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1.发明授权Electronic component mounting apparatus and electronic component mounting method 失效电子元件安装装置和电子元件安装方法公开(公告)号：US08152049B2
公开(公告)日：2012-04-10
申请号：US12439282
申请日：2007-08-23
申请人： Takeshi Morita , Masanori Hiyoshi
发明人： Takeshi Morita , Masanori Hiyoshi
CPC分类号： H05K3/3484 , H05K2201/035 , H05K2201/10674 , H05K2201/10734 , H05K2203/0139 , H05K2203/0338
摘要： The present invention aims at providing an electronic component mounting apparatus and an electronic component mounting method that perform automated setting of a thickness of a paste film.The electronic component mounting apparatus of the present invention has a paste transfer unit 10 that horizontally, relatively moves a squeegee 11b and a transfer surface 13 with respect to each other, thereby spreading, over the transfer surface 13, a paste film 3 whose thickness is equivalent to the height of a squeegee gap “c” formed from clearance between the squeegee 11b and the transfer surface 13; a storage unit 18 that stores a database defining correlation among bump heights, paste types, and squeegee-gap heights; a computing unit 20 that derives, from the database, a squeegee-gap height G21 in correspondence with a height H1 of a bump of an electronic component to be mounted and a type P2 of paste to be transferred; and a vertical movement mechanism 16b that adjusts the height of the squeegee gap “c” formed from clearance between the squeegee 11b and the transfer surface 13 to a derived squeegee-gap height.
摘要翻译： 本发明的目的在于提供一种执行膏膜厚度的自动设定的电子部件安装装置和电子部件安装方法。 本发明的电子部件安装装置具有：水平方向相对于彼此移动刮板11b和转印面13的浆料转印单元10，从而在转印面13上铺展厚度为 相当于由刮板11b和转印面13之间的间隙形成的刮板间隙“c”的高度; 存储单元18，其存储限定凸起高度，糊剂类型和刮刀间隙高度之间的相关性的数据库; 计算单元20从数据库导出与要安装的电子部件的凸起的高度H1相对应的刮板间隙高度G21和待传送的浆料的类型P2; 以及垂直移动机构16b，其将由刮板11b和转印面13之间的间隙形成的刮板间隙“c”的高度调节到衍生的刮刀间隙高度。
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2.发明申请ELECTRONIC COMPONENT MOUNTING APPARATUS AND ELECTRONIC COMPONENT MOUNTING METHOD 失效电子元件安装设备和电子元件安装方法公开(公告)号：US20090321499A1
公开(公告)日：2009-12-31
申请号：US12439282
申请日：2007-08-23
申请人： Takeshi Morita , Masanori Hiyoshi
发明人： Takeshi Morita , Masanori Hiyoshi
CPC分类号： H05K3/3484 , H05K2201/035 , H05K2201/10674 , H05K2201/10734 , H05K2203/0139 , H05K2203/0338
摘要： The present invention aims at providing an electronic component mounting apparatus and an electronic component mounting method that perform automated setting of a thickness of a paste film.The electronic component mounting apparatus of the present invention has a paste transfer unit 10 that horizontally, relatively moves a squeegee 11b and a transfer surface 13 with respect to each other, thereby spreading, over the transfer surface 13, a paste film 3 whose thickness is equivalent to the height of a squeegee gap “c” formed from clearance between the squeegee 11b and the transfer surface 13; a storage unit 18 that stores a database defining correlation among bump heights, paste types, and squeegee-gap heights; a computing unit 20 that derives, from the database, a squeegee-gap height G21 in correspondence with a height H1 of a bump of an electronic component to be mounted and a type P2 of paste to be transferred; and a vertical movement mechanism 16b that adjusts the height of the squeegee gap “c” formed from clearance between the squeegee 11b and the transfer surface 13 to a derived squeegee-gap height.
