape including a gas inlet hole (122a, 122b, 122c), the outer tube covering the inner tube, and being spaced, from the inner tube on a leading end side of the junction when viewed in a direction perpendicular to an axial direction of the inner tube.

    摘要翻译： 一种温度传感器，包括具有温度检测单元（103）的温度感测元件（102）和从温度检测单元延伸的一对器件电极线（104）; 护套构件（106），包括在接合部（110）处连接到所述器件电极线中的一个的护套线（108）和将所述护套线保持在绝缘材料（114）中的护套外管（107）; 内管（112），其具有有底圆筒形状，所述内管容纳所述温度感测元件，并且所述接合部位于所述内管的底部侧，用作所述温度传感器的前端，并且沿着 器件电极线和护套线; 以及外管（120），其具有包括气体入口孔（122a，122b，122c）的有底圆筒形状，所述外管覆盖所述内管，并且在所述接合部的前端侧与所述内管间隔开 当从与内管的轴向垂直的方向观察时。

    TEMPERATURE SENSOR
    4.
    发明申请
    TEMPERATURE SENSOR 有权
    温度感应器

    公开(公告)号：US20090147826A1

    公开(公告)日：2009-06-11

    申请号：US12326175

    申请日：2008-12-02

    申请人： Tatsuya Suzuki ,  Go Hanzawa ,  Takeshi Morita

    发明人： Tatsuya Suzuki ,  Go Hanzawa ,  Takeshi Morita

    IPC分类号： G01K1/00

    CPC分类号： G01K1/08 ,  G01K13/02 ,  G01K2013/024 ,  G01K2205/04

    摘要： A temperature sensor includes: a temperature-sensing element comprising a temperature-sensing portion and an element electrode wire connected to the temperature-sensing portion; a sheath member comprising a sheath tube and a sheath core wire extending from the sheath tube, the sheath core wire being joined to the element electrode wire to form a joint portion; an enclosing member comprising a closed-bottomed tube having a bottom portion at one end, and enclosing at least the temperature-sensing element and the joint portion; and a holding material filling at least a portion of a space enclosed by the enclosing member extending between a front end face of the temperature-sensing portion and the bottom portion of the enclosing member. The element electrode wire includes a bend at an intermediate portion of the element electrode wire between the temperature-sensing portion and the joint portion.

    摘要翻译： 温度传感器包括：温度感测元件，包括温度感测部分和连接到温度感测部分的元件电极线; 护套构件，其包括护套管和从所述护套管延伸的鞘芯线，所述护芯线与所述元件电极线接合以形成接合部; 封闭构件，其包括在一端具有底部的封闭底管，并且至少包围所述温度感测元件和所述接合部分; 以及保持材料，其填充由所述封闭构件包围的空间的至少一部分，所述封闭构件在所述温度检测部的前端面与所述封闭构件的底部之间延伸。 元件电极线包括在温度感测部分和接头部分之间的元件电极线的中间部分处的弯曲部。

    Temperature sensor
    5.
    发明授权
    Temperature sensor 有权
    温度感应器

    公开(公告)号：US08192081B2

    公开(公告)日：2012-06-05

    申请号：US12437614

    申请日：2009-05-08

    申请人： Tatsuya Suzuki ,  Mitsunori Oi ,  Takashi Maeda ,  Norimichi Saito ,  Toshinori Nishi ,  Go Hanzawa ,  Takeshi Morita

    发明人： Tatsuya Suzuki ,  Mitsunori Oi ,  Takashi Maeda ,  Norimichi Saito ,  Toshinori Nishi ,  Go Hanzawa ,  Takeshi Morita

    IPC分类号： G01K7/16 ,  G01K1/08 ,  G01K1/14

    CPC分类号： G01K1/12 ,  G01K13/02 ,  G01K2205/04

    摘要： A temperature sensor including: a temperature sensing element (102) having a temperature sensing unit (103) and a pair of device electrode wires (104); a sheath member (106) having a sheath wire (108) connected at a junction (110) to at least one of the device electrode wires and a sheath outer pipe (107) retaining the sheath wire in an insulating material (114); an inner tube (112) which has a bottomed cylindrical shape; and a cylindrical outer tube (120) having an open end, covering the inner tube such that the open end is located at a front end side of the junction and in a region to the rear end side of or aligned with the front end of the inner tube, and being spaced from the inner tube at the front end side of the junction.

