公开(公告)号：US07294827B2

公开(公告)日：2007-11-13

申请号：US10711476

申请日：2004-09-21

申请人： Teck Tiong Tan ,  Binghua Pan ,  Jeffrey H. Burns ,  John R. Troxell

发明人： Teck Tiong Tan ,  Binghua Pan ,  Jeffrey H. Burns ,  John R. Troxell

IPC分类号： H01J5/02 ,  H01L31/203 ,  H01L21/00

CPC分类号： H01L31/0203 ,  H01L27/14618 ,  H01L27/14625 ,  H01L31/02325 ,  H01L2924/0002 ,  H04N5/2253 ,  H04N5/2254 ,  H01L2924/00

摘要： An electronic module adapted to sense light and configured to minimize the entry of stray light into the module. The module includes a housing having an opening through which light enters the housing, a first substrate coupled to the housing, a second substrate on the first substrate opposite the housing, and a chip on the second substrate. The first substrate defines a window aligned with the housing so that light traveling through the housing also passes through window. The second substrate defines an opening aligned with the window, and the chip is located over the opening in the second substrate so that a light-sensing element on the chip senses light passing through the opening. The module is equipped with features that prevent light from entering the module through the second substrate, the first substrate, and between the chip and second substrate.

摘要翻译： 一种电子模块，适于感测光并被配置为使杂散光进入模块最小化。 模块包括具有开口的壳体，光通过该开口进入壳体，耦合到壳体的第一基板，与壳体相对的第一基板上的第二基板和第二基板上的芯片。 第一基板限定与壳体对准的窗口，使得穿过壳体的光也穿过窗口。 第二基板限定与窗口对准的开口，并且芯片位于第二基板中的开口上方，使得芯片上的感光元件感测穿过开口的光。 该模块配备有防止光通过第二基板，第一基板以及芯片与第二基板之间进入模块的特征。

公开(公告)号：US20070284420A1

公开(公告)日：2007-12-13

申请号：US11423725

申请日：2006-06-13

申请人： Teck Tiong Tan ,  Hwee Seng Jimmy Chew

发明人： Teck Tiong Tan ,  Hwee Seng Jimmy Chew

IPC分类号： B23K31/02

CPC分类号： B23K1/0016 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/13023 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/3436 ,  H05K2201/0367 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/29099

摘要： A method for coupling a semiconductor substrate to a receiving substrate is disclosed. The method comprising the step of providing a receiving substrate having at least one receiving pad formed thereon, the at least one receiving pad having a face and a portion substantially extending from the periphery of the face to the receiving substrate. The method also involves the step of providing a semiconductor substrate having at least one bonding pad formed thereon and at least one pillar extending from the at least one bonding pad towards the at least one receiving pad, the at least one pillar having a reflowable and a non-reflowable portion. The method further involves the step of positioning the semiconductor substrate over the receiving substrate for facing the at least one receiving pad towards the at least one pillar, and reflowing the reflowable portion substantially over the face and substantially onto the portion.

摘要翻译： 公开了一种将半导体衬底耦合到接收衬底的方法。 该方法包括提供具有形成在其上的至少一个接收垫的接收衬底的步骤，所述至少一个接收衬垫具有面和基本上从面的周边延伸到接收衬底的部分。 该方法还包括提供具有形成在其上的至少一个焊盘和至少一个从至少一个焊盘朝向至少一个接收焊盘的支柱的半导体衬底的步骤，该至少一个支柱具有可回流和 不可回流部分。 该方法还包括将半导体衬底定位在接收衬底上用于面向至少一个接收衬垫朝向至少一个支柱的步骤，并且将可回流部分基本上回流到面部上并且基本上在该部分上。