摘要翻译： 本发明的目的在于提供一种执行膏膜厚度的自动设定的电子部件安装装置和电子部件安装方法。 本发明的电子部件安装装置具有：水平方向相对于彼此移动刮板11b和转印面13的浆料转印单元10，从而在转印面13上铺展厚度为 相当于由刮板11b和转印面13之间的间隙形成的刮板间隙“c”的高度; 存储单元18，其存储限定凸起高度，糊剂类型和刮刀间隙高度之间的相关性的数据库; 计算单元20从数据库导出与要安装的电子部件的凸起的高度H1相对应的刮板间隙高度G21和待传送的浆料的类型P2; 以及垂直移动机构16b，其将由刮板11b和转印面13之间的间隙形成的刮板间隙“c”的高度调节到衍生的刮刀间隙高度。
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3.发明授权公开(公告)号：US07870991B2
公开(公告)日：2011-01-18
申请号：US12377903
申请日：2007-09-06
CPC分类号： H05K3/3484 , H01L2224/81 , H05K3/1216 , H05K3/3436 , H05K2201/035 , H05K2201/10734 , H05K2203/0338 , H05K2203/163 , Y02P70/613
摘要： In a mounting system having a height measuring instrument for measuring the height of solder paste printed on the electrodes and an electronic component placing apparatus, whether the height of solder paste is right or wrong is determined based on the measurement result of measuring the height of solder paste printed on the electrode. Further, whether or not the transfer of solder paste to the solder bump is required based on the determination result, and if it is determined that the transfer is required, the paste is transferred to an electronic component held in a mounting head. Thereby, the mounting quality can be assured by adding adequately an amount of solder in treating the board causing a shortage of the solder amount due to printing failure.
摘要翻译： 在具有用于测量印刷在电极上的焊膏的高度的高度测量装置和电子部件放置装置的安装系统中，基于测量焊料的高度的测量结果来确定焊膏的高度是正确还是错误 糊状印在电极上。 此外，基于判定结果，是否需要焊锡膏向焊料凸块的转印，如果确定需要转印，则将糊剂转印到保持在安装头中的电子部件。 由此，可以通过在处理基板上充分地添加一定量的焊料而导致由于印刷失败引起的焊料量的不足而确保安装质量。
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公开(公告)号：US07712652B2
公开(公告)日：2010-05-11
申请号：US11743812
申请日：2007-05-03
申请人： Takeshi Morita , Masanori Hiyoshi
发明人： Takeshi Morita , Masanori Hiyoshi
CPC分类号： H05K3/3489 , H01L24/13 , H01L24/743 , H01L24/75 , H01L24/81 , H01L24/95 , H01L25/0657 , H01L25/50 , H01L2224/11822 , H01L2224/13099 , H01L2224/131 , H01L2224/16145 , H01L2224/16225 , H01L2224/81011 , H01L2224/81024 , H01L2225/06513 , H01L2225/06517 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01068 , H01L2924/01075 , H01L2924/014 , H05K3/3484 , H05K13/0465 , H05K2201/035 , H05K2201/10734 , H05K2203/0338 , Y10T29/4913 , Y10T29/53178 , Y10T29/53183
摘要： First components and second components in which bumps are formed on the lower surface thereof and laminate structures are formed by mounting them to stack with each other on a circuit board 13 are picked up from a component supply unit 1 using a placement head 16, and by lifting and lowering the placement head 16 holding the first components and the second components relative to a paste transfer device 5 supplying a flux 10 in the manner such as coating films having two types of different thicknesses, the flux 10 is supplied to the bumps of the plurality of components in a bundle using a transfer coating method. With such a configuration, it is possible to efficiently perform a component mounting with a satisfactory adhesiveness by ensuring an optimal amount of application quantity of a paste.
摘要翻译： 在其下表面上形成凸块的第一部件和第二部件以及通过在电路板13上将它们彼此堆叠而形成的层叠结构通过使用放置头16从部件供应单元1拾取，并且通过 提升和降低保持第一部件和第二部件的放置头16相对于以诸如具有两种类型的不同厚度的涂膜的方式供给焊剂10的糊剂传递装置5，将焊剂10供应到 使用转印涂布方法的多个组分。 通过这样的结构，可以通过确保最佳施用量的浆料来有效地进行具有令人满意的粘合性的部件安装。
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5.发明申请公开(公告)号：US20100230472A1
公开(公告)日：2010-09-16
申请号：US12377903
申请日：2007-09-06
CPC分类号： H05K3/3484 , H01L2224/81 , H05K3/1216 , H05K3/3436 , H05K2201/035 , H05K2201/10734 , H05K2203/0338 , H05K2203/163 , Y02P70/613
摘要： In a mounting system having a height measuring instrument for measuring the height of solder paste printed on the electrodes and an electronic component placing apparatus, whether the height of solder paste is right or wrong is determined based on the measurement result of measuring the height of solder paste printed on the electrode. Further, whether or not the transfer of solder paste to the solder bump is required based on the determination result, and if it is determined that the transfer is required, the paste is transferred to an electronic component held in a mounting head. Thereby, the mounting quality can be assured by adding adequately an amount of solder in treating the board causing a shortage of the solder amount due to printing failure.