    摘要翻译： 一种温度传感器，包括：温度感测元件（102），其具有温度感测单元（103）和一对器件电极线（104）; 护套构件（106），其具有在结（110）处连接到至少一个器件电极线的护套线（108）和将护套线保持在绝缘材料（114）中的护套外管（107）; 内管（112），其具有有底圆筒形状; 以及具有开口端的圆柱形外管（120），其覆盖所述内管，使得所述开口端位于所述接合部的前端侧，并且位于所述接合部的前端侧的区域中， 内管，并且在连接处的前端侧与内管间隔开。

    Temperature sensor
    6.
    发明授权
    Temperature sensor 有权

    公开(公告)号：US08182145B2

    公开(公告)日：2012-05-22

    申请号：US12437646

    申请日：2009-05-08

    申请人： Tatsuya Suzuki ,  Mitsunori Oi ,  Takashi Maeda ,  Norimichi Saito ,  Toshinori Nishi ,  Go Hanzawa ,  Takeshi Morita

    发明人： Tatsuya Suzuki ,  Mitsunori Oi ,  Takashi Maeda ,  Norimichi Saito ,  Toshinori Nishi ,  Go Hanzawa ,  Takeshi Morita

    IPC分类号： G01K1/08 ,  G01K7/16

    摘要： A temperature sensor including a temperature sensing element (102) having a temperature sensing unit (103) and a pair of device electrode wires (104) extending from the temperature sensing unit; a sheath member (106) including a sheath wire (108) connected at a junction (110) to one of the device electrode wires and a sheath outer pipe (107) retaining the sheath wire in an insulating material (114); an inner tube (112) which has a bottomed cylindrical shape, the inner tube accommodating the temperature sensing element and the junction in a bottom portion side of the inner tube serving as a leading end of the temperature sensor, and extending in an extension direction of the device electrode wire and the sheath wire; and an outer tube (120) which has a bottomed cylindrical shape including a gas inlet hole (122a, 122b, 122c), the outer tube covering the inner tube, and being spaced, from the inner tube on a leading end side of the junction when viewed in a direction perpendicular to an axial direction of the inner tube.

    Temperature sensor
    7.
    发明授权
    Temperature sensor 有权
    温度感应器

    公开(公告)号：US08092086B2

    公开(公告)日：2012-01-10

    申请号：US12326175

    申请日：2008-12-02

    申请人： Tatsuya Suzuki ,  Go Hanzawa ,  Takeshi Morita

    发明人： Tatsuya Suzuki ,  Go Hanzawa ,  Takeshi Morita

    IPC分类号： G01K1/00

    CPC分类号： G01K1/08 ,  G01K13/02 ,  G01K2013/024 ,  G01K2205/04

    摘要： A temperature sensor includes: a temperature-sensing element comprising a temperature-sensing portion and an element electrode wire connected to the temperature-sensing portion; a sheath member comprising a sheath tube and a sheath core wire extending from the sheath tube, the sheath core wire being joined to the element electrode wire to form a joint portion; an enclosing member comprising a closed-bottomed tube having a bottom portion at one end, and enclosing at least the temperature-sensing element and the joint portion; and a holding material filling at least a portion of a space enclosed by the enclosing member extending between a front end face of the temperature-sensing portion and the bottom portion of the enclosing member. The element electrode wire includes a bend at an intermediate portion of the element electrode wire between the temperature-sensing portion and the joint portion.

    摘要翻译： 温度传感器包括：温度感测元件，包括温度感测部分和连接到温度感测部分的元件电极线; 护套构件，其包括护套管和从所述护套管延伸的鞘芯线，所述护芯线与所述元件电极线接合以形成接合部; 封闭构件，其包括在一端具有底部的封闭底管，并且至少包围所述温度感测元件和所述接合部分; 以及保持材料，其填充由所述封闭构件包围的空间的至少一部分，所述封闭构件在所述温度检测部的前端面与所述封闭构件的底部之间延伸。 元件电极线包括在温度感测部分和接头部分之间的元件电极线的中间部分处的弯曲部。

    Shift controller and shift controlling method
    8.
    发明授权
    Shift controller and shift controlling method 失效
    换档控制器和换档控制方式

    公开(公告)号：US08512202B2

    公开(公告)日：2013-08-20

    申请号：US13168235

    申请日：2011-06-24

    申请人： Yoshikazu Oota ,  Ryozo Hiraku ,  Takeshi Morita ,  Akira Takano

    发明人： Yoshikazu Oota ,  Ryozo Hiraku ,  Takeshi Morita ,  Akira Takano

    IPC分类号： B60W20/00

    CPC分类号： B60W20/30 ,  B60K6/48 ,  B60K6/543 ,  B60W10/02 ,  B60W10/08 ,  B60W10/10 ,  B60W10/107 ,  B60W20/00 ,  B60W30/18127 ,  B60W2510/0208 ,  B60W2520/10 ,  F16H61/66259 ,  Y02T10/6221 ,  Y02T10/7258 ,  Y10T477/26 ,  Y10T477/6203

    摘要： A shift controller controls a transmission for a hybrid vehicle in which: an engine and a motor are connected together via a clutch; and the transmission is placed between the motor and driving wheels. The shift controller has: a first shift controlling unit which performs shift control on a basis of at least one of transmission efficiency of the transmission and power generation efficiency of the motor in a case where regeneration is performed with the clutch disengaged during deceleration of the hybrid vehicle; and a second shift controlling unit which performs shift control to make a transmission gear ratio of the transmission smaller than in the shift control performed by the first shift controlling unit in a case where the regeneration is performed with the clutch engaged during the deceleration of the hybrid vehicle.

