公开(公告)号：US5352745A

公开(公告)日：1994-10-04

申请号：US145655

申请日：1993-11-03

申请人： Teruo Katayose ,  Yoshiyuki Ishii ,  Hiroji Oda

发明人： Teruo Katayose ,  Yoshiyuki Ishii ,  Hiroji Oda

IPC分类号： C08F290/14 ,  C08L61/00 ,  C08L63/00 ,  C08L71/12 ,  H05K1/03 ,  C08F283/08

CPC分类号： C08F290/142 ,  C08L71/126 ,  C08L61/00 ,  C08L63/00 ,  H05K1/0326 ,  Y10S525/905 ,  Y10T428/31692

摘要： A novel curable polyphenylene ether resin composition caontains (a) a curable polyphenylene ether resin containing at least a reaction product of a polyphenylene ether with an unsaturated carboxylic acid or an acid anhydride, (b) at least one cyanurate selected from the group consisting of triallyl isocyanurate and triallyl cyanurate, optionally (c) a resin composition comprising an epoxy resin and a curing agent and/or (d) a compound having at least one unsaturated double bond and at least one epoxy group and/or (e) a reinforcement material. The resin composition has excellent film-forming properties, resin flowability in pressing and storage stability. A cured polyphenylene ether resin composition obtained by curing the curable polyphenylene ether resin composition has excellent chemical resistance, heat resistance, dielectric properties and dimensional stability.

摘要翻译： 新型可固化聚苯醚树脂组合物包含（a）至少含有聚苯醚与不饱和羧酸或酸酐的反应产物的可固化聚苯醚树脂，（b）至少一种氰尿酸酯，其选自三烯丙基 异氰脲酸酯和三烯丙基氰脲酸酯，任选地（c）包含环氧树脂和固化剂的树脂组合物和/或（d）具有至少一个不饱和双键和至少一个环氧基的化合物和/或（e）增强材料 。 该树脂组合物具有优异的成膜性，耐压性和贮存稳定性的树脂流动性。 通过使可固化聚苯醚树脂组合物固化得到的固化聚苯醚树脂组合物具有优异的耐化学性，耐热性，介电性和尺寸稳定性。

公开(公告)号：US5218030A

公开(公告)日：1993-06-08

申请号：US476916

申请日：1990-02-07

申请人： Teruo Katayose ,  Hiroji Oda ,  Haruhisa Sasaki

发明人： Teruo Katayose ,  Hiroji Oda ,  Haruhisa Sasaki

IPC分类号： C08F283/08 ,  C08F290/14 ,  C08K5/3477

CPC分类号： C08F283/08 ,  C08F290/142 ,  C08K5/3477 ,  Y10S525/905 ,  Y10T428/31547

摘要： A novel curable polyphenylene ether resin composition is disclosed, which comprises (a) a curable polyphenylene ether resin having at least one group selected from the group consisting of an allyl group and a propargyl group and (b) at least one cyanurate. The resin composition has excellent storage stability, film-forming properties and melt moldability. If desired, a fire retardant, optionally together with an antimony-containing auxiliary fire retardant, and/or a reinforcement is incorporated into the resin composition in order to improve the fire retardance and mechanical properties of the resin composition, respectively. By curing the resin composition, a cured polyphenylene ether resin composition comprising a chloroform nonextractable polyphenylene ether resin component and a chloroform extractable, polyphenylene ether-containing component is obtained, which has excellent chemical resistance, electrical properties, dimensional stability and heat resistance. A laminate or composite structure comprising the cured polyphenylene ether resin composition and a metallic foil and/or a metallic substrate provides advantageous mechanical and electronic components.

公开(公告)号：US4923932A

公开(公告)日：1990-05-08

申请号：US242234

申请日：1988-09-09

申请人： Teruo Katayose ,  Hiroji Oda

发明人： Teruo Katayose ,  Hiroji Oda

IPC分类号： C08F283/08 ,  C08G65/48 ,  C08L71/12

CPC分类号： C08G65/485 ,  C08F283/08 ,  C08G65/44 ,  C08L71/126 ,  C08L71/12

摘要： A novel cured polyphenylene ether resin is disclosed comprising a chloroform nonextractable polyphenylene ether and a chloroform extractable polyphenylene ether. By subjecting the resin to pyrolysis gas chromatography, the resin is decomposed to form 3,5-dimethylphenol specifically. The chloroform extractable polyphenylene ether is contained in the resin in an amount of 0.01 to 20% by weight and comprises polyphenylene ether units substituted by an alkenyl group and/or an alkynyl group. The novel cured polyphenylene ether resin has excellent mechanical properties, electrical properties, heat resistance and chemical resistance. The cured polyphexylene ether resin is prepared by curing a novel curable polyphenylene ether resin comprising polyphenylene ether units substituted with an alkenyl groups and/or an alkynyl groups at a specific average substitution degree. The novel curable polyphenylene ether resin has not only excellent mechanical properties and desired electric properties such as a low dielectric constant and a low dielectric dissipation factor, but also excellent melt processability and storage properties.

公开(公告)号：US06254971B1

公开(公告)日：2001-07-03

申请号：US09202078

申请日：1999-04-23

申请人： Teruo Katayose ,  Shozo Kinoshita ,  Takeshi Arai

发明人： Teruo Katayose ,  Shozo Kinoshita ,  Takeshi Arai

IPC分类号： B32B300

CPC分类号： H05K3/4655 ,  H01L23/142 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K1/024 ,  H05K1/0326 ,  H05K3/4652 ,  H05K3/4676 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2201/0358 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/249999 ,  Y10T428/25 ,  Y10T428/31529 ,  H01L2924/00

摘要： The invention provides resin-having metal foil for a multilayered wiring board which comprises metal foil having provided on one side thereof a film of a thermosetting resin having a relative dielectric constant of not higher than 3.3 at a frequency range of not lower than 1 MHz and having a resin flow of from 1 to 50% or from 5 to 50%, and a process for producing the same. The invention also provides a (sequentially) multilayered wiring board produced by using the resin-having metal foil and an electronic device comprising the multilayered wiring board and an electronic element connected thereto with a wiring means.

摘要翻译： 本发明提供了一种用于多层布线板的树脂用金属箔，该金属箔包括金属箔，该金属箔的一面在不低于1MHz的频率范围内设置相对介电常数不高于3.3的热固性树脂的膜，以及 树脂流动率为1〜50％或5〜50％，及其制造方法。 本发明还提供了一种通过使用具有树脂的金属箔制造的（顺序）多层布线板和包括多层布线板的电子器件和与布线装置连接的电子元件。