摘要翻译： 在具有用于测量印刷在电极上的焊膏的高度的高度测量装置和电子部件放置装置的安装系统中，基于测量焊料的高度的测量结果来确定焊膏的高度是正确还是错误 糊状印在电极上。 此外，基于判定结果，是否需要焊锡膏向焊料凸块的转印，如果确定需要转印，则将糊剂转印到保持在安装头中的电子部件。 由此，可以通过在处理基板上充分地添加一定量的焊料而导致由于印刷失败引起的焊料量的不足而确保安装质量。
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6.发明授权Electronic component placing apparatus and electronic component mounting method 有权电子元件放置装置和电子元件安装方法公开(公告)号：US07793817B2
公开(公告)日：2010-09-14
申请号：US12438099
申请日：2007-09-06
CPC分类号： H05K3/3484 , B23K3/0623 , B23K2101/40 , H01L2224/81 , H05K3/3436 , H05K2201/035 , H05K2201/094 , H05K2203/0139 , H05K2203/0338 , Y02P70/613
摘要： To provide an electronic component placing apparatus and an electronic component mounting method that can prevent a cold joint from occurring when an electronic component likely to cause warp deformation is mounted by means of soldering. In the electronic component placing apparatus for placing the electronic component 16 with a plurality of solder bumps 16a formed on a lower surface on a board, a film 7a having a film thickness distribution for transferring a desired transfer amount of solder paste according to a state of warp deformation to each of the plurality of solder bumps is formed in a paste transfer unit 24, based on the component warp information indicating the state of warp deformation in a reflow process of the electronic component. Thereby, it is possible to prevent a cold joint from occurring when the electronic component likely to cause warp deformation is mounted by means of soldering by additionally supplying a just enough amount of solder to each solder bump 16a.
摘要翻译： 提供一种电子部件放置装置和电子部件安装方法，其可以通过焊接来安装可能导致翘曲变形的电子部件时发生冷接头。 在电子部件放置装置中，电子部件16配置有形成在基板的下表面上的多个焊料凸块16a，具有膜厚分布的膜7a，其根据状态 基于表示电子部件的回流工序中的翘曲变形的状态的部件翘曲信息，在糊状物转印部24中形成多个焊料凸块各自的翘曲变形。 由此，当通过向每个焊料凸块16a额外提供足够量的焊料，通过焊接来安装可能引起翘曲变形的电子部件时，可以防止发生冷接头。
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7.发明申请ELECTRONIC COMPONENT PLACING APPARATUS AND ELECTRONIC COMPONENT MOUNTING METHOD 有权电子元件放置装置和电子元件安装方法公开(公告)号：US20100163602A1
公开(公告)日：2010-07-01
申请号：US12438099
申请日：2007-09-06
CPC分类号： H05K3/3484 , B23K3/0623 , B23K2101/40 , H01L2224/81 , H05K3/3436 , H05K2201/035 , H05K2201/094 , H05K2203/0139 , H05K2203/0338 , Y02P70/613
摘要： To provide an electronic component placing apparatus and an electronic component mounting method that can prevent a cold joint from occurring when an electronic component likely to cause warp deformation is mounted by means of soldering.In the electronic component placing apparatus for placing the electronic component 16 with a plurality of solder bumps 16a formed on a lower surface on a board, a film 7a having a film thickness distribution for transferring a desired transfer amount of solder paste according to a state of warp deformation to each of the plurality of solder bumps is formed in a paste transfer unit 24, based on the component warp information indicating the state of warp deformation in a reflow process of the electronic component. Thereby, it is possible to prevent a cold joint from occurring when the electronic component likely to cause warp deformation is mounted by means of soldering by additionally supplying a just enough amount of solder to each solder bump 16a.