    摘要翻译： 变速控制器控制混合动力车辆的变速器，其中：发动机和电动机通过离合器连接在一起; 并且变速器被放置在电动机和驱动轮之间。 变速控制器具有：第一变速控制单元，其基于变速器的传动效率和电动机的发电效率中的至少一个进行换档控制，在进行再生时，离合器在混合动力减速期间分离 车辆; 以及第二变速控制单元，其执行变速控制，以使得变速箱的变速比小于在第一变速控制单元执行的变速控制中的变速比，其中在混合动力减速期间离合器接合时进行再生的情况下 车辆。

    Electronic component mounting apparatus and electronic component mounting method
    9.
    发明授权
    Electronic component mounting apparatus and electronic component mounting method 失效
    电子元件安装装置和电子元件安装方法

    公开(公告)号：US08152049B2

    公开(公告)日：2012-04-10

    申请号：US12439282

    申请日：2007-08-23

    申请人： Takeshi Morita ,  Masanori Hiyoshi

    发明人： Takeshi Morita ,  Masanori Hiyoshi

    IPC分类号： B23K35/12 ,  B23K1/00

    CPC分类号： H05K3/3484 ,  H05K2201/035 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2203/0139 ,  H05K2203/0338

    摘要： The present invention aims at providing an electronic component mounting apparatus and an electronic component mounting method that perform automated setting of a thickness of a paste film.The electronic component mounting apparatus of the present invention has a paste transfer unit 10 that horizontally, relatively moves a squeegee 11b and a transfer surface 13 with respect to each other, thereby spreading, over the transfer surface 13, a paste film 3 whose thickness is equivalent to the height of a squeegee gap “c” formed from clearance between the squeegee 11b and the transfer surface 13; a storage unit 18 that stores a database defining correlation among bump heights, paste types, and squeegee-gap heights; a computing unit 20 that derives, from the database, a squeegee-gap height G21 in correspondence with a height H1 of a bump of an electronic component to be mounted and a type P2 of paste to be transferred; and a vertical movement mechanism 16b that adjusts the height of the squeegee gap “c” formed from clearance between the squeegee 11b and the transfer surface 13 to a derived squeegee-gap height.

    摘要翻译： 本发明的目的在于提供一种执行膏膜厚度的自动设定的电子部件安装装置和电子部件安装方法。 本发明的电子部件安装装置具有：水平方向相对于彼此移动刮板11b和转印面13的浆料转印单元10，从而在转印面13上铺展厚度为 相当于由刮板11b和转印面13之间的间隙形成的刮板间隙“c”的高度; 存储单元18，其存储限定凸起高度，糊剂类型和刮刀间隙高度之间的相关性的数据库; 计算单元20从数据库导出与要安装的电子部件的凸起的高度H1相对应的刮板间隙高度G21和待传送的浆料的类型P2; 以及垂直移动机构16b，其将由刮板11b和转印面13之间的间隙形成的刮板间隙“c”的高度调节到衍生的刮刀间隙高度。

    Method of making a semiconductor device manufacturing mask substrate
    10.
    发明授权
    Method of making a semiconductor device manufacturing mask substrate 有权
    制造半导体器件制造掩模基板的方法

    公开(公告)号：US07157192B2

    公开(公告)日：2007-01-02

    申请号：US11101396

    申请日：2005-04-08

    申请人： Takeshi Morita

    发明人： Takeshi Morita

    IPC分类号： G03F1/00 ,  G03C5/00

    CPC分类号： G03F1/36

    摘要： A method of making a semiconductor device manufacturing mask, which makes it possible to suppress a semiconductor-device global step and simply manufacture a highly reliable semiconductor device. Square dummy patterns each having one side of, for example, 0.25 μm or less are inserted into an area other than an actual pattern lying within a semiconductor device manufacturing mask to thereby uniformize a pattern density, enable etching processing without changing conditions set for every semiconductor device manufacturing mask an prevent an increase in global step of a post-CMP interlayer insulating film.

    摘要翻译： 制造半导体器件制造掩模的方法，其可以抑制半导体器件全局步骤并简单地制造高可靠性的半导体器件。 将各自具有例如0.25μm或更小的一侧的平面虚拟图案插入到位于半导体器件制造掩模内的实际图案之外的区域中，从而使图案密度均匀化，使得能够进行蚀刻处理而不改变为每个半导体设置的条件 器件制造掩模，防止后CMP层间绝缘膜的全局步长增加。