摘要翻译： 提供一种电子部件放置装置和电子部件安装方法，其可以通过焊接来安装可能导致翘曲变形的电子部件时发生冷接头。 在电子部件放置装置中，电子部件16配置有形成在基板的下表面上的多个焊料凸块16a，具有膜厚分布的膜7a，其根据状态 基于表示电子部件的回流工序中的翘曲变形的状态的部件翘曲信息，在糊状物转印部24中形成多个焊料凸块各自的翘曲变形。 由此，当通过向每个焊料凸块16a额外提供足够量的焊料，通过焊接来安装可能引起翘曲变形的电子部件时，可以防止发生冷接头。
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公开(公告)号：US08512202B2
公开(公告)日：2013-08-20
申请号：US13168235
申请日：2011-06-24
申请人： Yoshikazu Oota , Ryozo Hiraku , Takeshi Morita , Akira Takano
发明人： Yoshikazu Oota , Ryozo Hiraku , Takeshi Morita , Akira Takano
IPC分类号： B60W20/00
CPC分类号： B60W20/30 , B60K6/48 , B60K6/543 , B60W10/02 , B60W10/08 , B60W10/10 , B60W10/107 , B60W20/00 , B60W30/18127 , B60W2510/0208 , B60W2520/10 , F16H61/66259 , Y02T10/6221 , Y02T10/7258 , Y10T477/26 , Y10T477/6203
摘要： A shift controller controls a transmission for a hybrid vehicle in which: an engine and a motor are connected together via a clutch; and the transmission is placed between the motor and driving wheels. The shift controller has: a first shift controlling unit which performs shift control on a basis of at least one of transmission efficiency of the transmission and power generation efficiency of the motor in a case where regeneration is performed with the clutch disengaged during deceleration of the hybrid vehicle; and a second shift controlling unit which performs shift control to make a transmission gear ratio of the transmission smaller than in the shift control performed by the first shift controlling unit in a case where the regeneration is performed with the clutch engaged during the deceleration of the hybrid vehicle.
摘要翻译： 变速控制器控制混合动力车辆的变速器，其中：发动机和电动机通过离合器连接在一起; 并且变速器被放置在电动机和驱动轮之间。 变速控制器具有：第一变速控制单元，其基于变速器的传动效率和电动机的发电效率中的至少一个进行换档控制，在进行再生时，离合器在混合动力减速期间分离 车辆; 以及第二变速控制单元，其执行变速控制，以使得变速箱的变速比小于在第一变速控制单元执行的变速控制中的变速比，其中在混合动力减速期间离合器接合时进行再生的情况下 车辆。
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公开(公告)号：US20090147826A1
公开(公告)日：2009-06-11
申请号：US12326175
申请日：2008-12-02
申请人： Tatsuya Suzuki , Go Hanzawa , Takeshi Morita
发明人： Tatsuya Suzuki , Go Hanzawa , Takeshi Morita
IPC分类号： G01K1/00
CPC分类号： G01K1/08 , G01K13/02 , G01K2013/024 , G01K2205/04
摘要： A temperature sensor includes: a temperature-sensing element comprising a temperature-sensing portion and an element electrode wire connected to the temperature-sensing portion; a sheath member comprising a sheath tube and a sheath core wire extending from the sheath tube, the sheath core wire being joined to the element electrode wire to form a joint portion; an enclosing member comprising a closed-bottomed tube having a bottom portion at one end, and enclosing at least the temperature-sensing element and the joint portion; and a holding material filling at least a portion of a space enclosed by the enclosing member extending between a front end face of the temperature-sensing portion and the bottom portion of the enclosing member. The element electrode wire includes a bend at an intermediate portion of the element electrode wire between the temperature-sensing portion and the joint portion.
摘要翻译： 温度传感器包括：温度感测元件，包括温度感测部分和连接到温度感测部分的元件电极线; 护套构件，其包括护套管和从所述护套管延伸的鞘芯线，所述护芯线与所述元件电极线接合以形成接合部; 封闭构件，其包括在一端具有底部的封闭底管，并且至少包围所述温度感测元件和所述接合部分; 以及保持材料，其填充由所述封闭构件包围的空间的至少一部分，所述封闭构件在所述温度检测部的前端面与所述封闭构件的底部之间延伸。 元件电极线包括在温度感测部分和接头部分之间的元件电极线的中间部分处的弯曲部。
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公开(公告)号：US07157192B2
公开(公告)日：2007-01-02
申请号：US11101396
申请日：2005-04-08
申请人： Takeshi Morita
发明人： Takeshi Morita
CPC分类号： G03F1/36
摘要： A method of making a semiconductor device manufacturing mask, which makes it possible to suppress a semiconductor-device global step and simply manufacture a highly reliable semiconductor device. Square dummy patterns each having one side of, for example, 0.25 μm or less are inserted into an area other than an actual pattern lying within a semiconductor device manufacturing mask to thereby uniformize a pattern density, enable etching processing without changing conditions set for every semiconductor device manufacturing mask an prevent an increase in global step of a post-CMP interlayer insulating film.
摘要翻译： 制造半导体器件制造掩模的方法，其可以抑制半导体器件全局步骤并简单地制造高可靠性的半导体器件。 将各自具有例如0.25μm或更小的一侧的平面虚拟图案插入到位于半导体器件制造掩模内的实际图案之外的区域中，从而使图案密度均匀化，使得能够进行蚀刻处理而不改变为每个半导体设置的条件 器件制造掩模，防止后CMP层间绝缘膜的全局步长增加。
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